×

Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process

  • US 7,171,334 B2
  • Filed: 06/01/2004
  • Issued: 01/30/2007
  • Est. Priority Date: 06/01/2004
  • Status: Active Grant
First Claim
Patent Images

1. A device comprising:

  • a substrate having a wafer-like shape capable of being disposed within integrated circuit processing equipment, the substrate comprising;

    an event sensor, to generate an output representative of an event related to the integrated circuit processing equipment, anda process parameter sensor to sense a process parameter of a process performed by the integrated circuit processing equipment, wherein the process parameter sensor senses the process parameter in response to a control signal; and

    a controller, coupled to the event sensor and coupled to the process parameter sensor, to receive the output from the event sensor and to detect at least one predetermined event based on the output, wherein the controller generates the control signal in response to detecting the at least one predetermined event and provides the control signal to the process parameter sensor.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×