Stacked packages and systems incorporating the same

• US 7,183,643 B2
• Filed: 11/04/2004
• Issued: 02/27/2007
• Est. Priority Date: 11/04/2003
• Status: Active Grant

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Gibson, David, Stavros, Andy
• Primary Examiner(s): Potter; Roy Karl
• Application Number:
  US10/981,067
• Publication Number:
  US 20050194672A1
• Time in Patent Office: 845 Days
• Field of Search: 257/723, 257/778, 257/685, 257/686
• US Class Current: 257/723
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2225/0652 Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06548 Conductive via connections through the substrate, container, or encapsulation
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/107 Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB printed circuits H05K1/00
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 24/14 of a plurality of bump connectors
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/10 the devices having separate containers
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1437 Static random-access memory [SRAM]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/112 directly combined with via connections
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10515 : Stacked components
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A microelectronic assembly incorporates units stacked one above the other and may include a plurality of similar stacks mounted to a circuit board. Some of the stacks may be inverted, rotated or both relative to other stacks so that corresponding edges of the stacks face one another to facilitate communication between the stacks. Communication between the stacks may be carried along traces on one or more interposers intercepting the stacks remote from the circuit board. Within each stack, conducting paths may extend in vertical columns or in other arrangements such as a stair step arrangement wherein each conductive path traverses a series of column positions, or in a crossing arrangement such two conductive paths cross back and forth between column positions along the vertical extend of the stack. A stack may include portions disposed above and below the circuit board.

Claims

1. A microelectronic assembly comprising:

(a) a circuit panel having top and bottom surfaces;

(b) a plurality of units each including one or more microelectronic elements, each said unit having a top surface, a bottom surface and edges extending between said top and bottom surfaces, each said unit having terminals at column positions on at least one of said surfaces,

said units being disposed in a plurality of stacks,

each said stack including a plurality of said units superposed on one another in top-surface to bottom surface arrangement with the top surfaces of the units facing toward the top of the stack and with terminals at the same column positions in different units of the stack aligned with one another in columns extending upwardly and downwardly within the stack,

said stacks being mounted to the circuit panel so that a first set of said stacks are disposed in a first orientation with the top surfaces of the units facing upwardly and a second set of said stacks are disposed in a second orientation with the top surfaces of the units facing downwardly, at least some of said stacks of said first set and at least some of said stacks of said second set being disposed side-by-side with one another.

2. The assembly as claimed in claim 1 wherein said units in each said stack are substantially identical to one another.

3. The assembly as claimed in claim 1 wherein each said stack has sides including a northerly side and a westerly side, the northerly side of each stack of said first set confronting the northerly side of a stack of said second set, the westerly side of each stack of said first set confronting the westerly side of a stack of the second set.

4. The assembly as claimed in claim 3 wherein at least some of the terminals at column positions on the northerly side of each stack of said first set are connected to terminals of the confronting northerly side of a stack of said second set, and wherein at least some of the terminals at column positions on the westerly side of each stack of said first set are connected to terminals of the confronting westerly side of a stack of said second set.

5. The assembly as claimed in claim 4 wherein said circuit panel has conductors thereon and at least some of said terminals of said stacks of said first and second sets are electrically connected to one another through said conductors on said circuit panel.

6. The assembly as claimed in claim 4 further comprising one or more interconnect interposers extending horizontally between said confronting sides of said stacks remote from said circuit panel, said interconnect interposer having conductors thereon, at least some of said terminals of said stacks of said first and second sets are electrically connected to one another through said conductors on said interconnect interposer.

7. The assembly as claimed in claim 6 wherein a portion of each said stack is disposed above said circuit panel and another portion of each said stack is disposed below said circuit panel, and wherein said one or more interconnect interposers include at least one top interconnect interposer disposed above said circuit panel and at least one bottom interconnect interposer disposed below said circuit panel.

8. A microelectronic assembly comprising:

(a) a circuit panel;

(b) a plurality of units each including one or more microelectronic elements, each said unit having a top surface, a bottom surface, each said unit having unit terminals on at least one of said surfaces,

said units being disposed in a plurality of stacks including first and second stacks, each said stack including a plurality of said units superposed on one another in top-surface to bottom surface arrangement, at least some of the unit terminals on each unit being connected to at least some of the unit terminals on other units in the same stack, said stacks being mounted to said circuit panel; and

(c) an interconnect interposer including a dielectric element and conductors, said interconnect interposer extending horizontally between said first and second stacks remote from said circuit panel, at least some unit terminals in a said first stack being electrically connected to at least some unit terminals in said second stack through said conductors of said interposer.

9. The assembly as claimed in claim 8 wherein each said unit includes a unit substrate having said unit terminals thereon, the at least one microelectronic element of each said unit being mounted to the unit substrate of such unit.

10. The assembly as claimed in claim 9 wherein said interconnect interposer extends between the unit substrates of adjacent units in said first stack and extends between the unit substrates of adjacent units in said second stack.

11. The assembly as claimed in claim 10 wherein each said unit substrate includes a central region and a peripheral region, and wherein the at least one microelectronic element of each said substrate is mounted in said central region, at least some of the terminals of each said unit being disposed in the peripheral region of the unit substrate, each said interconnect interposer extending between the peripheral regions of said unit substrates of said adjacent units but not between the central regions of those unit substrates.

12. The assembly as claimed in claim 11 wherein said dielectric element of said interconnect interposer includes a plurality of holes and border regions surrounding said holes and wherein each said interconnect interposer includes interposer terminals disposed on said border regions, the border regions being aligned with peripheral regions of said unit substrates of said adjacent units, said holes being aligned with the central regions of those unit substrates.

13. The assembly as claimed in claim 10 wherein said dielectric element of said interposer has oppositely-directed top and bottom surfaces, said interposer includes top interposer terminals exposed at the top surface of the dielectric element and bottom interposer terminals exposed at the bottom surface of the dielectric element, at least some of said bottom interposer terminals being electrically connected to at least some of said top interposer terminals, and wherein, in said first stack, unit terminals on one of said adjacent units are connected to unit terminals the other one of said adjacent units through said top and bottom interposer terminals.

14. The assembly as claimed in claim 13 wherein, in said first stack, said unit terminals, said top interposer terminals and said bottom interposer terminals are disposed at column positions such that terminals at the same column position are aligned with one another, and wherein at least some of said top interposer terminals are electrically connected to bottom interposer terminals at the same column position.

15. The assembly as claimed in claim 13 wherein, in said first stack, said unit terminals, said top interposer terminals and said bottom interposer terminals are disposed at column positions such that terminals at the same column position are aligned with one another, and wherein at least some of said top interposer terminals are electrically connected to bottom interposer terminals at the same column position.

16. A microelectronic assembly comprising:

(a) a stack including;

(i) an upper unit having first and second regions, said upper unit having downwardly facing unit terminals in said first region; and

(ii) a lower unit having first and second regions, said lower unit having upwardly facing unit terminals in said first region of said lower unit, said upper unit being disposed over said lower unit with said first regions of said upper and lower units aligned with one another and with said second regions of said upper and lower units aligned with one another; and

(b) an interposer extending between said first regions but not extending between said second regions, said interposer having interposer terminals thereon, at least some of said unit terminals of said upper unit being electrically connected to at least some of said unit terminals of said lower unit through said interposer terminals.

17. An assembly as claimed in claim 16 wherein said interposer has an upwardly-facing top surface and a downwardly-facing bottom surface, said interposer terminals include top interposer terminals exposed at the top surface of the interposer and bottom interposer terminals exposed at the bottom surface of the interposer, at least some of said top and bottom interposer terminals being electrically connected to one another, said unit terminals of said upper unit confronting said top interposer terminals, said unit terminals of said lower unit confronting said bottom interposer terminals.

18. An assembly as claimed in claim 17 further comprising electrically conductive elements extending between the unit terminals of at least one of said units and the interposer terminals confronting such unit terminals.

19. An assembly as claimed in claim 18 wherein said electrically conductive elements include lower conductive elements extending between the unit terminals of the lower unit and the bottom interposer terminals and upper conductive elements extending between the unit terminals of the upper unit and the top interposer terminals.

20. An assembly as claimed in claim 16 wherein said upper unit includes a upper unit substrate having the unit terminals of the upper unit thereon and at least one microelectronic element projecting downwardly from said upper unit substrate in said second region.

21. An assembly as claimed in claim 16 wherein said lower unit includes a lower unit substrate having the unit terminals of the lower unit thereon and at least one microelectronic element projecting upwardly from said unit substrate in said second region.

22. An assembly as claimed in claim 16 further comprising a circuit panel disposed below said lower unit, said stack being mounted to said circuit panel.

23. An assembly as claimed in claim 22 wherein said interposer projects out of said stack above said circuit panel.

24. An assembly as claimed in claim 23 further comprising an additional element mounted to said circuit panel horizontally offset from said stack, said interposer extending to said additional element and electrically connecting said stack and said additional element independently of said circuit panel.

25. A component for use in a microelectronic assembly, said component comprising:

(a) a structure including at least one dielectric element, said support structure having top and bottom surfaces extending in horizontal directions; and

(b) top unit terminals exposed at said top surface and bottom unit terminals exposed at said bottom surface, said top and bottom unit terminals being disposed at column positions such that top and bottom terminals disposed at the same column position are aligned with one another along an axis extending in a vertical direction transverse to said horizontal directions, said terminals including;

(i) a set of A terminals including an A top unit terminal at a first column position and an A bottom unit terminal at a second column position, said A terminals being electrically connected to one another; and

(ii) a set of B terminals including a B top unit terminal at said second column position and a B bottom unit terminal at said first column position, said B terminals being electrically connected to one another but not connected to said A terminals by any element of said substrate.

26. The component as claimed in claim 25 further wherein said vertical direction is perpendicular to said horizontal directions.

27. The component as claimed in claim 25 wherein said support structure includes a unitary dielectric element defining said top and bottom surfaces.

28. The component as claimed in claim 27 further comprising electrically conductive vias extending through said dielectric element, said A terminals being electrically connected to one said via, said B terminals being electrically connected to another said via.

29. The component as claimed in claim 25 wherein said support structure includes a main substrate including a main dielectric element having oppositely directed first and second surfaces and a swap substrate overlying at least a part of said second surface, said swap substrate having a first surface facing toward said main substrate and a second surface facing away from said main substrate, said first surface of said substrate constituting one of said top and bottom surfaces of said structure, said second surface of said swap substrate constituting the other one of said top and bottom surfaces.

30. The component as claimed in claim 29 wherein said swap substrate overlies only a part of said second surface.

31. A microelectronic unit including a component as claimed in claim 25 and a first microelectronic element mounted to said support structure, said first microelectronic element having contact pads electrically connected to at least some of said terminals, said contact pads including an A contact pad electrically connected to said A terminals.

32. The unit as claimed in claim 31 wherein said contact pads include and a B contact pad electrically connected to said B terminals.

33. The unit as claimed in claim 32 wherein said first microelectronic element is adapted to receive input signals through said B contact pad and is adapted to supply output signals through said A contact pad.

34. The unit as claimed in claim 33 wherein said first microelectronic element includes a semiconductor logic element.

35. The unit as claimed in claim 33 wherein said first microelectronic element includes an FPGA.

36. An assembly including first and second units as claimed in claim 31 superposed on one another in a stack with said first unit above said second unit, said bottom B terminal of said first unit being connected to the top A terminal of said second unit, said bottom A terminal of said first unit being connected to said top B terminal of said second unit.

37. An assembly including first, second, third and fourth units as claimed in claim 31 superposed on one another in a stack in numeric order with each lower-numbered unit above the next higher-numbered unit, said bottom B terminal of said first unit being connected to the top A terminal of said second unit, said bottom A terminal of said first unit being connected to said top B terminal of said second unit, said bottom B terminal of said third unit being connected to the top A terminal of said fourth unit, said bottom A terminal of said third unit being connected to said top B terminal of said fourth unit.

38. The assembly as claimed in claim 37 wherein the bottom A and B terminals of said second unit are not electrically connected within said stack to the top A and B terminals of said third unit.

39. The assembly as claimed in claim 37 further comprising a circuit panel extending within said stack between said second and third units, said circuit panel having an upper surface facing said second unit and a lower surface facing said third unit.

40. The assembly as claimed in claim 39 wherein said circuit panel has upper pads exposed at said upper surface of said circuit panel and lower pads exposed at said lower surface of said circuit panel, said upper pads including a first upper pad connected to the bottom B terminal of said second unit, a second upper pad connected to the bottom A terminal of said second unit, said lower pads including a first lower pad connected to the top A terminal of said third unit and a second lower pad connected to the top B terminal of said third unit.

41. The assembly as claimed in claim 40 wherein said top and bottom terminals of each said unit include:

(i) a set of C terminals including a C top unit terminal at a third column position and a C bottom unit terminal at a fourth column position, said C terminals being electrically connected to one another; and

(ii) a set of D terminals including a D top unit terminal at said fourth column position and a D bottom unit terminal at said third column position, said D terminals being electrically connected to one another,

and wherein said upper pads of said circuit panel include a third upper pad connected to the bottom D terminal of said second unit and a fourth upper pad connected to the bottom C terminal of said second unit, said lower pads of said circuit panel including a third lower pad connected to the top C terminal of said third unit and a fourth lower pad connected to the top D terminal of said third unit.

42. The assembly as claimed in claim 41 wherein said upper and lower pads of said circuit panel are connected to one another as follows:

first upper to third lower;

second upper to fourth lower;

third upper to first lower; and

fourth upper to second lower, whereby the A terminals of each said unit are connected to the C terminals of another one of said units.

43. The assembly as claimed in claim 42 wherein said contact pads of said first microelectronic element in each said unit include C contact pads connected to the C terminals of such unit.

44. A microelectronic assembly comprising a plurality of units, each including at least one microelectronic element, each said unit having a top surface, a bottom surface and contacts exposed at said top and bottom surfaces, each said unit defining horizontal directions, said units being superposed on one another to form a stack having a vertical direction and having column positions such that each column position lies at the same horizontal location in each unit, at least some of said contacts on each unit are connected to one another to form conductive paths extending between said units, said conductive paths including at least one group of crossed paths, each said group of crossed paths including a first set of paths and a second set of paths such that in a first part of the stack the first set of paths extends at a first set of column positions and the second set of paths extends at a second set of column positions, whereas in a second part of the stack, above or below the first part of the stack, the first set of paths extends at said second set of column positions and the second set of paths extends at said column positions.

45. A microelectronic assembly comprising a plurality of units, each including at least one microelectronic element, each said unit having a top surface, a bottom surface and contacts exposed at said top and bottom surfaces, each said unit defining horizontal directions, said units being superposed on one another to form a stack having a vertical direction and having column positions such that each column position lies at the same horizontal location in each unit, at least some of said contacts on each unit are connected to one another to form conductive paths extending between said units, said conductive paths including at least one pair of crossed paths, each said pair of crossed paths including a first one of said paths and a second one of said paths, such that in a first part of the stack the first path extends at a first column position and the second path extends at a second column position, whereas in a second part of the stack, above or below the first part of the stack, the first path extends at said second column position and the second path extends at said first column position.

46. The assembly as claimed in claim 45 wherein each said unit includes a structure including at least one dielectric element, said at least one microelectronic element of each said unit being mounted to the structure of such unit, and wherein said terminals of each said unit include top unit terminals exposed at the top surface of the structure of such unit and bottom unit terminals exposed at the bottom surface of the structure of such unit.

47. A microelectronic assembly including:

(a) a plurality of units, each having a structure including at least one dielectric element defining top and bottom surfaces and horizontal directions, each said structure having and terminals disposed at column positions such that each column position denotes a location in said horizontal directions, each said unit including a microelectronic element, the microelectronic elements of said units being substantially identical to one another, each said microelectronic element having contacts, at least some of said contacts being common contacts, at least some of said terminals on each said microelectronic element being common terminals electrically connected to said common contacts, said common terminals being disposed at the same column positions and connected to the same common contacts in each said unit,

(b) a circuit panel having upper and lower surfaces and having horizontal directions, upper pads exposed at said upper surface and lower pads exposed at said lower surface, said pads including common pad pairs, each such common pad pair including one of said upper pads and one of said lower pads, the pads of each such pair being electrically connected to one another and substantially aligned with one another in the horizontal directions of said circuit panel;

said units being superposed on one another in a stack with a lower portion of the stack disposed below said circuit panel and an upper portion of the stack disposed above the circuit panel, the top surfaces of all of said units facing upwardly, said common terminals of all of the units being aligned with one another and with said common pairs of pads, the aligned common terminals and common pairs being connected to one another.

48. A stackable microelectronic unit comprising:

(a) a dielectric element having top and bottom surfaces, a central region, and first and second side regions disposed on opposite sides of said central region,

(b) terminals exposed at said top and bottom surfaces of said dielectric element, said terminals including at least one row of common terminals extending in said central region; and

(c) first and second substantially identical microelectronic elements, each said microelectronic element having a front surface and contacts exposed at said front surface, said contacts including common contacts and unique contacts, said front surface having a first edge, said first microelectronic element being mounted to said dielectric element on a first side of said central region with said front surface facing downwardly and said first edge adjacent said central region, said second microelectronic element being mounted to said dielectric element in said first side region with said front face facing downwardly and with said first edge adjacent said central region, said second microelectronic element being mounted to said dielectric element in said second side region with said front face facing upwardly and with said first edge adjacent said central region, at least some of said common contacts being connected to at least some of said common terminals.

49. A unit as claimed in claim 48 wherein said common contacts of each said microelectronic element are disposed adjacent the first edge of the front surface of such element.

50. A unit as claimed in claim 48 wherein said first microelectronic element overlies said top surface of said dielectric element and said second microelectronic element overlies said bottom surface of said dielectric element.