Method of making thin silicon sheets for solar cells
First Claim
1. A process for producing a layer of single-crystal silicon, said process comprising the steps of forming parallel, first trenches in a silicon substrate of substantially (111) orientation;
- applying an etch-resistant layer to the surface of said first trenches;
forming a series of narrower second trenches inside said first trenches;
contacting said second trenches with an etchant to which {111} planes of silicon are substantially resistant, and etching lateral channels from said second trenches until adjacent and opposing etch fronts at least substantially meet, thereby defining said layer of single-crystal silicon; and
detaching said layer from said substrate.
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Accused Products
Abstract
A thin layer of single-crystal silicon is produced by forming first trenches in a silicon substrate having (111) orientation; forming narrower second trenches at the bases of the trenches; anisotropically etching lateral channels (4) from the second trenches, until adjacent etch fronts (16) substantially meet; and detaching said layer from the substrate. The trenches may be arranged so that the resultant layer has rows of slots, whit the slots in adjacent rows being mutually offset. Solar cells may be formed on strips (5) between the trenches, having lengths of more than 50 mm, widths of up to 5 mm, and thicknesses of less than 100 microns, and having two electrical contacts on the same face (6) of each strip (5).
111 Citations
9 Claims
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1. A process for producing a layer of single-crystal silicon, said process comprising the steps of forming parallel, first trenches in a silicon substrate of substantially (111) orientation;
- applying an etch-resistant layer to the surface of said first trenches;
forming a series of narrower second trenches inside said first trenches;
contacting said second trenches with an etchant to which {111} planes of silicon are substantially resistant, and etching lateral channels from said second trenches until adjacent and opposing etch fronts at least substantially meet, thereby defining said layer of single-crystal silicon; and
detaching said layer from said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
- applying an etch-resistant layer to the surface of said first trenches;
Specification