Memory card production using prefabricated cover and molded casing portion

• US 7,174,628 B1
• Filed: 03/03/2005
• Issued: 02/13/2007
• Est. Priority Date: 03/03/2005
• Status: Expired due to Fees

• Current Assignee: Super Talent Electronics, Inc.
• Original Assignee: Super Talent Electronics, Inc.
• Inventors: Hsueh, Paul, Ni, Jim, Wang, Kuang-Yu, Chiou, Ren-Kang
• Primary Examiner(s): Arbes; Carl J.
• Application Number:
  US11/071,289
• Time in Patent Office: 712 Days
• Field of Search: 298/30, 298/32, 298/40, 298/41, 438/127
• US Class Current: 29/841
• CPC Class Codes: H05K 1/117 Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
• CPC Class Codes: H05K 2201/10159 Memory
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

Secure-digital (SD) type memory cards are produced using one or more prefabricated cover portions and a molded casing portion. A sub-assembly is formed by mounting a printed circuit board assembly (PCBA) onto the cover portion such that the contact pads of the PCBA are exposed through associated windows defined in the cover. The sub-assembly is placed into a cavity formed in a mold assembly, and molten thermoplastic material is then injected into each cavity of the mold assembly under heat and pressure using known injection molding techniques, thereby forming a molded plastic casing portion that secures the PCBA to the cover and completes the memory card housing.

Claims

1. A method for fabricating a memory card, the method comprising:

forming a cover defining a plurality of windows and a printed circuit board assembly (PCBA) including a printed circuit board (PCB) substrate having opposing first and second surfaces and opposing front and back edges, wherein the PCBA also includes a plurality of contact pads mounted on the second surface and arranged along the front edge of the PCB substrate;

forming a sub-assembly by mounting the PCBA onto the cover such that at least one contact pad of the plurality of contact pads is exposed through an associated window of the plurality of windows; and

injecting molten plastic onto at least one of the first surface and the second surface of the PCBA such that the molten plastic secures the PCBA to the cover.

2. The method according to claim 1,

wherein forming the first PCBA further comprises mounting one or more integrated circuits on the first surface of the PCB substrate,

wherein forming the cover comprises forming a lower wall defining the windows, and

wherein forming the sub-assembly comprises mounting the PCB substrate onto the lower wall of the cover such that the contact pads are exposed through the windows and the integrated circuits extend away from the lower wall.

3. The method according to claim 2, wherein forming the cover comprises forming a plurality of identical prefabricated covers including said cover, each prefabricated cover being connected to a carrier strip by an associated connecting segment.

4. The method according to claim 2, wherein forming the sub-assembly comprises positioning the PCBA in the cover such that a rear section of the PCB substrate defines a first plane, and such that a front section of the PCB substrate defines a second plane that extends at an acute angle relative to the first plane.

5. The method according to claim 4, wherein forming the sub-assembly further comprises mounting the PCBA such that the front edge of the PCB substrate is maintained at a first height relative to a lower surface of the lower wall, and such that the rear edge of the PCB substrate is maintained at a second height relative to the lower surface of the lower wall, wherein the first height is greater than the second height.

6. The method according to claim 2, wherein injecting said molten plastic comprises forming a molded casing including an upper wall located over the integrated circuits.

7. The method according to claim 2,

forming said cover further comprises forming a second prefabricated cover including an upper wall;

wherein forming the sub-assembly comprises mounting the second prefabricated cover such that the PCBA is positioned between the upper and lower walls; and

wherein injecting the molten plastic comprises forming an intermediate casing portion between the upper and lower walls.

8. The method according to claim 1,

wherein forming the cover comprises forming a plurality of identical prefabricated covers including said cover, each prefabricated cover being connected to a carrier strip by an associated connecting segment;

and

wherein the method further comprises mounting the plurality of prefabricated covers into a multi-chamber molding assembly such that each cover is received in a corresponding chamber of the multi-chamber molding assembly, and such that said associated connecting segment of each prefabricated cover extends through a groove formed in a wall surrounding the corresponding chamber.

9. The method according to claim 1,

wherein forming the prefabricated cover comprises forming a switch base on a side wall of the prefabricated cover, and

wherein the method further comprising attaching a movable switch portion to the switch base.

10. The method according to claim 9,

wherein forming the switch base comprises forming an elongated slot, and

wherein attaching the movable switch portion to the switch base comprises engaging a rail portion into the elongated slot such that a handle portion extends out of the elongated slot.

11. The method according to claim 9,

wherein forming the switch base comprises forming an elongated rail, and

wherein attaching the movable switch portion to the switch base comprises mounting the movable switch portion such that the elongated rail of the switch base is slidably received inside an elongated opening defined in the movable switch portion.

12. The method according to claim 1,

wherein forming the first PCBA further comprises mounting one or more integrated circuits on the first surface of the PCB substrate,

wherein forming the cover comprises forming an upper wall, a front wall, and a first lower wall portion connected to the front wall and extending parallel to the upper wall, wherein the first lower wall portion defines the windows, and

wherein forming the sub-assembly comprises mounting the PCB substrate onto the cover such the front edge of the PCB substrate is inserted between the upper wall and the first lower wall portion with the second surface facing away from the upper wall such that the contact pads are exposed through the windows and the integrated circuits extend toward the upper wall.

13. The method according to claim 12, wherein injecting said molten plastic comprises forming a molded casing including a second lower wall portion formed on the second surface of the PCB substrate.

14. The method according to claim 1, wherein the memory card is a Secure Digital (SD) memory card.

15. The method according to claim 1, wherein the memory card is a Universal Serial Bus (USB) memory device.

16. The method according to claim 1, wherein the memory card is a memory stick.