Multi-pitch test probe assembly for testing semiconductor dies having contact pads
First Claim
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1. An apparatus comprising:
- a substrate comprising a probe card;
a first plurality of probe wires coupled to the substrate, wherein the first plurality of probe wires are arranged with respect to the substrate to correspond to a first plurality of pads of an integrated circuit; and
a second plurality of probe wires coupled to the substrate, wherein the second plurality of probe wires are arranged with respect to the substrate to correspond to a second plurality of pads of the integrated circuit, and wherein the first plurality of pads of an integrated circuit are test pads and the second plurality of pads of an integrated circuit are bond pads, each of the first plurality of pads being in electrical communication with one of the second plurality of pads, and wherein at least one of the first plurality of probe wires is electrically coupled to at least one of the second plurality of probe wires.
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Abstract
Die probing devices can include multiple sets of probe wires, where certain probe wires correspond to test pads and other correspond to bond pads. The probe wires can be electrically coupled to each other using either a space transformer or a probe card, to provide appropriate continuity. Probe wires can generally be arranged in numerous different patterns depending upon (for example) pad layout, wire configuration, wire type, and probe head design/manufacturing constraints.
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Citations
24 Claims
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1. An apparatus comprising:
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a substrate comprising a probe card; a first plurality of probe wires coupled to the substrate, wherein the first plurality of probe wires are arranged with respect to the substrate to correspond to a first plurality of pads of an integrated circuit; and a second plurality of probe wires coupled to the substrate, wherein the second plurality of probe wires are arranged with respect to the substrate to correspond to a second plurality of pads of the integrated circuit, and wherein the first plurality of pads of an integrated circuit are test pads and the second plurality of pads of an integrated circuit are bond pads, each of the first plurality of pads being in electrical communication with one of the second plurality of pads, and wherein at least one of the first plurality of probe wires is electrically coupled to at least one of the second plurality of probe wires. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of probing an integrated circuit die having a bond pad and a test pad electrically connected to the bond pad, the method comprising:
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contacting a first probe wire with the test pad; and contacting a second probe wire with the bond pad; and shorting the first probe wire to the second probe wire. - View Dependent Claims (18, 19, 20, 21, 22)
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23. An apparatus comprising:
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a means for contacting a first probe means with a first pad of an integrated circuit die; and a means for contacting a second probe means with a second pad of the integrated circuit die; and means for electrically coupling together the first probe means to the second probe means; wherein the first pad of the integrated circuit die is a first test pad or a first bond pad, wherein the second pad of the integrated circuit die is a second test pad or a second bond pad, and wherein the first test pad is electrically coupled to the first bond pad. - View Dependent Claims (24)
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Specification