Direct application voltage variable material, devices employing same and methods of manufacturing such devices
First Claim
1. A circuit carrier comprising:
- a first insulating layer;
a second insulating layer;
first and second electrodes positioned between the first and second insulating layers and separated from each other by a gap, wherein at least one of the electrodes is provided on one of the first and second insulating layers; and
a voltage variable material (“
VVM”
) that protects against an electrostatic discharge (“
ESD”
) event, the VVM located in the gap between the first and second insulating layers and contacting the first and second electrodes, wherein at least one of the insulating layers has a minimum thickness for preventing energy from the ESD event from traveling across the thickness that is determined by and greater than or equal to (i) an ESD magnitude rating divided by (ii) a dielectric strength of the at least one insulating layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A voltage variable material (“VVM”) including an insulative binder that is formulated to intrinsically adhere to conductive and non-conductive surfaces is provided. The binder and thus the VVM is self-curable and applicable in a spreadable form that dries before use. The binder eliminates the need to place the VVM in a separate device or to provide separate printed circuit board pads on which to electrically connect the VVM. The binder and thus the VVM can be directly applied to many different types of substrates, such as a rigid FR-4 laminate, a polyimide, a polymer or a multilayer PCB via a process such as screen or stencil printing. In one embodiment, the VVM includes two types of conductive particles, one with a core and one without a core. The VVM can also have core-shell type semiconductive particles.
247 Citations
30 Claims
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1. A circuit carrier comprising:
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a first insulating layer; a second insulating layer; first and second electrodes positioned between the first and second insulating layers and separated from each other by a gap, wherein at least one of the electrodes is provided on one of the first and second insulating layers; and a voltage variable material (“
VVM”
) that protects against an electrostatic discharge (“
ESD”
) event, the VVM located in the gap between the first and second insulating layers and contacting the first and second electrodes, wherein at least one of the insulating layers has a minimum thickness for preventing energy from the ESD event from traveling across the thickness that is determined by and greater than or equal to (i) an ESD magnitude rating divided by (ii) a dielectric strength of the at least one insulating layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A method of manufacturing a circuit carrier comprising the steps of:
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(a) providing a first electrode on a first insulating layer; (b) providing a second electrode on the first insulation layer and spacing the first and second electrodes apart to form a gap between the electrodes; (c) screen printing/stenciling a layer of voltage variable material (“
VVM”
) that protects against an electrostatic discharge event into the gap so as to contact the first and second electrodes; and(d) providing a second insulating layer over at least a portion of the electrodes and the VVM so that the second insulating layer has a minimum thickness for preventing energy from the electrostatic discharge event from traveling across the thickness that is greater than or equal to (i) an electrostatic discharge (“
ESD”
) magnitude rating divided by (ii) a dielectric strength of the second insulating layer. - View Dependent Claims (21, 22, 23)
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24. A method of manufacturing a circuit carrier comprising the steps of:
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(a) providing a first electrode on a first insulating layer; (b) providing a second electrode on the first insulation layer and spacing the first and second electrodes apart to form a gap between the electrodes; (c) using an apparatus that holds and stores voltage variable material (“
VVM”
) that protects against an electrostatic discharge event under pressure to dispense the VVM into the gap so as to contact the first and second electrodes; and(d) providing a second insulating layer over at least a portion of the electrodes and the VVM so that the second insulating layer has a minimum thickness for preventing energy from the electrostatic discharge event from traveling across the thickness that is greater than or equal to (i) an electrostatic discharge (“
ESD”
) magnitude rating of the VVM divided by (ii) a dielectric strength of the second insulating layer. - View Dependent Claims (25, 26, 27, 28, 29, 30)
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Specification