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Microelectronic package within cylindrical housing

  • US 7,180,736 B2
  • Filed: 07/10/2003
  • Issued: 02/20/2007
  • Est. Priority Date: 07/10/2003
  • Status: Expired due to Fees
First Claim
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1. A microelectronic package comprising:

  • a housing including a cylindrical wall defining a central axis, the cylindrical wall having an outer surface and an inner surface, said cylindrical wall defining a central compartment between the inner surface and the central axis, the central axis being located within the central compartment, said inner surface having at least one assembly support surface that substantially faces the central axis, said housing further including at least one axial channel interposed between the outer surface and the inner surface; and

    a microelectronIc assembly affixed to the assembly support surface, thereby disposing the microelectronic assembly within the central compartment.

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  • 11 Assignments
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