Multi-pitch test probe assembly for testing semiconductor dies having contact pads

• US 7,180,318 B1
• Filed: 10/15/2004
• Issued: 02/20/2007
• Est. Priority Date: 10/15/2004
• Status: Active Grant

• Current Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Original Assignee: Xilinx, Inc. (Advanced Micro Devices, Inc.)
• Inventors: Mardi, Mohsen Hossein, Mahoney, David M.
• Primary Examiner(s): Nguyen; Vinh P.
• Application Number:
  US10/966,917
• Time in Patent Office: 858 Days
• Field of Search: 324761-762, 324/765, 324/158.1, 324/763, 438 14- 18, 439/482, 439/824, 257/686, 257/700
• US Class Current: 324/756.03
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams

Abstract

Die probing devices can include multiple sets of probe wires, where certain probe wires correspond to test pads and other correspond to bond pads. The probe wires can be electrically coupled to each other using either a space transformer or a probe card, to provide appropriate continuity. Probe wires can generally be arranged in numerous different patterns depending upon (for example) pad layout, wire configuration, wire type, and probe head design/manufacturing constraints.

Claims

1. An apparatus comprising:

a substrate comprising a probe card;

a first plurality of probe wires coupled to the substrate, wherein the first plurality of probe wires are arranged with respect to the substrate to correspond to a first plurality of pads of an integrated circuit; and

a second plurality of probe wires coupled to the substrate, wherein the second plurality of probe wires are arranged with respect to the substrate to correspond to a second plurality of pads of the integrated circuit, and wherein the first plurality of pads of an integrated circuit are test pads and the second plurality of pads of an integrated circuit are bond pads, each of the first plurality of pads being in electrical communication with one of the second plurality of pads, and wherein at least one of the first plurality of probe wires is electrically coupled to at least one of the second plurality of probe wires.

2. The apparatus of claim 1 wherein the substrate further comprises:

a first plate including a first plurality of through holes; and

a second plate including a second plurality of through holes, wherein the first plurality of probe wires and the second plurality of probe wires are coupled between the first plate and the second plate, wherein at least one of the first plurality of probe wires is at least partially held in place by corresponding ones of the first plurality of through holes and the second plurality of through holes, and wherein at least one of the second plurality of probe wires is at least partially held in place by corresponding ones of the first plurality of through holes and the second plurality of through holes.

3. The apparatus of claim 1 wherein the substrate further comprises:

a first surface including a plurality of conductive terminals; and

a second surface opposing the first surface, wherein the first plurality of probe wires is coupled to the second surface, wherein the second plurality of probe wires is coupled to the second surface, and wherein at least one of the first plurality of probe wires or at least one of the second plurality of probe wires is electrically coupled to at least one of the plurality of conductive terminals.

4. The apparatus of claim 3 wherein the at least one of the first plurality of probe wires and the at least one of the second plurality of probe wires are both electrically coupled to one of the plurality of conductive terminals.

5. The apparatus of claim 1 further comprising:

a space transformer coupled to the substrate and configured to make electrical contact with at least one of the first plurality of probe wires and at least one of the second plurality of probe wires.

6. The apparatus of claim 5, wherein the probe card is coupled to the space transformer and configured to electrically couple the space transformer, the at least one of the first plurality of probe wires, and the at least one of the second plurality of probe wires to a test controller operable to transmit and receive test signal for integrated circuit testing.

7. The apparatus of claim 5 wherein the space transformer further comprises:

a first surface including a plurality of pins; and

a second surface including a plurality of sockets, wherein a first one of the plurality of sockets is coupled to the at least one of the first plurality of probe wires, and wherein a second one of the plurality of sockets is coupled to the at least one of the second plurality of probe wires.

8. The apparatus of claim 7 wherein the at least one of the first plurality of probe wires coupled to the first one of the plurality of sockets and the at least one of the second plurality of probe wires coupled to the second one of the plurality of sockets are electrically coupled to each other.

9. The apparatus of claim 5 wherein the space transformer further comprises:

a wire operable to be connected to the probe card, wherein the wire includes a wire surface oriented to make electrical contact with the at least one of the first plurality of probe wires and the at least one of the second plurality of probe wires.

10. The apparatus of claim 1 wherein at least one of the first plurality of probe wires is longer than at least one of the second plurality of probe wires.

11. The apparatus of claim 1 wherein at least one of the second plurality of probe wires is located in proximity to a corresponding one of the first plurality of probe wires.

12. The apparatus of claim 1 wherein at least one of the first plurality of probe wires has a shape different from that of at least one of the second plurality of probe wires.

13. The apparatus of claim 1 wherein at least one of the first plurality of probe wires and at least one of the second plurality of probe wires each have a spring section.

14. The apparatus of claim 1 wherein at least one of the first plurality of probe wires and at least one of the second plurality of probe wires each possess a resilient property.

15. The apparatus of claim 1 wherein at least one of the first plurality of probe wires is not electrically connected any of the second plurality of probe wires.

16. The apparatus of claim 1 wherein at least one of the first plurality of probe wires is oriented in a first direction, and at least one of the second plurality of probe wires is oriented in a second direction.

17. A method of probing an integrated circuit die having a bond pad and a test pad electrically connected to the bond pad, the method comprising:

contacting a first probe wire with the test pad; and

contacting a second probe wire with the bond pad; and

shorting the first probe wire to the second probe wire.

18. The method of claim 17 further comprising:

transmitting a test signal to the integrated circuit die via at least one of the first probe wire and the second probe wire.

19. The method of claim 17 further comprising:

receiving a test signal from the integrated circuit die via at least one of the first probe wire and the second probe wire.

20. The method of claim 17 wherein the shorting the first probe wire to the second probe wire further comprises:

contacting a first end of the first probe wire and a first end of the second probe wire with a wire surface of a test wire.

21. The method of claim 17 wherein the shorting the first probe wire to the second probe wire further comprises:

contacting a first end of the first probe wire with a first conductor;

contacting a first end of the second probe wire with a second conductor; and

electrically coupling the first conductor to the second conductor.

22. The method of claim 17 wherein the contacting a first probe wire with a first pad of an integrated circuit die further comprises resiliently flexing the first probe wire, and wherein the contacting a second probe wire with a second pad of an integrated circuit die further comprises resiliently flexing the second probe wire.

23. An apparatus comprising:

a means for contacting a first probe means with a first pad of an integrated circuit die; and

a means for contacting a second probe means with a second pad of the integrated circuit die; and

means for electrically coupling together the first probe means to the second probe means;

wherein the first pad of the integrated circuit die is a first test pad or a first bond pad, wherein the second pad of the integrated circuit die is a second test pad or a second bond pad, and wherein the first test pad is electrically coupled to the first bond pad.

24. The apparatus of claim 23 further comprising:

a means for transmitting a test signal to the integrated circuit die via at least one of the first probe means and the second probe means.