Optical inspection system and method for displaying imaged objects in greater than two dimensions

• US 7,171,037 B2
• Filed: 03/20/2003
• Issued: 01/30/2007
• Est. Priority Date: 03/20/2003
• Status: Expired due to Fees

• Current Assignee: Agilent Technologies, Inc.
• Original Assignee: Agilent Technologies, Inc.
• Inventors: Zhang, Xuemei, Baharav, Izhak, Rosner, S. Jeffrey, Mahon, James
• Primary Examiner(s): MARIAM, DANIEL G
• Application Number:
  US10/393,413
• Publication Number:
  US 20040184032A1
• Time in Patent Office: 1,412 Days
• Field of Search: 382/145, 382149-150, 382/154, 382/218, 382/309, 382/311, 345/419, 348/87, 356/237.4
• US Class Current: 382/145
• CPC Class Codes: G01N 21/8806 Specially adapted optical and illumination features
• CPC Class Codes: G01N 21/95684 Patterns showing highly reflecting parts, e.g. metallic elements
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates

Abstract

A display for use in a printed circuit board inspection system for inspecting objects on a printed circuit board is capable of displaying a greater-than-two dimensional image of the shape of the surface of an object resident on the printed circuit board in at least two dimensions. The image of the object is generated based on optical imaging of the object under different illumination configurations.

Claims

1. A printed circuit board inspection system for inspecting objects on a printed circuit board, comprising:

a display operable to display a greater-than two dimensional image of the shape of the surface of an object resident on the printed circuit board, the image being displayed in at least two dimensions and being generated based on optical imaging of the object under different illumination configurations; and

a processor operable to generate the greater-than two dimensional image and provide the greater-than two dimensional image to said display;

wherein said processor includes a pre-processor operable to estimate at least one object feature from the greater-than two dimensional image and perform a comparison of the object feature to specification data associated with the object.

2. The printed circuit board inspection system of claim 1, wherein said processor further comprises:

an image manipulation processor operable to receive the image and alter the displayed image.

3. The printed circuit board inspection system of claim 2, further comprising:

a computer readable medium having computer executable instructions therein for enhancing the image, said image manipulation processor being connected to said computer readable medium to retrieve the computer executable instructions, enhance the image according to the computer-executable instructions and provide the enhanced image to said display.

4. The printed circuit board inspection system of claim 2, further comprising:

a user interface operable to receive image manipulation input from a user and to provide to said image manipulation processor image manipulation instructions based on the image manipulation input, said image manipulation processor being operable to manipulate the image in response to the image manipulation instructions and to provide the manipulated image to said display.

5. The printed circuit board inspection system of claim 4, wherein the image manipulation instructions operate to alter the viewing angle of the image.

6. The printed circuit board inspection system of claim 1, further comprising:

a computer-readable medium having the specification data stored therein, said pre-processor being connected to said computer-readable medium to retrieve the specification data.

7. The printed circuit board inspection system of claim 1, wherein said processor further comprises:

an alert notification processor operable to transmit to a device associated with said display an alert notification indictor based on the results of the comparison.

8. The printed circuit board inspection system of claim 1, wherein said display is a three-dimensional display.

9. The printed circuit board inspection system of claim 1, wherein said display is a two-dimensional display.

10. A method for displaying a greater-than-two dimensional image of an object resident on a printed circuit board during an optical inspection process, comprising:

receiving an image of the shape of the surface of an object resident on the printed circuit board, the image being in greater than two dimensions and generated based on optical imaging of the object under different illumination configurations;

estimating at least one object feature of the image;

performing a comparison of the object feature to specification data associated with the object; and

displaying the image in at least two dimensions on a display.

11. The method of claim 10, wherein said displaying comprises:

storing computer-executable instructions for enhancing the image;

enhancing the image according to the computer-executable instructions; and

providing the enhanced image to the display.

12. The method of claim 10, further comprising:

receiving image manipulation instructions for altering the displayed image;

manipulating the image in response to the image manipulation instructions; and

providing the manipulated image to display.

13. The method of claim 12, wherein said manipulating comprises:

altering the viewing angle of the image.

14. The method of claim 13, wherein said altering comprises:

rotating the image displayed on a two-dimensional display to convey a three-dimensional representation of the shape of the surface of the object.

15. The method of claim 10, further comprising:

storing the specification data.

16. The method of claim 15, further comprising:

transmitting to a device associated with the display an alert notification indicator based on the results of the comparison; and

providing the image to said display upon transmission of the alert notification indictor.

17. The method of claim 10, wherein said displaying comprises:

displaying the image to a user for the inspection of the object.

18. A method for selectively displaying a greater than two-dimensional image of an object during an optical inspection process, comprising;

storing specification data associated with the object;

receiving an image of the shape of the surface of an object resident on the printed circuit board, the image being in greater than two dimensions and generated based on optical imaging of the object under different illumination configurations;

estimating at least one object feature from the image;

performing a comparison of the specification data and the object feature; and

based on the results of the comparison selectively displaying the object image in at least two dimensions on a display.

19. The method of claim 18, in which said displaying comprises:

based on the results of the comparison, transmitting an alert notification indictor to a device associated with the display; and

providing the image to said display upon transmission of the alert notification indicator.

20. A method for manipulating a greater-than-two dimensional image of an object during an optical process, comprising:

receiving an image of the shape of the surface of an object resident on the printed circuit board, the image being in greater than two dimensions and generated based on optical imaging of the object under different illumination configurations;

receiving instructions for altering the displayed image;

manipulating the image in response to the instructions; and

providing the manipulated image to an at least two-dimensional display.

21. The method of claim 20, wherein said receiving instructions comprises:

storing computer-executable instructions for enhancing the image;

enhancing the viewing angle of the image according to the computer-executable instructions; and

providing the enhanced image to the display.