Light emitting diodes (LEDs) with improved light extraction by roughening
First Claim
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1. A method of fabricating a semiconductor light emitting diode (LED) device, comprising:
- forming an n-gallium nitride (n-GaN) layer on the LED device; and
roughening the surface of the n-GaN layer, via a photoelectrochemical (PEC) oxidation and etching method, to form non-ordered textured surfaces to enhance light extraction from an interior of the LED device;
wherein,the oxidation and etching is performed in a system with;
an aqueous solution, an illumination system, and an electrical biased system,the aqueous solution comprises a combination of an oxidizing agent and either acid or alkaline solutions, andthe oxidizing agent comprises one or the combination of H2O2, K2S2O8.
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Abstract
Systems and methods are disclosed for fabricating a semiconductor light emitting diode (LED) device by forming an n-gallium nitride (n-GaN) layer on the LED device; and roughening the surface of the n-GaN layer to extract light from an interior of the LED device.
111 Citations
18 Claims
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1. A method of fabricating a semiconductor light emitting diode (LED) device, comprising:
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forming an n-gallium nitride (n-GaN) layer on the LED device; and roughening the surface of the n-GaN layer, via a photoelectrochemical (PEC) oxidation and etching method, to form non-ordered textured surfaces to enhance light extraction from an interior of the LED device; wherein, the oxidation and etching is performed in a system with;
an aqueous solution, an illumination system, and an electrical biased system,the aqueous solution comprises a combination of an oxidizing agent and either acid or alkaline solutions, and the oxidizing agent comprises one or the combination of H2O2, K2S2O8. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of roughening an exposed n-GaN of an n-side up LED wafer, the method comprising:
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depositing an n-GaN portion above a carrier substrate; depositing active layers above the n-GaN portion; depositing a p-GaN portion above the active layers; depositing one or more first metal layers; applying a masking layer; etching the first metal layers, the p-GaN portion, the active layers, and the n-GaN portion; removing the masking layer; depositing a passivation layer; removing a portion of the passivation layer on top of the p-GaN portion to expose the first metal layers; depositing one or more second metal layers; depositing a metal substrate; removing the carrier substrate to expose the n-GaN portion; and roughening the n-GaN portion. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification