Soil probe device and method of making same

• US 7,183,779 B2
• Filed: 12/28/2004
• Issued: 02/27/2007
• Est. Priority Date: 12/28/2004
• Status: Active Grant

• Current Assignee: Spectrum Technologies
• Original Assignee: Spectrum Technologies
• Inventors: Hughes, William C.
• Primary Examiner(s): Hirshfeld; Andrew H.
• Assistant Examiner(s): Nguyen; Hoai-An D.
• Application Number:
  US11/025,009
• Publication Number:
  US 20060139037A1
• Time in Patent Office: 791 Days
• Field of Search: 324/696, 324/694, 324/693, 324/691, 324/649, 324/600, 324/437, 324/445, 324/446, 324/715, 324/724, 324/72.5, 324/751, 324/752, 324/754, 324/757, 324/758, 324/690, 324/149, 324/664, 324/688
• US Class Current: 324/696
• CPC Class Codes: G01N 33/246 for water content

Abstract

A device for measuring one or more different properties of soil or a soil-related substance is provided. The device includes a probe that is inserted into the soil or soil-related substance. The probe includes a tip. The tip is electrically insulative and defines apertures. Electrodes are fitted into the apertures. The tip and electrodes are machined together to have a desired shape that is suitable for insertion into a sample. A printed circuit board (“PCB”) is located inside the probe. The electrodes are soldered directly to the PCB in one embodiment. A temperature sensing element is also located in the tip, near the electrodes, and is connected electrically to the PCB.

Claims

1. A probe for a soil media measuring device, the probe comprising:

a housing, the housing having a receiving end;

a tip assembly configured to mount in the receiving end, the tip assembly including;

a tip, the tip having a first end distal to the housing, wherein the tip assembly and the housing are separately formed and configured to be inserted within the soil media;

a plurality of electrodes disposed in the tip at locations spaced at least substantially equally from the first end of the tip and at least substantially equally around the tip, the electrodes enabling a signal indicative of a property of the soil media to be generated with the device;

a temperature sensing element that enables the device to provide temperature compensation; and

wherein the temperature sensing element is disposed within an aperture formed in the tip and is spaced apart at least substantially equally with the electrodes from the end of the tip.

2. The probe of claim 1, wherein the tip includes at least one characteristic selected from the group consisting of being:

(i) conically shaped, (ii) electrically insulative, (iii) of a machinable material, and (iv) of a material having a relatively low coefficient of friction.

3. The probe of claim 1, which includes a plurality of electrode pairs, one electrode of each pair being a ground electrode and one electrode of each pair being a signal electrode.

4. The probe of claim 3, wherein the ground and signal electrodes are spaced apart alternatingly about the tip.

5. The probe of claim 1, wherein the electrodes are made of a material having at least one quality selected from the group consisting of being solderable and being relatively non-corrosive.

6. The probe of claim 1, wherein the signal is indicative of a conductivity of the soil media.

7. The probe of claim 1, wherein the soil media is of at least one type selected from the group consisting of potting soil, bedding soil, cultural soil, compost, a fertilizer, a fertilization mixture, irrigation water, land reclamation soil and sand.

8. The probe of claim 1, wherein the temperature sensing element is coupled to a printed circuit board, and the electrodes are placed in electrical communication with traces on the printed circuit board.

9. The probe of claim 8, wherein the electrodes are coupled directly to the traces.

10. The probe of claim 8, wherein at least one of the traces is located on a first side of the printed circuit board and at least one of the traces is located on a second side of the printed circuit board.

11. The probe of claim 1, which is combined with a force sensor.

12. A probe for a soil media measuring device, the probe comprising:

a housing;

a tip assembly, the tip assembly configured to be carried by the housing, the tip assembly configured to include;

a tip having a tapered end, wherein the tip assembly and the housing are separately formed and configured to be inserted within the soil media;

a plurality of electrodes disposed within the tip, each of the plurality of radially arrayed substantially equally around the tapered end;

a temperature sensing element that enables the device to provide temperature compensation;

wherein the temperature sensing element is disposed within an aperture formed in the tip and is spaced apart at least substantially equally with the electrodes from the end of the tip; and

a printed circuit board (“

PCB”

) placed within the housing, the PCB including conductive traces, the electrodes placed in electrical communication with the traces.

13. The probe of claim 12, wherein the temperature sensing element is connected electrically to the PCB.

14. The probe of claim 12, wherein the housing is at least filled partially with an epoxy.

15. A soil media device comprising:

a meter;

electronic circuitry coupled operably with the meter; and

a probe, the probe including;

a housing having a first end in electrical communication with the meter and a second end disposed distal to the meter;

a tip located at the second end of the housing, the housing and the tip separately formed and configured for insertion within the soil media;

a plurality of electrodes secured to the tip at locations spaced at least substantially equally from an end of the tip, the electrodes enabling a signal indicative of a property of the soil media to be generated with the circuitry;

a temperature sensing element that enables the device to provide temperature compensation; and

wherein the temperature sensing element is disposed within an aperture formed in the tip and is spaced apart at least substantially equally with the electrodes from the end of the tip.

16. The soil media device of claim 15, wherein the meter displays units indicating a soil media property selected from the group consisting of conductivity and temperature.

17. The soil media device of claim 15, wherein the soil media is of at least one type selected from the group consisting of potting soil, bedding soil, cultural soil, compost, a fertilizer, a fertilization mixture, irrigation water, land reclamation soil and sand.

19. The method of claim 17, wherein forming the plurality of electrodes include machining the desired shape of the tip with the plurality of electrode disposed therein.

18. A method of manufacturing a probe for a soil media measuring device, the method comprising:

providing a housing having a receiving end;

providing a tip assembly configured to mount in the receiving end;

providing a tip having a first end distal to the housing, wherein the tip assembly and the housing are separately formed and configured to be inserted within the soil media;

forming a plurality of electrodes within the tip at locations spaced at least substantially equally from the first end of the tip and at least substantially equally around the tip, and configuring the electrodes to provide a signal indicative of a property of the soil media;

forming an aperture within the tip; and

inserting a temperature sensing element that enables the device to provide temperature compensation, wherein the temperature sensing element is disposed within the aperture and is spaced apart at least substantially equally with the electrodes from the end of the tip.

20. The method of claim 18, wherein machining includes lathe-cutting an insulative material and the plurality of electrodes.