Selectively configurable probe structures, e.g., selectively configurable probe cards for testing microelectronic components

• US 7,170,304 B2
• Filed: 07/28/2005
• Issued: 01/30/2007
• Est. Priority Date: 08/26/2002
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Crump, Brett, Schaeffer, Ralph
• Primary Examiner(s): Nguyen; Vinh P.
• Application Number:
  US11/192,147
• Publication Number:
  US 20050258848A1
• Time in Patent Office: 551 Days
• Field of Search: 324754-765, 324/158.1, 324/73.1, 324/72.5, 439/482, 439/824, 738/625.1, 310/309, 310/321, 310/338
• US Class Current: 324/750.03
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07392 manipulating each probe element or tip individually
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Microelectronic components are commonly tested with probe cards. Certain aspects of probes, probe cards, and methods of testing microelectronic components are discussed herein. In one specific example, a probe card includes a base and a probe carried by the base. An actuator is associated with the probe and is adapted to selectively position the probe with respect to an electrical contact on the microelectronic component. A test power circuit is coupled to the first probe and adapted to deliver test power to the first probe. In one exemplary method, an actuator is actuated to move the probe from a first probe arrangement to a second probe arrangement.

Claims

1. A method of testing a microelectronic component with a selectively configurable probe card, comprising:

at a first temperature, contacting each of a plurality of contacts carried by the microelectronic component with one of a plurality of probes carried by the probe card, the probes being arranged in a first probe arrangement;

changing the temperature of the microelectronic component, thereby altering a relative arrangement of the contacts from a first contact arrangement to a different second contact arrangement;

actuating a plurality of actuators to rearrange the probes to a second probe arrangement wherein each of the probes is positioned to correspond to a position of one of the contacts in the second contact arrangement.

2. The method of claim 1 wherein the each of the actuators is associated with one of the probes, and wherein actuating the actuators includes moving tips of the associated probes with respect to a base of the probe card.

3. The method of claim 2 wherein each of the actuators includes a flexor coupled to the associated probe, and wherein actuating the actuators comprises changing the lengths of the flexors.

4. The method of claim 2 wherein each of the actuators includes a flexor coupled to the associated probe, and wherein actuating the actuators comprises heating the flexors.

5. The method if claim 1 wherein actuating a plurality of actuators includes actuating a plurality of actuators to rearrange the probes to a second probe arrangement where each of the probes is positioned to contact one of the contacts in the second contact arrangement.

6. The method if claim 1 wherein actuating a plurality of actuators includes actuating a plurality of actuators to rearrange the probes to a second probe arrangement where each of the probes is positioned to contact one of the contacts in the second contact arrangement, and wherein the method further includes delivering test power to the contacts via the probes when the probes are in the second probe arrangement.

7. The method of claim 1 further comprising delivering test power to the contacts via the probes when the probes are in the first probe arrangement.

8. The method of claim 1 wherein actuating a plurality of actuators includes actuating a plurality of actuators that include flexors comprised of a shape memory material.

9. The method of claim 1, wherein the method further comprises moving the probes to a third probe arrangement different from the first probe arrangement and the second probe arrangement, wherein in the third probe arrangement a tip of each probe is positioned away from the contacts.

10. The method of claim 1 wherein actuating a plurality of actuators includes actuating a plurality of actuators that include flexors that are adapted to change length in response to an applied voltage.

11. The method of claim 1 wherein actuating a plurality of actuators includes actuating a plurality of actuators that include flexors that are adapted to change length in response to a temperature change.

12. The method of claim 1 wherein the probes comprise cantilevered wire probes extending beyond an edge of a base of the probe card.