Singulation method used in image sensor packaging process and support for use therein

• US 7,186,587 B2
• Filed: 09/20/2004
• Issued: 03/06/2007
• Est. Priority Date: 09/20/2004
• Status: Active Grant

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Yang, JunYoung, Kim, InHo
• Primary Examiner(s): Smith; Zandra V.
• Assistant Examiner(s): DUONG, KHANH B
• Application Number:
  US10/944,197
• Publication Number:
  US 20060063357A1
• Time in Patent Office: 897 Days
• Field of Search: None
• US Class Current: 438/110
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A singulation method used in a process for making a plurality of image sensor packages is disclosed. Firstly, a semi-finished product including a plurality of package structures formed on a substrate is placed on a support having a plurality of cavities for receiving the package structures. Then, the semi-finished product is sawed into separate image sensor packages. During the sawing step, the air pressure in the cavities is decreased to create suction within the cavities such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support whereby the package structures are positioned precisely and clamped in place with the support during the sawing step.

Claims

1. A singulation method used in a process for making a plurality of image sensor packages, the singulation method comprising the following steps:

providing a semi-finished product including a plurality of package structures formed on a substrate, wherein each of the package structures comprises a housing formed on the substrate, an image sensor chip disposed within the housing and electrically coupled to the substrate, and a transparent component supported by the housing;

placing the semi-finished product on a support having a plurality of cavities such that the package structures are respectively received in the cavities of the support; and

simultaneously sawing the semi-finished product into separate image sensor packages and decreasing the air pressure in the cavities to create suction within the cavities such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support.

2. The method as claimed in claim 1, wherein:

the substrate has a plurality of sawing streets between the package structures,

the support has a plurality of slots between the cavities,

the cutting streets of the substrate faces the slots of the support when the semi-finished product is placed on the support,

the semi-finished product are sawed into separate image sensor packages along the sawing streets, and

the method further comprises a step of decreasing the air pressure in the slots to remove sawing debris during the sawing step.

3. The method as claimed in claim 1, further comprising a step of removing sawing debris during the sawing step by an air gun or a blower.

4. The method as claimed in claim 1, wherein the cavities of the support are arranged in rows and columns.

5. The method as claimed in claim 1, wherein the sawing step is conducted by a high speed steel sawing tool or a solid carbide sawing tool.

6. The method as claimed in claim 1, wherein the substrate is selected from a group consisting of a liquid crystal polymer (LCP) substrate, a thermoplastic substrate, an alumina-based ceramic substrate, a printed circuit board, a plastic glass laminated substrate, and a tape-based substrate.

7. A singulation method used in a process for making a plurality of image sensor packages, the singulation method comprising the following steps:

providing a semi-finished product including a plurality of package structures formed on a substrate, wherein each of the package structures comprises a housing formed on the substrate, an image sensor chip disposed within the housing and electrically coupled to the substrate, and a transparent component supported by the housing;

providing a support having a plurality of cavities and a plurality of first slots between the cavities;

placing the semi-finished product on the support such that the package structures are respectively received in the cavities of the support;

simultaneously sawing the semi-finished product into separate image sensor packages and decreasing the air pressure in the first slots to create suction within the first slots such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support whereby the package structures are positioned precisely and clamped in place with the support during the sawing step.

8. The method as claimed in claim 7, wherein:

the substrate has a plurality of sawing streets between the package structures,

the support has a plurality of second slots between the cavities,

the cutting streets of the substrate faces the second slots of the support when the semi-finished product is placed on the support,

the semi-finished product are sawed into separate image sensor packages along the sawing streets, and

the method further comprises a step of decreasing the air pressure in the second slots to remove sawing debris during the sawing step.

9. The method as claimed in claim 7, further comprising a step of removing sawing debris during the sawing step by an air gun or a blower.

10. The method as claimed in claim 7, wherein the cavities of the support are arranged in rows and columns.

11. The method as claimed in claim 7, wherein the sawing step is conducted by a high speed steel sawing tool or a solid carbide sawing tool.

12. The method as claimed in claim 7, wherein the substrate is selected from a group consisting of a liquid crystal polymer (LCP) substrate, a thermoplastic substrate, an alumina-based ceramic substrate, a printed circuit board, a plastic glass laminated substrate, and a tape-based substrate.