Materials for chemical mechanical polishing

• US 7,179,159 B2
• Filed: 05/02/2005
• Issued: 02/20/2007
• Est. Priority Date: 05/02/2005
• Status: Expired due to Fees

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Prabhu, Gopalakrishna B., Jackson, Robert L., Menk, Gregory E., Iyer, Anand N., Bonner, Benjamin A., Rondum, Erik S., McReynolds, Peter, Leung, Garlen
• Primary Examiner(s): NGUYEN, DUNG V
• Application Number:
  US11/119,682
• Publication Number:
  US 20060246831A1
• Time in Patent Office: 659 Days
• Field of Search: 451/533, 451527-530, 451537-539, 451/296
• US Class Current: 451/527
• CPC Class Codes: B24B 7/228 for grinding thin, brittle parts, e.g. semiconductors, wafers grinding edges of thin, brittle parts B24B9/065
• CPC Class Codes: B24D 11/00 Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
• CPC Class Codes: B24D 2203/00 Tool surfaces formed with a pattern

Abstract

A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.

Claims

1. A processing article for removing material from a substrate, comprising:

a linear base film;

an adhesive layer; and

a plurality of polishing tiles positioned on the adhesive layer across a width of the base film and configured to define a plurality of grooves therebetween, wherein the plurality of grooves enable fluid flow therein and facilitate delivery and take up in a roll format.

2. The processing article of claim 1, further comprising an upper film bound on the plurality of tiles.

3. The processing article of claim 1, wherein each of the plurality of tiles are substantially rectangular.

4. The processing article of claim 1, wherein the plurality of tiles define a polishing surface with a lateral portion in the polishing surface that is transparent to light or electromagnetic radiation.

5. The processing article of claim 1, wherein the plurality of tiles supported on the base film are configured for use on a web type platen assembly.

6. The processing article of claim 1, wherein the polishing tiles have an average surface roughness of about 0.5 micrometers to about 12 micrometers.

7. The processing article of claim 1, wherein the polishing tiles have a hardness of about 20 to about 80 on the Shore D hardness scale.

8. The processing article of claim 1, wherein each of the plurality of tiles are discrete from each other.

9. A processing article for removing material from a substrate, comprising:

a linear base film;

a plurality of polishing tiles comprising a polishing material positioned on the base film and configured to define a plurality of grooves therebetween, wherein the plurality of grooves are formed through the polishing material and are configured to enable fluid flow therein and facilitate delivery and take up in a roll format.

10. The processing article of claim 9, further comprising an upper film bound on the plurality of tiles.

11. The processing article of claim 9, wherein each of the plurality of tiles are substantially rectangular.

12. The processing article of claim 11, wherein the substantially rectangular tiles substantially covers a width of the base film.

13. The processing article of claim 9, wherein the plurality of tiles define a polishing surface with a lateral portion that is transparent to light or electromagnetic radiation.

14. The processing article of claim 9, wherein the plurality of tiles supported on the base film is configured for use on a web type platen assembly.

15. The processing article of claim 9, wherein the polishing tiles have an average surface roughness of about 0.5 micrometers to about 12 micrometers.

16. The processing article of claim 9, wherein the polishing tiles have a hardness of about 20 to about 80 on the Shore D hardness scale.

17. The processing article of claim 9, wherein each of the plurality of tiles are discrete from each other.