Microelectronic package within cylindrical housing
First Claim
1. A microelectronic package comprising:
- a housing including a cylindrical wall defining a central axis, the cylindrical wall having an outer surface and an inner surface, said cylindrical wall defining a central compartment between the inner surface and the central axis, the central axis being located within the central compartment, said inner surface having at least one assembly support surface that substantially faces the central axis, said housing further including at least one axial channel interposed between the outer surface and the inner surface; and
a microelectronIc assembly affixed to the assembly support surface, thereby disposing the microelectronic assembly within the central compartment.
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Accused Products
Abstract
A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipati9on of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.
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Citations
11 Claims
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1. A microelectronic package comprising:
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a housing including a cylindrical wall defining a central axis, the cylindrical wall having an outer surface and an inner surface, said cylindrical wall defining a central compartment between the inner surface and the central axis, the central axis being located within the central compartment, said inner surface having at least one assembly support surface that substantially faces the central axis, said housing further including at least one axial channel interposed between the outer surface and the inner surface; and a microelectronIc assembly affixed to the assembly support surface, thereby disposing the microelectronic assembly within the central compartment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification