Reflective plate of LCD and fabrication method thereof

• US 7,176,995 B2
• Filed: 10/22/2003
• Issued: 02/13/2007
• Est. Priority Date: 12/31/2002
• Status: Active Grant

• Current Assignee: LG Philips LCD Company Limited (LG Display Co., Ltd.)
• Original Assignee: LG Philips LCD Company Limited (LG Display Co., Ltd.)
• Inventors: Jang, Sang Min, Ryu, Hee Yeong, Choi, Su Seok
• Primary Examiner(s): QI, ZHI QIANG
• Application Number:
  US10/689,625
• Publication Number:
  US 20040125287A1
• Time in Patent Office: 1,210 Days
• Field of Search: 349/113, 349/114, 349/67, 359/599
• US Class Current: 349/113
• CPC Class Codes: G02F 1/133553 Reflecting elements associated to illuminating devices G02F1/133605
• CPC Class Codes: G02F 1/136236 using a grey or half tone lithographic process

Abstract

A reflective plate used in a liquid crystal display including a substrate, a first peak and depression layer of organic insulator on the substrate, a second peak and depression layer of organic insulator overlapping with the first peak and depression layer, and a reflective layer on the first and second peak and depression layers.

Claims

1. A method for fabricating a reflective plate used in a liquid crystal display comprising:

depositing a first organic insulating layer on a substrate;

forming a plurality of first peak patterns having a predetermined distance from the first organic insulating layer by using a first mask;

depositing a second organic insulating layer on the substrate including the first peak patterns;

forming a plurality of second peak patterns between the first peak patterns from the second organic insulating layer by using a second mask; and

forming a reflective electrode on the first and second peak patterns;

wherein the second peak patterns have a different height from the first peak patterns, and overlap only a portion of the adjacent first peak pattern.

2. The method according to claim 1, wherein the first and second peak patterns are softened by a curing bake process to form a plurality of peak patterns.

3. The method according to claim 1, wherein each of the first peak patterns comprises a plurality of first peaks and each of the second peak pattern comprises a plurality of second peaks, wherein a highest point of each of the first peaks is located at different locations from a highest point of each of the second peaks.

4. The method according to claim 1, wherein each of the first peak patterns comprises a plurality of first peaks and each of the second peak pattern comprises a plurality of second peaks, wherein a center of each of the first peaks is located at different locations from a center of each of the second peaks.

5. The method according to claim 1, wherein the first and second organic insulating layers are photosensitive resin.

6. The method according to claim 1, wherein the first mask comprises a light transmission portion and a light reflecting portion.

7. The method according to claim 1, wherein the second mask comprises a light transmission portion and a light reflecting portion.

8. The method according to claim 1, wherein the first mask is one of a transflective mask and a diffraction mask.

9. The method according to claim 1, wherein the second mask is one of a transflective mask and a diffraction mask.

10. The method according to claim 1, wherein the first and second peak patterns have a plurality of peaks that are randomly arranged.

11. The method according to claim 1, wherein each of the first peak patterns comprises a plurality of first peaks and each of the second peak pattern comprises a plurality of second peak overlapped with the first peaks.

12. The method according to claim 1, wherein each of the first peak patterns comprises a plurality of first peaks and each of the second peak pattern comprises a plurality of second peaks overlapped with portions of the first peaks with a height less than one half height of the first peaks.

13. The method according to claim 1, wherein a reflecting surface formed by the first and second peak patterns has final peak shapes in which a ratio of a height to a radius of the peak is 1:

10.

14. The method according to claim 1, wherein the second peak patterns between the first peak patterns directly contacts the substrate.