Method of fabricating printhead IC using CTE matched wafer and sacrificial materials
First Claim
1. A method of fabricating a printhead integrated circuit to incorporate a plurality of nozzle arrangements, each nozzle arrangement having nozzle chamber walls defining a nozzle chamber and an ink ejection port bounded by a rim, the method comprising the steps of:
- providing a substrate having drive circuitry formed thereon;
depositing a sacrificial material layer on the substrate, the sacrificial material having a coefficient of thermal expansion substantially the same as that of the substrate;
etching the sacrificial material layer to define deposition zones for the nozzle chamber walls and the rim;
depositing a conformal layer of structural material on the sacrificial layer;
planarizing the conformal layer to a predetermined depth to define each ink ejection port bounded by its respective rim; and
removing the sacrificial material layer.
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Accused Products
Abstract
A method of fabricating a printhead integrated circuit to incorporate a plurality of nozzle arrangements is provided. Each nozzle arrangement has nozzle chamber walls defining a nozzle chamber and an ink ejection port bounded by a rim. The method comprises providing a substrate having drive circuitry formed thereon, depositing a sacrificial material layer on the substrate, etching the sacrificial material layer to define deposition zones for the nozzle chamber walls and the rim, depositing a conformal layer of structural material on the sacrificial layer, planarizing the conformal layer to a predetermined depth to define each ink ejection port bounded by its respective rim and etching away the sacrificial material layer. The sacrificial material has a coefficient of thermal expansion substantially the same as that of the substrate.
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Citations
9 Claims
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1. A method of fabricating a printhead integrated circuit to incorporate a plurality of nozzle arrangements, each nozzle arrangement having nozzle chamber walls defining a nozzle chamber and an ink ejection port bounded by a rim, the method comprising the steps of:
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providing a substrate having drive circuitry formed thereon; depositing a sacrificial material layer on the substrate, the sacrificial material having a coefficient of thermal expansion substantially the same as that of the substrate; etching the sacrificial material layer to define deposition zones for the nozzle chamber walls and the rim; depositing a conformal layer of structural material on the sacrificial layer; planarizing the conformal layer to a predetermined depth to define each ink ejection port bounded by its respective rim; and removing the sacrificial material layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification