Heat transfer system for a satellite including an evaporator

• US 7,174,950 B2
• Filed: 05/29/2003
• Issued: 02/13/2007
• Est. Priority Date: 05/30/2002
• Status: Expired due to Fees

• Current Assignee: Alcatel SA (Nokia Corporation)
• Original Assignee: Alcatel SA (Nokia Corporation)
• Inventors: Texier, Emmanuel, Jacque, Bernard, Cluzet, Ge, Tjiptahardja, Tisna, Amidieu, Marcel
• Primary Examiner(s): Walberg; Teresa J.
• Application Number:
  US10/446,828
• Publication Number:
  US 20040040691A1
• Time in Patent Office: 1,356 Days
• Field of Search: 165/41, 165/104.26, 165/86, 244/158.R, 244/159
• US Class Current: 165/104.26
• CPC Class Codes: B64G 1/503 Radiator panels
• CPC Class Codes: B64G 1/506 Heat pipes
• CPC Class Codes: F28D 15/0275 Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
• CPC Class Codes: F28D 15/043 forming loops, e.g. capillary pumped loops

Abstract

A heat transfer system includes a heat transfer passage in the vicinity of a source of dissipated heat on a satellite to collect heat dissipated by the source and a fluid loop including an evaporator having over part of its path a maximum surface area of its external walls in contact with external walls of the heat transfer passage.

Claims

1. A heat transfer system including a heat transfer passage in the vicinity of a source of dissipated heat on a satellite adapted to collect heat dissipated by said source and a fluid loop including an evaporator having over part of its path a maximum surface area of its external walls in contact with external walls of said heat transfer passage.

2. The system claimed in claim 1 wherein said evaporator is parallel to and between two heat transfer passages and each face of said evaporator facing respective heat transfer passages is thermally coupled to the facing face of said passage by surface contact of fins of said passages and said evaporator.

3. The system claimed in claim 2 wherein said heat transfer passages are coupling heat pipes and a base of said evaporator constituting its third face is coupled by surface contact to a main heat pipe in direct contact with said source.

4. The system claimed in claim 1 wherein said evaporator has a shape with right-angle corners.

5. The system claimed in claim 4 wherein said shape is a square.

6. The system claimed in claim 4 wherein said shape is a rectangle.

7. The system claimed in claim 1 wherein faces of said evaporator having no surfaces in contact with a heat transfer passage are hollowed out.

8. The system of claim 1, wherein the evaporator comprises a capillary wick.

9. The system of claim 1, wherein the fluid loop is sealed from the heat transfer passage.

10. The system claimed in claim 1, wherein at least two external walls of the evaporator over at least part of the evaporator are in contact with external walls of the heat transfer passage.

11. The system claimed in claim 1, wherein at least three external walls of the evaporator over at least part of the evaporator are in contact with external walls of the heat transfer passage.

12. A satellite, comprising:

a heat source;

a heat transfer passage; and

a two phase fluid loop having a vapor phase and a liquid phase and comprising an evaporator and a condenser, wherein the vapor and liquid phases are separated, except in the evaporator and the condenser, and wherein the vapor and liquid phases flow in a same direction within the two phase fluid loop; and

wherein the evaporator has external walls and over at least part of the evaporator a majority of the surface area of the external walls are in contact with external walls of the heat transfer passage.

13. The satellite of claim 12, wherein the two phase fluid loop is sealed from the heat transfer passage.

14. The satellite of claim 12, wherein the heat transfer passage comprises fluid piping in contact with or adjacent the heat source and in contact with or adjacent the evaporator for exchanging heat with the evaporator.

15. The satellite of claim 12, wherein the evaporator is parallel to and between two heat transfer passages and each face of the evaporator facing respective heat transfer passages is thermally coupled to the facing face of the corresponding heat transfer passage by surface contact of the heat transfer passages and the evaporator.

16. The satellite of claim 15, wherein the heat transfer passages are coupling heat pipes and a base of the evaporator constituting a third face of the evaporator is coupled by surface contact to a main heat pipe in direct contact with the heat source.

17. The satellite of claim 12, wherein the evaporator has a cross-sectional shape with right-angle corners, the cross section taken in a direction perpendicular to a longitudinal direction of the evaporator.

18. The satellite of claim 17, wherein the shape is a square.

19. The satellite of claim 17, wherein the shape is a rectangle.

20. The satellite of claim 12, wherein faces of said evaporator having no surfaces in contact with a heat transfer passage are hollowed out.

21. The satellite of claim 12, wherein over at least part of the evaporator a maximum of the surface area of the external walls are in contact with external walls of the heat transfer passage.

22. The satellite of claim 12, wherein at least two external walls of the evaporator over at least part of the evaporator are in contact with external walls of the heat transfer passage.

23. The satellite of claim 12, wherein at least three external walls of the evaporator over at least part of the evaporator are in contact with external walls of the heat transfer passage.

24. A satellite, comprising:

a heat source;

a heat transfer passage; and

a two phase heat exchanger having a vapor phase and a liquid phase and comprising an evaporator and a condenser; and

wherein the evaporator has external walls and over at least part of the evaporator a majority of the surface area of the external walls are in contact with external walls of the heat transfer passage.

25. The satellite of claim 24, wherein the evaporator is parallel to and between two heat transfer passages and each face of the evaporator facing respective heat transfer passages is thermally coupled to the facing face of the corresponding heat transfer passage by surface contact of the heat transfer passages and the evaporator.

26. The satellite of claim 24, wherein faces of said evaporator having no surfaces in contact with a heat transfer passage are hollowed out.