Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process
First Claim
1. A device comprising:
- a substrate having a wafer-like shape capable of being disposed within integrated circuit processing equipment, the substrate comprising;
an event sensor, to generate an output representative of an event related to the integrated circuit processing equipment, anda process parameter sensor to sense a process parameter of a process performed by the integrated circuit processing equipment, wherein the process parameter sensor senses the process parameter in response to a control signal; and
a controller, coupled to the event sensor and coupled to the process parameter sensor, to receive the output from the event sensor and to detect at least one predetermined event based on the output, wherein the controller generates the control signal in response to detecting the at least one predetermined event and provides the control signal to the process parameter sensor.
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Abstract
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of, and system for autonomously monitoring fabrication equipment, for example, integrated circuit fabrication equipment. In one embodiment of this aspect of the invention, the present invention is an autonomous monitoring device including one or more event sensors (for example, acceleration, motion, velocity and/or inertial sensing device(s)) to detect a predetermined event of or by the fabrication equipment (for example, an event that is indicative of the onset, commencement, initiation and/or launch of fabrication process or sub-processes of or by the fabrication equipment). In response thereto, one or more process parameter sensors sample, sense, detect, characterize, analyze and/or inspect one or more parameters of the process in real time (i.e., during the fabrication process).
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Citations
26 Claims
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1. A device comprising:
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a substrate having a wafer-like shape capable of being disposed within integrated circuit processing equipment, the substrate comprising; an event sensor, to generate an output representative of an event related to the integrated circuit processing equipment, and a process parameter sensor to sense a process parameter of a process performed by the integrated circuit processing equipment, wherein the process parameter sensor senses the process parameter in response to a control signal; and a controller, coupled to the event sensor and coupled to the process parameter sensor, to receive the output from the event sensor and to detect at least one predetermined event based on the output, wherein the controller generates the control signal in response to detecting the at least one predetermined event and provides the control signal to the process parameter sensor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A device comprising:
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a substrate capable of being disposed on a wafer stage of integrated circuit processing equipment, the substrate comprising; a first event sensor to generate a first output representative of a first event related to the integrated circuit processing equipment, a second event sensor to generate a second output representative of a second event related to the integrated circuit processing equipment, wherein the first and second events are different types of events, and a process parameter sensor to sense a process parameter of a process performed by the integrated circuit processing equipment, wherein the process parameter sensor senses the process parameter in response to a control signal; and a controller, coupled to the first and second event sensors and coupled to the process parameter sensor, to receive the second output from the second event sensor and to detect at least one predetermined event based on the second output, wherein the controller generates the control signal in response to detecting the at least one predetermined event and provides the control signal to the process parameter sensor. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A device comprising:
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a substrate capable of being disposed on a wafer stage of integrated circuit processing equipment, the substrate comprising; an event sensor to generate an output representative of acceleration, velocity, inertia or motion of the substrate, and a process parameter sensor to sense a process parameter of a process performed by the integrated circuit processing equipment, wherein the process parameter sensor senses the process parameter in response to a data acquisition signal; and a controller, coupled to the event sensor and the process parameter sensor, to receive the output from the event sensor and to detect at least one predetermined event based on the output, wherein the controller generates the data acquisition signal in response to detecting the predetermined event and provides the data acquisition signal to the process parameter sensor. - View Dependent Claims (23, 24, 25, 26)
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Specification