Reduction of thermal non-cyclic error effects in interferometers

• US 7,180,603 B2
• Filed: 06/28/2004
• Issued: 02/20/2007
• Est. Priority Date: 06/26/2003
• Status: Expired due to Fees

• Current Assignee: Zygo Corporation (Ametek Incorporated)
• Original Assignee: Zygo Corporation (Ametek Incorporated)
• Inventors: Hill, Henry A., Schroeder, Michael, Carlson, Andrew Eric
• Primary Examiner(s): Toetley, Jr.; Gregory J.
• Assistant Examiner(s): CONNOLLY, PATRICK J
• Application Number:
  US10/879,681
• Publication Number:
  US 20050094155A1
• Time in Patent Office: 967 Days
• Field of Search: 356484-487, 356491-493, 356/496, 356/498, 356/500, 356/508, 356/509
• US Class Current: 356/500
• CPC Class Codes: G01B 2290/70 Using polarization in the interferometer
• CPC Class Codes: G01B 9/02003 using beat frequencies
• CPC Class Codes: G01B 9/02049 characterised by particular mechanical design details
• CPC Class Codes: G03F 7/70775 Position control, e.g. interferometers or encoders for determining the stage position
• CPC Class Codes: G03F 7/70858 Environment aspects, e.g. pressure of beam-path gas, temperature pollution aspects G03F7/70916

Abstract

In general, in one aspect, the invention features an interferometer assembly for use in a lithography tool used for fabricating integrated circuits on a wafer, wherein the lithography tool includes a support structure and a stage for positioning the wafer relative to the support structure, the interferometer assembly including an interferometer configured to direct a measurement beam between the stage and the support structure and combine the measurement beam with another beam to form an output beam which includes a phase related to a position of the stage relative to the support structure, wherein the interferometer is mechanically secured to the lithography tool through an interferometer surface selected to cause the phase of the output beam to be insensitive to thermal changes of the interferometer over a range of temperatures.

Claims

1. An interferometer assembly for use in a lithography tool used for fabricating integrated circuits on a wafer, wherein the lithography tool includes a support structure and a stage for positioning the wafer relative to the support structure, the interferometer assembly comprising:

an interferometer configured to direct a measurement beam between the stage and the support structure and combine the measurement beam with another beam to form an output beam which comprises a phase related to a position of the stage relative to the support structure,

wherein the interferometer is mechanically secured to the lithography tool through an interferometer surface selected to cause a distance between the stage and the support structure along the measurement beam path to be insensitive to thermal expansion of the interferometer over a range of temperatures so that the phase of the output beam is insensitive to thermal changes of the interferometer over the range of temperatures.

2. The interferometry assembly of claim 1, wherein the thermal changes comprise thermal expansion of the interferometer.

3. The interferometry assembly of claim 1, wherein the thermal changes comprise thermally induced changes in a refractive index of the interferometer.

4. The interferometry assembly of claim 1, wherein the interferometer surface mechanically secured to the lithography tool is an exit surface of the measurement beam.

5. The interferometry assembly of claim 1, wherein the interferometer is mechanically secured to the support structure.

6. The interferometry assembly of claim 1, wherein the interferometer is mechanically secured to the stage.

7. The interferometry assembly of claim 1, wherein the measurement beam contacts a measurement object.

8. The interferometry assembly of claim 7, wherein the measurement beam contacts the measurement object more than once.

9. The interferometry assembly of claim 7, wherein the other beam contacts the measurement object.

10. The interferometry assembly of claim 7, wherein the measurement object is a plane mirror.

11. The interferometry assembly of claim 1, wherein the interferometer is a high-stability plane mirror interferometer.

12. The interferometer assembly of claim 1, wherein the interferometer comprises beam splitter including two glass portions that are bonded together by a cement such that an optical path length of the measurement beam through the cement is substantially the same as an optical path length of the other beam through the cement.

13. An apparatus, comprising:

an interferometer, which during operation produces an output beam comprising a phase related to an optical path difference between a path of a first beam, which exits the interferometer at an exit surface and contacts a measurement object, and a path of a second beam; and

a mechanical fixture for mechanically securing the interferometer to an object,

wherein the interferometer is secured to the mechanical fixture at a location of the interferometer that causes a path length between the exit surface and the measurement object to be insensitive to thermal expansion of the interferometer over a range of temperatures so that the phase of the output beam is insensitive to thermal changes of the interferometer over the range of temperatures.

14. The apparatus of claim 13, wherein the thermal changes comprise thermal expansion of the interferometer.

15. The interferometry assembly of claim 13, wherein the thermal changes comprise thermally induced changes in a refractive index of the interferometer.

16. The apparatus of claim 13, wherein the location of the interferometer secured to the mechanical fixture is a portion of an exit surface of the first beam path.

17. The apparatus of claim 13, wherein the location of the interferometer secured to the mechanical fixture corresponds to a portion of the exit surface.

18. The apparatus of claim 13, wherein the interferometer is configured so that a thermal variation an optical path length of the first beam path within the interferometer is substantially equal to a thermal variation of an optical path length of the second beam path within the interferometer.

19. The apparatus of claim 13, wherein the interferometer is configured so that a thermal variation of an optical path length of the first beam path within the interferometer is unequal to a thermal variation of an optical path length of the second beam path within the interferometer.

20. The apparatus of claim 19, wherein the first beam path exits the interferometer at an exit surface and the location of the interferometer secured to the mechanical fixture is displaced from the exit surface by an amount that causes a thermal variation in the optical path difference of the first and second beam paths within the interferometer to be offset by a thermal variation in the optical path length of the first beam path out of the interferometer.

21. The apparatus of claim 20, wherein the location of the interferometer secured to the mechanical fixture is displaced by an amount Δ

X from the exit surface, where Δ

X corresponds to

$\mathrm{\Delta <br><br>}<br><br><br><br>X=\frac{1}{4<br><br><br><br>\mathrm{\alpha <br><br>}<br><br><br><br>k}<br><br>\frac{d<br><br>\mathrm{\Phi <br><br>}}{d<br><br>T},$

where k is the wavenumber of the first beam, T is the temperature, Φ

is the phase, and α

is a thermal expansion coefficient of a medium between the exit surface and the location.

22. The apparatus of claim 13, wherein the first beam contacts the measurement object more than once.

23. The apparatus of claim 22, wherein the interferometer is a high-stability plane mirror interferometer.

24. The apparatus of claim 13, wherein the second beam contacts the measurement object.

25. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer;

an illumination system for imaging spatially patterned radiation onto the wafer;

a positioning system for adjusting the position of the stage relative to the imaged radiation; and

the apparatus of claim 13 for monitoring the position of the wafer relative to the imaged radiation.

26. A lithography system for use in fabricating integrated circuits on a wafer, the system comprising:

a stage for supporting the wafer; and

an illumination system including a radiation source, a mask, a positioning system, a lens assembly, and the apparatus of claim 13,

wherein during operation the source directs radiation through the mask to produce spatially patterned radiation, the positioning system adjusts the position of the mask relative to the radiation from the source, the lens assembly images the spatially patterned radiation onto the wafer, and the apparatus monitors the position of the mask relative to the radiation from the source.

27. A beam writing system for use in fabricating a lithography mask, the system comprising:

a source providing a write beam to pattern a substrate;

a stage supporting the substrate;

a beam directing assembly for delivering the write beam to the substrate;

a positioning system for positioning the stage and beam directing assembly relative one another; and

the apparatus of claim 13 for monitoring the position of the stage relative to the beam directing assembly.

28. A lithography method for use in fabricating integrated circuits on a wafer, the method comprising:

supporting the wafer on a moveable stage;

imaging spatially patterned radiation onto the wafer;

adjusting the position of the stage; and

monitoring the position of the stage using the apparatus of claim 13.

29. A lithography method for use in the fabrication of integrated circuits comprising:

directing input radiation through a mask to produce spatially patterned radiation;

positioning the mask relative to the input radiation;

monitoring the position of the mask relative to the input radiation using the apparatus of claim 13; and

imaging the spatially patterned radiation onto a wafer.

30. A lithography method for fabricating integrated circuits on a wafer comprising:

positioning a first component of a lithography system relative to a second component of a

lithography system to expose the wafer to spatially patterned radiation; and

monitoring the position of the first component relative to the second component using the apparatus of claim 13.

31. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography method of claim 28; and

producing an integrated circuit from the wafer.

32. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography method of claim 29; and

producing an integrated circuit from the wafer.

33. A method for fabricating integrated circuits, the method comprising:

applying a resist to a wafer;

forming a pattern of a mask in the resist by exposing the wafer to radiation using the lithography method of claim 30; and

producing an integrated circuit from the wafer.

34. A method for fabricating integrated circuits, the method comprising using the lithography system of claim 25.

35. A method for fabricating integrated circuits, the method comprising using the lithography system of claim 26.

36. A method for fabricating a lithography mask, the method comprising:

directing a write beam to a substrate to pattern the substrate;

positioning the substrate relative to the write beam; and

monitoring the position of the substrate relative to the write beam using the apparatus of claim 13.

37. The apparatus of claim 13, wherein the interferometer comprises beam splitter including two glass portions that are bonded together by a cement such that an optical path length of the first beam through the cement is substantially the same as an optical path length of the second beam through the cement.

38. An apparatus, comprising:

an interferometer, which during operation produces an output beam comprising a phase related to an optical path difference between a path of a first beam, which exits the interferometer at an exit surface and contacts a measurement object, and a path of a second beam, the interferometer being configured so that a thermal variation of an optical path length of the first beam path within the interferometer is unequal to a thermal variation of an optical path length of the second beam path within the interferometer; and

a mechanical fixture for mechanically securing the interferometer to an object,

wherein the interferometer is secured to the mechanical fixture at a location of the interferometer displaced from the exit surface by an amount that causes a thermal variation in the optical path difference of the first and second beam paths within the interferometer to be offset by a thermal variation in the optical path length of the first beam path out of the interferometer so that the phase of the output beam is insensitive to thermal changes of the interferometer over a range of temperatures.