Fine force actuator assembly for chemical mechanical polishing apparatuses

• US 7,172,493 B2
• Filed: 10/18/2005
• Issued: 02/06/2007
• Est. Priority Date: 11/24/2003
• Status: Active Grant

• Current Assignee: Nikon Corporation
• Original Assignee: Nikon Corporation
• Inventors: Watson, Douglas C., Yuan, Bausan, Novak, W. Thomas, Yang, Pai-Hsueh
• Primary Examiner(s): NGUYEN, DUNG V
• Application Number:
  US11/252,483
• Publication Number:
  US 20060035564A1
• Time in Patent Office: 476 Days
• Field of Search: 451/5, 451 9- 11, 451/59, 451/41, 451285-289, 438691-693
• US Class Current: 451/11
• CPC Class Codes: B24B 37/005 Control means for lapping machines or devices
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 37/30 for single side lapping of plane surfaces
• CPC Class Codes: B24B 41/068 Table-like supports for panels, sheets or the like

Abstract

A polishing apparatus (10) for polishing a device (12) with a polishing pad (48) includes a pad holder (50) and an actuator assembly (432). The pad holder (50) retains the polishing pad (48). The actuator assembly (432) includes a plurality of spaced apart actuators (438F) (438S) (438T) that are coupled to the pad holder (50). The actuators (438F) (438S) (438T) cooperate to direct forces on the pad holder (50) to alter the pressure of the polishing pad (48) on the device (12). At least one of the actuators (438F) (438S) (438T) includes a first actuator subassembly (440) and a second actuator subassembly (442) that interacts with the first actuator subassembly (440) to direct a force on the pad holder (50). The second actuator subassembly (442) is coupled to the pad holder (50) and the second actuator subassembly (442) rotates with the pad holder (50) relative to the first actuator subassembly (440).

Claims

1. A polishing apparatus for polishing a device with a polishing pad, the polishing apparatus comprising:

a pad holder that retains the polishing pad; and

an actuator assembly that includes a plurality of spaced apart actuators that are coupled to the pad holder, each of the actuators directing a force on the pad holder that alters the pressure of the polishing pad on the device, wherein at least one of the actuators is an attraction only actuator.

2. The polishing apparatus of claim 1 wherein the attraction only actuator includes a first core that is substantially “

C”

shaped.

3. The polishing apparatus of claim 1 wherein the attraction only actuator includes a first core that is substantially “

E”

shaped.

4. The polishing apparatus of claim 1 wherein the attraction only actuator includes a first core, a conductor secured to the first core, and a second core spaced apart a component gap from the first core, the second core being coupled to the pad holder.

5. The polishing apparatus of claim 4 further comprising a control system that directs current to the conductor to attract the second core to the first core, wherein the amount of current directed to the conductor is calculated without measuring the component gap.

6. The polishing apparatus of claim 1 further comprising a fluid source that controls the pressure in a chamber to direct a force on the pad holder to alter the pressure of the polishing pad on the device.

7. A method for making a device that includes the steps of providing a substrate and polishing the substrate with the polishing apparatus according to claim 1.

8. A method for making a wafer that includes the steps of providing a substrate and polishing the substrate with the polishing apparatus according to claim 1.

9. The polishing apparatus of claim 1 wherein the plurality of spaced apart actuators dynamically control the force applied at various positions of the pad holder to inhibit over-polishing at an edge of the device.

10. The polishing apparatus of claim 1 wherein the plurality of space apart actuators dynamically control the force applied at various positions of the pad holder to achieve substantially uniform polishing of the device.

11. A polishing apparatus for polishing a device with a polishing pad, the polishing apparatus comprising:

a pad holder that retains the polishing pad; and

an actuator assembly that includes a plurality of spaced apart actuators that are coupled to the pad holder, each of the actuators directing a force on the pad holder that alters the pressure of the polishing pad on the device, wherein at least one of the actuators includes a first actuator subassembly and a second actuator subassembly that interacts with the first actuator subassembly to direct a force on the pad holder, the second actuator subassembly being coupled to the pad holder.

12. The polishing apparatus of claim 11 wherein at least one of the actuators is a voice coil type actuator.

13. The polishing apparatus of claim 11 further comprising a pad rotator that rotates the pad holder and the second actuator subassembly relative to the first actuator subassembly.

14. A polishing apparatus for polishing a device with a polishing pad, the polishing apparatus comprising:

a pad holder that retains the polishing pad; and

an actuator assembly that includes a plurality of spaced apart actuators that are coupled to the pad holder, each of the actuators directing a force on the pad holder that alters the pressure of the polishing pad on the device;

wherein the plurality of spaced apart actuators dynamically control the force applied at various positions of the pad holder to inhibit over-polishing at an edge of the device; and

wherein the plurality of spaced apart actuators dynamically control the force applied at various positions of the pad holder to inhibit tilting of the pad when only a portion of the pad is adjacent to the device.

15. A polishing apparatus for polishing a device with a polishing pad, the polishing apparatus comprising:

a pad holder that retains the polishing pad; and

an actuator assembly that includes an attraction only actuator that is coupled to the pad holder, the attraction only actuator directing a force on the pad holder to alter the pressure of the polishing pad on the device.

16. The polishing apparatus of claim 15 wherein the actuator assembly includes three spaced apart attraction only actuators.

17. The polishing apparatus of claim 15 wherein the attraction only actuator includes a first core that is substantially “

C”

shaped.

18. The polishing apparatus of claim 15 wherein the attraction only actuator includes a first core that is substantially “

E”

shaped.

19. The polishing apparatus of claim 15 wherein the attraction only actuator includes a first actuator subassembly and a second actuator subassembly that interacts with the first actuator subassembly to direct the force on the pad holder, the second actuator subassembly being coupled to the pad holder.

20. The polishing apparatus of claim 19 further comprising a pad rotator that rotates the pad holder and the second actuator subassembly relative to the first actuator subassembly.

21. The polishing apparatus of claim 15 further comprising a fluid source that controls the pressure in a chamber to alter the pressure of the polishing pad on the device.

22. A method for making a wafer that includes the steps of providing a substrate and polishing the substrate with the polishing apparatus according to claim 15.

23. The polishing apparatus of claim 15 wherein the actuator assembly dynamically controls the force applied at various positions of the pad to inhibit over-polishing at an edge of the device.

24. The polishing apparatus of claim 15 wherein the actuator assembly dynamically controls the force applied at various positions of the pad to inhibit tilting of the pad when only a portion of the pad is adjacent to the device.

25. The polishing apparatus of claim 15 wherein the actuator assembly dynamically controls the force applied at various positions of the pad to achieve substantially uniform polishing of the device.

26. A polishing apparatus for polishing a device, the polishing apparatus comprising:

a pad holder that retains a polishing pad;

an actuator assembly that includes an attraction only actuator having a first actuator subassembly and a second actuator subassembly, the second actuator subassembly being coupled to the pad holder, the second actuator subassembly interacting with the first actuator subassembly to direct a force on the pad holder relative to the device to alter the pressure of the polishing pad on the device; and

a pad rotator that rotates the pad and the second actuator subassembly relative to first actuator subassembly.

27. The polishing apparatus of claim 26 wherein the actuator assembly tilts the pad holder without substantially distorting the pad holder.

28. The polishing apparatus of claim 26 wherein the actuator assembly includes three spaced apart actuators.

29. The polishing apparatus of claim 26 further comprising a fluid source that controls the pressure in a chamber to alter the pressure of the polishing pad on the device.

30. A method for making a wafer that includes the steps of providing a substrate and polishing the substrate with the polishing apparatus according to claim 26.

31. The polishing apparatus of claim 26 wherein the actuator assembly dynamically controls the force applied at various positions of the pad to inhibit over-polishing at an edge of the device.

32. The polishing apparatus of claim 26 wherein the actuator assembly dynamically controls the force applied at various positions of the pad to inhibit tilting of the pad when only a portion of the pad is adjacent to the device.

33. The polishing apparatus of claim 26 wherein the actuator assembly dynamically controls the force applied at various positions of the pad to achieve substantially uniform polishing of the device.

34. A method for polishing a device, the method comprising the steps of:

retaining a polishing pad with a pad holder; and

directing a force on the pad holder to alter the pressure of the polishing pad on the device with an actuator assembly, the actuator assembly including a plurality of spaced apart actuators that are coupled to the pad holder, wherein at least one of the actuators is an attraction only actuator.

35. The method of claim 34 further comprising the step of controlling the pressure in a chamber with a fluid source to alter the pressure of the polishing pad on the device.

36. A method for making a device that includes the steps of providing a substrate and polishing the substrate by the method of claim 34.

37. A method for polishing a device, the method comprising the steps of:

retaining a polishing pad with a pad holder; and

directing a force on the pad holder to alter the pressure of the polishing pad on the device with an actuator assembly, the actuator assembly including a plurality of spaced apart actuators that are coupled to the pad holder, wherein at least one of the actuators includes a first actuator subassembly and a second actuator subassembly that interacts with the first actuator subassembly to direct the force on the pad holder, the second actuator subassembly being coupled to the pad holder.

38. The method of claim 37 wherein at least one of the actuators is a voice coil type actuator.

39. The method of claim 37 further comprising the step of rotating the pad holder and the second actuator subassembly relative to the first actuator subassembly with a pad rotator.

40. A method for polishing a device, the method comprising the steps of:

providing a pad holder that retains a polishing pad;

directing a force on the pad holder to alter the pressure of the polishing pad on the device with an actuator assembly, the actuator assembly including a plurality of spaced apart actuators each having a first actuator subassembly and a second actuator subassembly, the second actuator subassembly being coupled to the pad holder, the second actuator subassembly interacting with the first actuator subassembly to alter the pressure of the polishing pad on the device; and

rotating the polishing pad and the second actuator subassembly relative to first actuator subassembly with a pad rotator.

41. The method of claim 40 wherein at least one of the actuators is an attraction only actuator.

42. The method of claim 40 wherein at least one of the actuators is a voice coil type actuator.

43. The method of claim 40 further comprising the step of controlling the pressure in a chamber with a fluid source to alter the pressure of the polishing pad on the device.

44. A method for making a device that includes the steps of providing a substrate and polishing the substrate by the method of claim 40.

45. A polishing apparatus for polishing a device, the polishing apparatus comprising:

a pad holder that retains a polishing pad;

an actuator assembly that includes an actuator having a first actuator subassembly and a second actuator subassembly, the second actuator subassembly being coupled to the pad holder, the second actuator subassembly interacting with the first actuator subassembly to direct a force on the pad holder relative to the device to alter the pressure of the polishing pad on the device, wherein the actuator assembly tilts the pad holder without substantially distorting the pad holder; and

a pad rotator that rotates the pad and the second actuator subassembly relative to first actuator subassembly.

46. A polishing apparatus for polishing a device, the polishing apparatus comprising:

a pad holder that retains a polishing pad;

an actuator assembly that includes a voice coil type actuator having a first actuator subassembly and a second actuator subassembly, the second actuator subassembly being coupled to the pad holder, the second actuator subassembly interacting with the first actuator subassembly to direct a force on the pad holder relative to the device to alter the pressure of the polishing pad on the device; and

a pad rotator that rotates the pad and the second actuator subassembly relative to first actuator subassembly.