Pressure transducer
First Claim
1. A pressure transducer package for measuring the pressure in an environment, the pressure transducer package comprising:
- a housing;
a diaphragm supported by the housing;
a support disposed in the housing; and
a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element, the sensing element comprising;
at least one substrate; and
at least one piezoresistor formed on the at least one substrate;
wherein the at least one substrate is formed of a material having a coefficient of thermal expansion greater than 4 ppm/k at 600 degrees kelvin.
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Accused Products
Abstract
One aspect is a pressure transducer package comprising a housing, a diaphragm, a support disposed in the housing and a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element. The sensing element comprises at least one substrate having a coefficient of thermal expansion greater than 4 ppm/k. In another aspect, the sensing element comprises at least one substrate formed of a first material and an epitaxial layer of a second material having a lower coefficient of thermal expansion. In a further aspect, the support abuts the housing at a spherically-shaped interface to compensate for misalignment between the support and the sensing element to ensure that the sensing element is evenly loaded.
87 Citations
16 Claims
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1. A pressure transducer package for measuring the pressure in an environment, the pressure transducer package comprising:
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a housing; a diaphragm supported by the housing; a support disposed in the housing; and a sensing element disposed in the housing between the diaphragm and the support so that the pressure from the environment acts on the diaphragm to compress the sensing element, the sensing element comprising; at least one substrate; and at least one piezoresistor formed on the at least one substrate; wherein the at least one substrate is formed of a material having a coefficient of thermal expansion greater than 4 ppm/k at 600 degrees kelvin. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification