Vertical semiconductor component having a drift zone having a field electrode, and method for fabricating such a drift zone

• US 7,173,306 B2
• Filed: 08/27/2004
• Issued: 02/06/2007
• Est. Priority Date: 08/27/2003
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Hirler, Franz, Pfirsch, Frank, Tihanyi, Jenoe, Henninger, Ralf, Zundel, Markus
• Primary Examiner(s): LOUIE, WAI SING
• Application Number:
  US10/927,948
• Publication Number:
  US 20050082591A1
• Time in Patent Office: 893 Days
• Field of Search: None
• US Class Current: 257/329
• CPC Class Codes: H01L 29/0619 with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
• CPC Class Codes: H01L 29/402 Field plates
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/7802 Vertical DMOS transistors, i.e. VDMOS transistors
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236
• CPC Class Codes: H01L 29/861 Diodes

Abstract

The invention relates to a method for fabricating a drift zone of a vertical semiconductor component and to a vertical semiconductor component having the following features:

• • a semiconductor body (100) having a first side (101) and a second side (102),
  • a drift zone (30) of a first conduction type which is arranged in the region between the first and the second sides (101, 102) and is formed for the purpose of taking up a reverse voltage,
  • a field electrode arrangement arranged in the drift zone (30) and having at least one electrically conducted field electrode (40; 40A–40E; 90A–90J) arranged in a manner insulated from the semiconductor body (100), an electrical potential of the at least one field electrode (40; 40A–40E; 90A–90J) varying in the vertical direction of the semiconductor body (100) at least when a reverse voltage is applied.

Claims

1. A vertical semiconductor component comprising:

a semiconductor body including a first side and a second side;

a drift zone of a first conduction type positioned in the semiconductor body between the first side and the second side, the drift zone operable to take up a reverse voltage;

a field electrode arrangement positioned in the drift zone, the field electrode arrangement including at least one electrically conductive field electrode insulated from the semiconductor body; and

at least one semiconductor zone arranged in floating fashion in the drift zone or arranged in floating fashion adjoining the drift zone, wherein the at least one field electrode is electrically coupled to the at least one semiconductor zone.

2. The semiconductor component of claim 1 wherein the at least one semiconductor zone is of a second conduction type.

3. The semiconductor component of claim 1 wherein the at least one semiconductor zone is of the first conduction type and the at least one semiconductor zone is doped more heavily than the drift zone.

4. The semiconductor component of claim 1 wherein the at least one field electrode is formed such that it tapers in the vertical direction of the semiconductor body.

5. The semiconductor component of claim 1 wherein the at least one field electrode comprises a plurality of field electrodes and the at least one semiconductor zone comprises a plurality of floating semiconductor zones, with each of the plurality of field electrodes assigned to one of the semiconductor zones, and each of the plurality of semiconductor zones arranged in the vertical direction above or beside the field electrode assigned to it.

6. The semiconductor component of claim 2 wherein the at least one field electrode is surrounded by an insulation layer that has a respective cutout through which the at least one semiconductor zone of the second conduction type extends as far as the at least one field electrode.

7. The semiconductor component of claim 1 in which the at least one field electrode comprises a heavily doped semiconductor material or a metal.

8. The semiconductor component of claim 7 wherein the at least one field electrode is of the same conduction type as the at least one semiconductor zone.

9. The semiconductor component of claim 2 wherein the semiconductor component is a diode having a pn junction, the diode comprising:

a first terminal zone of the first conduction type, the first terminal zone doped more heavily than the drift zone and the first terminal zone adjoining the drift zone in the region of the first side; and

a second terminal zone of the second conduction type, the second terminal zone adjoining the drift zone in the region of the second side.

10. The semiconductor component of claim 1 wherein the semiconductor component is a Schottky diode, the diode comprising:

a terminal electrode that adjoins the drift zone on the first side and forms a Schottky contact with the drift zone.

11. The semiconductor component of claim 1 wherein the semiconductor component is formed as a transistor, the transistor comprising:

a first terminal zone of the first conduction type, the first terminal zone doped more heavily than the drift zone and the first terminal zone adjoining the drift zone in the region of the first side of the semiconductor body,

a second terminal zone of the first conduction type in the region of the second side of the semiconductor body;

a body zone of the second conduction type arranged between the second terminal zone and the drift zone; and

a control electrode insulated from the semiconductor body, the control electrode operable, upon application of a drive potential, to form a conductive channel in the body zone between the second terminal and the drift zone.

12. The semiconductor component of claim 11 wherein the body zone is coupled to one of the field electrodes arranged in a manner lying one above the other in the vertical direction.

13. The semiconductor component of claim 11 wherein the control electrode is formed in a trench extending into the semiconductor body proceeding from the second side.

14. The semiconductor component of claim 13 wherein the at least one field electrode is arranged below the control electrode in the trench.

15. The semiconductor component of claim 11 wherein the control electrode is formed above the second side of the semiconductor body.

16. The semiconductor component of claim 15 wherein the at least one field electrode is formed in a trench extending into the semiconductor body in the vertical direction.

21. The semiconductor component of claim 13, wherein the connection terminals comprise an anode terminal and a cathode terminal, and wherein floating with respect to the connection terminals further comprises being separated by a material other than a conductive material from the connection terminals.

17. A vertical semiconductor component having connection terminals, comprising:

a semiconductor body including a first side and a second side;

a drift zone of a first conduction type positioned in the semiconductor body between the first side and the second side, the drift zone operable to take up a reverse voltage;

a field electrode arrangement positioned in the drift zone, the field electrode arrangement including at least one electrically conductive field electrode insulated from the semiconductor body; and

at least one semiconductor zone arranged in the drift zone or arranged adjoining the drift zone, the at least one semiconductor zone floating with respect to the connection terminals, wherein the at least one field electrode is electrically coupled to the at least one semiconductor zone.

18. The semiconductor component of claim 17, wherein the connection terminals include a source and a drain of a transistor.

19. The semiconductor component of claim 17, wherein the connection terminals include a cathode and an anode.

20. The semiconductor component of claim 17, wherein the connection terminals comprise a source terminal and a drain terminal, and wherein floating with respect to the connection terminals further comprises being separated by a material other than a conductive material from the connection terminals.