Laminate for electronic circuit

• US 7,175,736 B2
• Filed: 01/28/2004
• Issued: 02/13/2007
• Est. Priority Date: 04/20/2000
• Status: Expired due to Fees

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Sakayori, Katsuya
• Primary Examiner(s): Aftergut; Jeff H.
• Assistant Examiner(s): GOFF II, JOHN L
• Application Number:
  US10/765,086
• Publication Number:
  US 20040241465A1
• Time in Patent Office: 1,112 Days
• Field of Search: 156/309.6
• US Class Current: 156/309.6
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 2250/40 Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
• CPC Class Codes: B32B 2309/02 Temperature
• CPC Class Codes: B32B 2311/12 Copper
• CPC Class Codes: B32B 2311/30 Iron, e.g. steel
• CPC Class Codes: B32B 37/10 characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• CPC Class Codes: H05K 1/036 Multilayers with layers of different types
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0154 Polyimide
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 156/1092 All laminae planar and face to face
• CPC Class Codes: Y10T 428/24355 Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
• CPC Class Codes: Y10T 428/31721 Of polyimide

Abstract

The present invention is directed to a laminate having a layer construction of metal-insulating layer-metal or a layer construction of metal-insulating layer, which laminate meets conditions for developing large adhesive strength between the insulating layer and the metal, as well as to an insulating film and an electronic circuit using the laminate. The laminate has a layer construction of first metal layer/insulating layer/second metal layer or a layer construction of metal layer/insulating layer. The insulating layer 1 has a multilayer structure of two or more layers. The layers on the side of the adhesive interface with each metal layer (a copper foil 3 and an SUS foil 4), out of the layers constituting the insulating layer 1, each are a thermoplastic resin layer 2. The minimum value of the storage modulus at a temperature at or above Tg of the thermoplastic resin layer 2 is not more than 10⁶ Pa.

Claims

1. A process for producing a laminate, comprising the step of thermocompression bonding a core insulating layer, a thermoplastic resin layer, which is disposed on both sides or one side (z-plane) of the core insulating layer, has an adhesive property and has a maximum value of the storage modulus of not more than 10⁶ Pa at a temperature at or above Tg of the thermoplastic resin layer, and a metal layer disposed on the surface of the thermoplastic resin layer at a temperature of Tg or above of the thermoplastic resin layer under temperature conditions such that the storage modulus of the thermoplastic resin is minimum.

2. A method for producing an electronic circuit comprising the steps of:

providing a laminate comprising a combination of a metal layer with an insulating layer, said laminate having a layer construction of first metal layer/insulating layer/second metal layer or a layer construction of metal layer/insulating layer, the insulating layer having a multilayer structure of two or more layers, the layer on the side of the adhesive interface with the metal layer, out of the layers constituting the insulating layer, being a thermoplastic resin layer, and a maximum value of the storage modulus at a temperature at or above Tg of the thermoplastic resin layer being not more than 10⁶ Pa and obtained by thermocompression under temperature conditions such that the storage modulus of the thermoplastic resin is minimum;

forming a photosensitive resin layer on a surface of the metal layer of the laminate; and

patterning the thus formed photosensitive resin layer to prepare an electronic circuit.

3. A method for producing an electronic circuit comprising the steps of:

providing an insulating film comprising an insulating layer and a thermoplastic resin layer provided on at least one side of the insulating layer, the thermoplastic resin having a maximum value of the storage modulus of not more than 10⁶ Pa at a temperature at or above Tg of the thermoplastic resin layer;

laminating the insulating film with a metal layer to prepare a laminate by thermocompression under temperature conditions such that the storage modulus of the thermoplastic resin is minimum;

forming a photosensitive resin layer on a surface of the metal layer of the laminate; and

patterning the thus formed photosensitive resin layer to prepare an electronic circuit.