Curing light instrument

• US 7,182,597 B2
• Filed: 08/08/2002
• Issued: 02/27/2007
• Est. Priority Date: 08/08/2002
• Status: Expired due to Term

• Current Assignee: Kerr Corporation (Envista Holdings Corporation)
• Original Assignee: Kerr Corporation (Envista Holdings Corporation)
• Inventors: Gill, Owen, Klinger, John, Lippay, Alex
• Primary Examiner(s): BUMGARNER, MELBA N
• Application Number:
  US10/215,210
• Publication Number:
  US 20040029069A1
• Time in Patent Office: 1,664 Days
• Field of Search: 433/29, 433/28, 433/215, 362/804, 362/800, 362/119
• US Class Current: 433/29
• CPC Class Codes: A61C 19/004 Hand-held apparatus, e.g. guns
• CPC Class Codes: G02B 6/0006 Coupling light into the fibre in general G02B6/4298
• CPC Class Codes: G02B 6/102 for infrared and ultraviolet radiation
• CPC Class Codes: G02B 6/4298 coupling with non-coherent light sources and/or radiation detectors, e.g. lamps, incandescent bulbs, scintillation chambers
• CPC Class Codes: Y10S 362/80 Light emitting diode

Abstract

The present invention provides a handheld portable, efficient instrument for curing light-curable compounds. The instrument comprises a housing, a light emitted structure supported in the housing, and a reflector configured to interface with the light emitting structure such that light emitted is captured and directed by the reflector onto a light-curable compound. The reflector maximizes the amount of light transferred and contacting the light-curable compound thereby reducing the instrument'"'"'s power requirements and improving efficiency. The light emitting structure comprises state of the art, energy efficient, light generating dies. The curing light instrument may also have a self-contained power supply lending portability and convenient of use.

Claims

1. An instrument for curing light-curable compounds comprising:

a housing;

a light emitting structure positioned in the housing and including a plurality of light emitting dies forming a generally planar array positioned on a generally planar substrate;

the substrate being mounted on a base made of a thermally conductive metal;

a heat sink thermally coupled with the base to direct heat away from the base and light emitting structure;

a reflector configured for being positioned with the light emitting structure, the reflector being a tubular structure having open proximal and distal ends;

the open proximal end of the reflector surrounding the die array generally at the plane of the substrate, the reflector further configured to capture light emitted from the die array at the proximal end and direct the light out of the distal end onto a light-curable compound,

an adaptor having opposite ends and configured to interface, at one end, with the distal end of the reflector and to interface, at the other end, with an end of a light guide so that the light guide is directly coupled to the distal end of the reflector for directly transmitting light captured by the reflector onto a light-curable compound.

2. The instrument of claim 1 wherein the substrate comprises a thermally conductive material.

3. The instrument of claim 1 wherein the reflector proximal end and distal end are differently dimensioned.

4. The instrument of claim 1 wherein the reflector is configured of at least one of a plastic, metal and glass.

5. The instrument of claim 1 further comprising a light guide, the light guide being configured for removably interfacing with the adaptor and an end of the reflector and operable for transmitting light from the light emitting structure.

6. The instrument of claim 5 wherein the light guide comprises a multiplicity of fiber optic strands bundled together to form a solid conductor, the strands being individually tapered to impart a taper to the light guide.

7. The instrument of claim 6 wherein the solid conductor comprises a light receiving end and a light transmitting end, the light receiving end having a diameter of about 13 mm and the light transmitting end having a diameter of about 11 mm.

8. The instrument of claim 6 wherein the fiber optic strands are tapered at an angle less than one-tenth of a degree (<

0.1°

), and the taper angle for said light guide is less than five degrees (5°

).

9. The instrument of claim 1 further comprising a light shield removably mounted to the housing to prevent reflection of curing light to an operator during use of the instrument.

10. The instrument of claim 1 further comprising a fan positioned in the housing to cool the light emitting structure.

11. The instrument of claim 1 further comprising a portable power supply positioned within the housing for providing power to the light emitting structure.

12. The instrument of claim 1 wherein said housing comprises a barrel portion, and a handle portion coupled to the barrel portion, wherein an end of the barrel portion includes the adaptor and is configured to support a light guide for transmitting light out of the barrel portion of the housing and to the light-curable compound.

13. The instrument of claim 1 wherein the thermally conductive metal of the base is at least one of aluminum, copper, gold, and silver.

14. The instrument of claim 1 further comprising a printed circuit board coupled to the base.

15. The instrument of claim 14 wherein the printed circuit board includes aluminum.

16. An instrument for curing light-curable compounds comprising:

a housing;

a light emitting structure comprising a plurality of solid state light emitting dies forming a generally planar collective array positioned on a generally planar substrate;

a reflector forming a generally tubular passage with open proximal and distal ends, the open proximal end of the reflector configured to surround the array of dies generally at the plane of the substrate to capture and direct light emitted by the array of dies out of the open distal end;

an adaptor having opposite ends and configured to interface, at one end, with the distal end of the reflector and to interface, at the other end, with an end of a light guide so that the light guide is directly coupled to the open distal end of the reflector for directly transmitting light captured by the reflector onto a light-curable compound.

17. The instrument of claim 16 wherein the reflector is configured of at least one of a plastic, metal and glass.

18. The instrument of claim 16 wherein the light guide comprises a multiplicity of fiber optic strands bundled together to form a solid conductor, the strands being individually tapered to impart a taper to the light guide.

19. The instrument of claim 18 wherein the solid conductor comprises a light receiving end and a light transmitting end, the light receiving end having a diameter of about 13 mm and the light transmitting end having a diameter of about 11 mm.

20. The instrument of claim 18 wherein the fiber optic strands are tapered at an angle less than one-tenth of a degree (<

0.1°

), and the taper angle for said light guide is less than five degrees (5°

).

21. The instrument of claim 16 further comprising a printed circuit board formed of a thermally conductive material, the printed circuit board coupled with the substrate on a side opposing the collective array of dies.

22. The instrument of claim 21 wherein the printed circuit board includes aluminum.

23. The instrument of claim 21 further comprising a heat sink thermally coupled with the printed circuit board.

24. The instrument of claim 23 further comprising a forced air device for directing air proximate the heat sink.

25. The instrument of claim 16 further comprising a portable power supply positioned within the housing to provide power to the light emitting structure.

26. The instrument of claim 16 further comprising a base formed of a thermally conductive material thermally coupled with the substrate.

27. The instrument of claim 26 wherein the base is formed of one of aluminum, copper, gold and silver.