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Apparatus and method for force mounting semiconductor packages to printed circuit boards

  • US 7,171,745 B2
  • Filed: 09/30/2004
  • Issued: 02/06/2007
  • Est. Priority Date: 08/02/2002
  • Status: Expired due to Term
First Claim
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1. A method comprising:

  • mounting a first integrated circuit die onto a first surface of a substrate;

    housing the first integrated circuit die mounted onto the substrate in a housing;

    using a force mechanism to force mount the housing including the first integrated circuit die mounted on the substrate onto a printed circuit boards; and

    a first set of contact pads on the first surface of the substrate, a second set of contact pads on a second surface of the substrate, and vias through the substrate to electrically couple the first set of contact pads and the second set of contact pads respectively.

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