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Mesh shaped dam mounted on a substrate

  • US 7,180,181 B2
  • Filed: 09/03/2004
  • Issued: 02/20/2007
  • Est. Priority Date: 09/04/2003
  • Status: Active Grant
First Claim
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1. A substrate comprising:

  • a carrier body having a surface for carrying at least a semiconductor device;

    a plurality of contact pads disposed on the surface of the carrier body;

    a solder mask formed on the surface of the carrier body and having a plurality of openings exposing the contact pads; and

    a plurality of dams formed on the solder mask and located between the contact pads, the dams being made from another solder mask stacked on the underlying solder mask.

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