Semi-solid metal injection methods for electronic assembly thermal interface
First Claim
1. A method comprising:
- positioning a die adjacent to a plate;
flowing a thermally conductive thixotropic metal material between the die and the plate; and
applying vacuum to the thermally conductive material.
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Abstract
To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of a die to an integrated heat spreader (IHS) through a high capacity thermal interface formed of metal that has been injected in a semi-solid state. In one embodiment, vacuum and a shear-controlled viscosity enable semi-solid metallic material to fill a narrow chamber between the die surface and a specially shaped mold plate that doubles as an IHS, without inducing voids in the solidified metal. In another embodiment, an injection machine is disclosed. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
41 Citations
25 Claims
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1. A method comprising:
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positioning a die adjacent to a plate; flowing a thermally conductive thixotropic metal material between the die and the plate; and applying vacuum to the thermally conductive material. - View Dependent Claims (2, 3, 4)
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5. A method comprising:
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positioning a die adjacent to a plate; flowing a thermally conductive thixotropic metal alloy material between the die and the plate; and applying vacuum to the thermally conductive material. - View Dependent Claims (6, 7, 8)
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9. A method comprising:
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positioning a die adjacent to a plate, the die having a front surface comprising a plurality of terminals, and the die further having a back surface, which is adjacent to the plate; and flowing a thermally conductive thixotropic metal alloy material between the die and the plate; wherein the plate comprises an inlet, an outlet, an inlet ramp, and an outlet ramp, and wherein the inlet ramp extends from the inlet to the die, and wherein the outlet ramp extends from the die to the outlet. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16)
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17. A method comprising:
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positioning a die adjacent to a plate; flowing a thermally conductive material from one of a liquid metallic material and a semi-solid metallic material between the die and the plate; and applying vacuum to the thermally conductive material. - View Dependent Claims (18, 19)
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20. A method comprising:
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positioning a die adjacent to a plate; flowing a thermally conductive material from one of a liquid metallic alloy material and a semi-solid metallic alloy material between the die and the plate; and applying vacuum to the thermally conductive material. - View Dependent Claims (21, 22)
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23. A method comprising:
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positioning a die adjacent to a plate, the die having a front surface comprising a plurality of terminals, and the die further having a back surface, which is adjacent to the plate; and flowing a thermally conductive material from one of a liquid metallic alloy material and a semi-solid metallic alloy material between the die and the plate; wherein the plate comprises an inlet, an outlet, an inlet ramp, and an outlet ramp, wherein the inlet ramp extends from the inlet to the die, and wherein the outlet ramp extends from the die to the outlet. - View Dependent Claims (24, 25)
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Specification