Mesh shaped dam mounted on a substrate
First Claim
Patent Images
1. A substrate comprising:
- a carrier body having a surface for carrying at least a semiconductor device;
a plurality of contact pads disposed on the surface of the carrier body;
a solder mask formed on the surface of the carrier body and having a plurality of openings exposing the contact pads; and
a plurality of dams formed on the solder mask and located between the contact pads, the dams being made from another solder mask stacked on the underlying solder mask.
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Abstract
A substrate is provided for carrying at least a semiconductor device. The substrate mainly includes a carrier body, a plurality of contact pads, a solder mask and a plurality of dams of a mesh. The contact pads are disposed on a surface of the carrier body and each has a bonding surface exposed out of the solder mask for connecting with the external terminals of the semiconductor device. The dams are disposed above the surface of the carrier body. The dams protrude from and located between the bonding surfaces of the contact pads to prevent solder paste, flux or the external terminals of the semiconductor device from bridging.
24 Citations
19 Claims
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1. A substrate comprising:
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a carrier body having a surface for carrying at least a semiconductor device; a plurality of contact pads disposed on the surface of the carrier body; a solder mask formed on the surface of the carrier body and having a plurality of openings exposing the contact pads; and a plurality of dams formed on the solder mask and located between the contact pads, the dams being made from another solder mask stacked on the underlying solder mask. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor package comprising:
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a substrate comprising; a carrier body having a surface; a plurality of contact pads disposed on the surface of the carrier body; a solder mask formed on the surface of the carrier body and having a plurality of openings exposing the contact pads; and a plurality of dams formed on the solder mask and located between the contact pads, the dams being made from another solder mask stacked on the underlying solder mask; and at least a semiconductor device disposed on the substrate and having a plurality of external terminals, the external terminals being connected to the bonding surfaces of the contact pads. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification