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Method of fabricating printhead IC using CTE matched wafer and sacrificial materials

  • US 7,175,775 B2
  • Filed: 03/04/2005
  • Issued: 02/13/2007
  • Est. Priority Date: 10/16/1998
  • Status: Expired due to Fees
First Claim
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1. A method of fabricating a printhead integrated circuit to incorporate a plurality of nozzle arrangements, each nozzle arrangement having nozzle chamber walls defining a nozzle chamber and an ink ejection port bounded by a rim, the method comprising the steps of:

  • providing a substrate having drive circuitry formed thereon;

    depositing a sacrificial material layer on the substrate, the sacrificial material having a coefficient of thermal expansion substantially the same as that of the substrate;

    etching the sacrificial material layer to define deposition zones for the nozzle chamber walls and the rim;

    depositing a conformal layer of structural material on the sacrificial layer;

    planarizing the conformal layer to a predetermined depth to define each ink ejection port bounded by its respective rim; and

    removing the sacrificial material layer.

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