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Semiconductor package with heat sink

  • US 7,166,914 B2
  • Filed: 06/25/2004
  • Issued: 01/23/2007
  • Est. Priority Date: 07/07/1994
  • Status: Expired due to Fees
First Claim
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1. A packaged semiconductor chip comprising:

  • (a) a first semiconductor chip having a front face, a rear face, edges bonding said faces and contacts exposed at said front surface;

    (b) a chip carrier having inner and outer surfaces, the inner surface of said chip carrier facing in an upward direction toward said chip, the outer surface of said chip carrier facing in a downward direction away from said chip, said chip carrier having a plurality of terminals exposed at said outer surface, at least some of said terminals being electrically connected to at least some of said contacts of said chip; and

    (c) a heat sink disposed beneath said chip in thermal communication with a face of said chip, said heat sink being exposed at said outer surface of said chip carrier.

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