Wafer processing method

• US 7,179,723 B2
• Filed: 11/12/2004
• Issued: 02/20/2007
• Est. Priority Date: 11/18/2003
• Status: Active Grant

• Current Assignee: Disco Corporation
• Original Assignee: Disco Corporation
• Inventors: Genda, Satoshi, Oba, Ryugo, Furuta, Kenji, Kitahara, Nobuyasu, Yoshikawa, Toshiyuki
• Primary Examiner(s): Lebentritt; Michael
• Assistant Examiner(s): Lee; Cheung
• Application Number:
  US10/986,371
• Publication Number:
  US 20050106782A1
• Time in Patent Office: 830 Days
• Field of Search: None
• US Class Current: 438/462
• CPC Class Codes: B23K 26/18 using absorbing layers on the workpiece, e.g. for marking or protecting purposes
• CPC Class Codes: B23K 26/364 for making a groove or trench, e.g. for scribing a break initiation groove
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/78 with subsequent division of the substrate into plural individual devices cutting to change the surface-physical characteristics or shape of semiconductor bodies H01L21/304

Abstract

A laser beam processing method for processing a wafer by applying a laser beam to a predetermined area, comprising the steps of forming a resin film which absorbs a laser beam, on the surface to be processed of the wafer; applying a laser beam to the surface to be processed of the wafer through the resin film; and removing the resin film after the laser beam application step.

Claims

1. A laser processing method for processing a wafer by applying a laser beam to a predetermined area of the wafer, comprising:

a resin film forming step for forming a resin film which absorbs a laser beam, on a surface to be processed of the wafer, wherein the resin film is formed of a water-soluble light absorbing resin prepared by mixing a light absorber with a water-soluble resin;

a laser beam application step for applying a laser beam having a wavelength of 355 nm to the surface to be processed of the wafer through the resin film to form grooves in the wafer; and

a resin film removal step for removing the resin film after the laser beam application step.

2. The laser processing method according to claim 1, wherein the resin film has a light absorption coefficient of 1,000/cm or more.

3. The laser processing method according to claim 1, wherein the water-soluble light absorbing resin is a resin prepared by mixing a polyvinyl alcohol with titanium dioxide.

4. The laser processing method according to claim 1, wherein the wafer is a semiconductor wafer comprising semiconductor chips which are composed of a laminate consisting of an insulating film and a functional film and formed on the front surface of a semiconductor substrate and which are sectioned by streets, the resin film forming step is to form the resin film which absorbs a laser beam, on the front surface of the semiconductor substrate, and the laser beam application step is to form laser grooves which reach the semiconductor substrate by applying a laser beam to the laminate forming the streets through the resin film.

5. The laser processing method according to claim 4, wherein the semiconductor wafer having the laser grooves formed by the laser beam application step is cut along the laser grooves with a cutting blade to be divided into individual semiconductor chips.

6. The laser processing method according to claim 1, wherein the wafer is an optical device wafer which has a plurality of streets formed in a lattice pattern on the front surface of a substrate and comprises optical devices formed in a plurality of areas sectioned by the plurality of streets, the resin film forming step is to form the resin film which absorbs a laser beam, on the back surface of the substrate, and the laser beam application step is to form laser grooves in the substrate by applying a laser beam to the back surface of the substrate through the resin film.

7. The laser processing method according to claim 6, wherein the optical device wafer having the laser grooves formed by the laser beam application step is divided into individual optical devices along the laser grooves by applying external force to the laser grooves.