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Chemical mechanical polishing test structures and methods for inspecting the same

  • US 7,179,661 B1
  • Filed: 08/25/2000
  • Issued: 02/20/2007
  • Est. Priority Date: 12/14/1999
  • Status: Expired due to Term
First Claim
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1. A method of fabricating a semiconductor die, comprising:

  • forming a first test structure on the semiconductor die, wherein at least a portion of the first test structure includes a dummy structure in a top conductive layer, wherein the dummy structure of the first test structure serves as both a dummy structure and a part of a voltage contrast structure, wherein serving as a dummy structure is defined as the dummy structure of the first test structure being part of a plurality of dummy structures that are distributed within empty spaces of the semiconductor die to facilitate an even polishing of a surface of the semiconductor die, and wherein only a portion of the dummy structures each serve as a voltage contrast structure while the other portion of dummy structures do not each serve as a voltage contrast structure; and

    performing voltage contrast testing on the first test structure that serves as both a dummy structure and a voltage contrast structure to detect electrical defects within the first test structure.

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