Optical cross-connect system

• US 7,183,633 B2
• Filed: 03/01/2002
• Issued: 02/27/2007
• Est. Priority Date: 03/01/2001
• Status: Expired due to Term

• Current Assignee: Analog Devices, Inc.
• Original Assignee: Analog Devices, Inc.
• Inventors: Kobrin, Boris, Chaparala, Murali, Dalton, Scott, Wall, Franklin, Daneman, Michael J., Beerling, Timothy, Lin, Chuang-Chia, Kiang, Meng-Hsiung, Behin, Behrang, Chang, Mark W., Panyko, Stephen
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US10/469,516
• Publication Number:
  US 20060049826A1
• Time in Patent Office: 1,824 Days
• Field of Search: None
• US Class Current: 257/678
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: G02B 6/3518 the reflective optical element being an intrinsic part of a MEMS device, i.e. fabricated together with the MEMS device MEMS devices in general B81B; manufacture of MEM devices in general B81C; micromechanical devices controlling the direction of light G02B26/0833
• CPC Class Codes: G02B 6/3546 NxM switch, i.e. a regular array of switches elements of matrix type constellation
• CPC Class Codes: G02B 6/356 in an optical cross-connect device, e.g. routing and switching aspects of interconnecting different paths propagating different wavelengths to (re)configure the various input and output links switching polarized beams G02B6/3594; power equalizers G02B6/356 and G02B6/3594; path selecting means H04Q11/0001
• CPC Class Codes: G02B 6/357 Electrostatic force electrostatic forces controlling reflecting elements in general G02B26/0841
• CPC Class Codes: G02B 6/3572 Magnetic force magnetic forces controlling reflecting elements in general G02B26/085; magneto-optic devices G02F1/09
• CPC Class Codes: G02B 6/3584 constructional details of an associated actuator having a MEMS construction, i.e. constructed using semiconductor technology such as etching MEMS per se B81B, B81C

Abstract

An optical cross-connect switch comprises a base (216), a flap (211) and one or more electrically conductive landing pads (222) connected to the flap (211). The flap (211) has a bottom portion that is movably coupled to the base (216) such that the flap (211) is movable with respect to a plane of the base (216) from a first orientation to a second orientation. The one or more landing pads (222) are electrically isolated from the flap (211) and electrically coupled to be equipotential with a landing surface.

Claims

1. An optical cross-connect switch, comprising:

a base;

a flap having a bottom portion movably coupled to the base such that the flap is movable with respect to a plane of the base from a first orientation to a second orientation; and

one or more electrically conductive landing pads connected to the flap, wherein the one or more landing pads are electrically isolated from the flap and electrically coupled to be equipotential with a landing surface, wherein at least one landing pad is substantially parallel to the flap.

2. The switch of claim 1, wherein the base further includes at least one cantilevered anti-stiction bar.

3. The switch of claim 1 or 2, wherein a magnetic field is used to create a first actuation force to manipulate the flap.

4. The switch of claim 1 or 2, wherein an acoustic pulse is used to create a first actuation force to manipulate the flap.

5. The switch of claim 1 or 2, wherein a pneumatic pressure is used to create a first actuation force to manipulate the flap.

6. The switch of claim 1, 2, 3, 4 or 5 further including a stop configured to contact a portion of the flap in a contact area sized so that, upon application of an electrostatic bias between the flap and the stop, a sufficient second force holds the flap against the stop.

7. The switch of claim 6 wherein stop is comprised of two vertical walls.

8. The switch of claim 6 or 7 wherein the stop includes a sidewall made of silicon and having crystalline orientation of <

111>

.

9. The switch of claim 1, 2, 3, 4, 5, 6, 7 or 8 further including a microcontroller electrically coupled to the flap to enable the flap to be grounded or held at a voltage potential.

10. The switch of claim 9, wherein the microcontroller also controls the first actuation force.

11. The switch of claim 9, further comprising a magnet assembly electrically coupled to the microcontroller and sized less than 0.5″

in width, said magnet assembly positioned to surround the switch and provide magnetic force along both a Z and an X axis, wherein the microcontroller also controls the magnet assembly and wherein the first actuation force is magnetic.

12. The switch of claim 9, 10 or 11 wherein the microcontroller stores the state of the flap and capacitive sensing is used to confirm that the flap is in the correct state.

13. The switch of claim 9, 10, 11 further including a magnetoresistive element coupled to the flap, wherein the microcontroller stores the state of the flap and magnetoresistive sensing is used to confirm that the flap is in the correct state.

14. The switch of claim 13 further including a magnetoresistive element coupled to the base, wherein the microcontroller stores the state of the flap and magnetoresistive sensing is used to confirm that the flap is in the correct state.

15. The switch of claim 13 or 14 further including a magnetoresistive element coupled to the stop, wherein the microcontroller stores the state of the flap and magnetoresistive sensing is used to confirm that the flap is in the correct state.

16. The switch of claim 6, 7 or 8, further including a charge-storing circuit electrically coupled between the stop and an electrical ground, an isolator element electrically coupled between the clamping surface and a source of clamping voltage, wherein the isolator element is configured to electrically isolate the source of clamping voltage from the clamping surface in the event of a power failure.

17. The switch of claim 16 wherein the isolator element is an opto-isolator or a low leakage diode.

18. The switch of claim 16 or 17, wherein the charge-storing circuit includes a capacitor.

19. The switchof claims 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17 or 18, further including an enclosure for sealing the flap and having one or more sidewalls, an optical element coupled to at least one of the sidewalls, wherein at least one of the one or more sidewalls or the optical element includes a surface that is angled with respect to an optical plane.

20. The switch of claim 18, wherein the enclosure is evacuated.

21. The switch of claim 18, wherein the enclosure is filled with a gas.

22. The switch of claim 9, 10, 11, 12, 13, 14 or 15 wherein the microcontroller also monitors voltage levels and engage a signal transmission in the event of a power failure.

23. The switch of claim 16, 17, 18, 19 or 20 further including a microcontroller to monitor voltage levels, whereby the microcontroller may engage a signal transmission in the event of a power failure.

24. The switch of claim 9, 10, 11, 12, 13, 14 or 15, further including a stop configured to contact a portion of the cantilever in a contact area sized so that, upon application of an electrostatic bias between the flap and the stop, a sufficient second force holds the flap against the stop;

and a charge-storing circuit electrically coupled between the stop and an electrical ground, an isolator element electrically coupled between the clamping surface and a source of clamping voltage, wherein the isolator element is configured to electrically isolate the source of clamping voltage from the clamping surface in the event of a power failure.