Wired circuit board
First Claim
1. A wired circuit board comprising a metal suspension board, a thin metal film formed on the metal suspension board, a metal foil formed on the thin metal film, an insulating layer formed on the metal foil, and a conductive pattern formed on the insulating layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A wired circuit board that can provide a reduced transmission loss and an improved adhesion strength between a metal suspension board and a metal foil with a simple laminar structure, thereby ensuring improved long-term reliability. The wired circuit board 1 comprises a metal suspension board 2, a thin metal film 3 formed on the metal suspension board 2 by sputtering or by electrolytic plating, a metal foil 4 formed on the thin metal film 3 by electrolytic plating, an insulating base layer 5 formed on the metal foil 4 and the metal suspension board 2, and a conductive pattern 6 formed on the insulating base layer 5 as a wired circuit pattern. The wired circuit board 1 may include an insulating cover layer 7 formed on the insulating base layer 5 to cover the conductive pattern 6.
36 Citations
5 Claims
- 1. A wired circuit board comprising a metal suspension board, a thin metal film formed on the metal suspension board, a metal foil formed on the thin metal film, an insulating layer formed on the metal foil, and a conductive pattern formed on the insulating layer.
-
5. A wired circuit board comprising:
-
a metal suspension board formed of stainless steel having a thickness of 15–
30 μ
m,a thin metal film formed of chromium, copper, gold, alloys thereof or oxides thereof having a thickness of 0.01–
1 μ
m which is formed on the metal suspension board,a metal foil formed of copper having a thickness of 2–
5 μ
m which is formed on the thin metal film,an insulating layer formed of polyimide having a thickness of 5–
15 μ
m which is formed on the metal foil, anda conductive pattern formed of copper having a thickness of 5–
20 μ
m which is formed on the insulating layer.
-
Specification
-
- Resources
-
Current AssigneeNitto Denko Corporation
-
Original AssigneeNitto Denko Corporation
-
InventorsIshii, Jun, Kanagawa, Hitoki, Funada, Yasuhito
-
Primary Examiner(s)Zarroli; Michael C.
-
Application NumberUS11/365,845Publication NumberTime in Patent Office362 DaysField of Search439/66, 174/257, 174/256, 174/261, 174/250, 174/255US Class Current439/66CPC Class CodesH05K 1/056 the metal substrate being c...H05K 2201/0317 Thin film conductor layer; ...H05K 2201/0338 Layered conductor, e.g. lay...H05K 2203/0723 Electroplating, e.g. finish...
