Method and device for ensuring trandsducer bond line thickness
First Claim
1. A housing configured to retain a transducer, the housing comprising:
- a wall; and
a receptacle positioned adjacent to the wall, the receptacle having a member configured to pass ultrasonic energy therethrough, the member including at least three spacers defining a uniform planar surface, the spacers configured to maintain a substantially uniform bond line between the transducer and the member.
2 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and method for producing a substantially uniform bond line thickness by utilizing a crosshatch, grid pattern, or spacers of like patterns in a receptacle of a transducer housing. Certain embodiments include a housing configured to retain a transducer. The housing includes an annular wall and a receptacle adjacent to the wall. The receptacle has a member configured to allow radiation to pass through it. The member has a first surface and a second surface. The spacers on the first surface are configured in a grid pattern to maintain uniform spacing and a uniform bond line thickness between the transducer and the member. The bond line is further controlled by the depth of the spacers, which are configured to maintain a generally constant bond line thickness.
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Citations
19 Claims
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1. A housing configured to retain a transducer, the housing comprising:
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a wall; and a receptacle positioned adjacent to the wall, the receptacle having a member configured to pass ultrasonic energy therethrough, the member including at least three spacers defining a uniform planar surface, the spacers configured to maintain a substantially uniform bond line between the transducer and the member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A housing configured to retain a transducer, the housing comprising:
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a wall; and a receptacle positioned adjacent to the wall, the receptacle having a member configured to pass ultrasonic energy therethrough, the member including a grid configured to maintain a substantially uniform bond line between the transducer and the member. - View Dependent Claims (10, 11)
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12. A method of providing a uniform bond line in a housing for a transducer, the method comprising:
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providing a spacer on a first surface of the housing wherein a first surface of the spacer defines a uniform planar surface; pre-selecting a height of the spacer; and disposing a predetermined amount of adhesive on the housing and the spacer wherein passage of ultrasonic energy through the housing is not adversely affected and further wherein the spacer is configured to maintain a substantially uniform bond line and spacing between a transducer and the first surface of the housing. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification