Plasma enhanced ALD of tantalum nitride and bilayer
First Claim
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1. A method for forming a bilayer of tantalum nitride and tantalum on a substrate, the method comprising:
- depositing a first layer on the substrate by plasma enhanced atomic layer deposition of a tantalum halide precursor in the presence of a plasma containing hydrogen and nitrogen;
wherein the depositing comprises;
a. exposing the substrate to the tantalum halide carried by an inert gas;
b. exposing the substrate to the plasma; and
c. repeating a. and b. approximately 40–
800 times until a desired thickness of the first layer is obtained; and
depositing a second layer by continuing plasma enhanced atomic layer deposition of a tantalum halide precursor in the presence of a plasma by reducing concentration of nitrogen in the plasma to zero so that a substantially nitrogen free second layer of amorphous tantalum is formed.
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Abstract
A method to deposit TaN by plasma enhanced layer with various nitrogen content. Using a mixture of hydrogen and nitrogen plasma, the nitrogen content in the film can be controlled from 0 to N/Ta=1.7. By turning off the nitrogen flow during deposition of TaN, a TaN/Ta bilayer is easily grown, which has copper diffusion barrier properties superior to those of a single Ta layer or a single TaN layer.
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15 Claims
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1. A method for forming a bilayer of tantalum nitride and tantalum on a substrate, the method comprising:
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depositing a first layer on the substrate by plasma enhanced atomic layer deposition of a tantalum halide precursor in the presence of a plasma containing hydrogen and nitrogen;
wherein the depositing comprises;a. exposing the substrate to the tantalum halide carried by an inert gas; b. exposing the substrate to the plasma; and c. repeating a. and b. approximately 40–
800 times until a desired thickness of the first layer is obtained; anddepositing a second layer by continuing plasma enhanced atomic layer deposition of a tantalum halide precursor in the presence of a plasma by reducing concentration of nitrogen in the plasma to zero so that a substantially nitrogen free second layer of amorphous tantalum is formed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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Specification