Barrier first method for single damascene trench applications

• US 7,186,648 B1
• Filed: 03/18/2004
• Issued: 03/06/2007
• Est. Priority Date: 03/13/2001
• Status: Expired due to Term

• Current Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Original Assignee: Novellus Systems Incorporated (Lam Research Corporation)
• Inventors: Danek, Michal, Rozbicki, Robert
• Primary Examiner(s): Lebentritt; Michael
• Assistant Examiner(s): STEVENSON, ANDRE C
• Application Number:
  US10/804,353
• Time in Patent Office: 1,083 Days
• Field of Search: 438/627, 438/687
• US Class Current: 438/687
• CPC Class Codes: H01L 21/2855 by physical means, e.g. sputtering, evaporation H01L21/28518 - H01L21/28537 and H01L21/28568 take precedence
• CPC Class Codes: H01L 21/76805 the opening being a via or contact hole penetrating the underlying conductor
• CPC Class Codes: H01L 21/76814 post-treatment or after-treatment, e.g. cleaning or removal of oxides on underlying conductors
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76844 Bottomless liners
• CPC Class Codes: H01L 21/76865 Selective removal of parts of the layer H01L21/76844 takes precedence

Abstract

Methods for forming a diffusion barrier on low aspect features of an integrated circuit include at least three operations. The first operation deposits a barrier material and simultaneously etches a portion of an underlying metal at the bottoms of recessed features of the integrated circuit. The second operation deposits barrier material to provide some minimal coverage over the bottoms of the recessed features. The third operation deposits a metal conductive layer. Controlled etching is used to selectively remove barrier material from the bottom of the recessed features, either completely or partially, thus reducing the resistance of subsequently formed metal interconnects.

Claims

1. A method for depositing a diffusion barrier and a metal conductive layer for metal interconnects on a substrate, the method comprising:

(a) etching the bottoms of recessed features on a surface of the substrate to clean at least part of an underlying metal while simultaneously depositing a first portion of a diffusion barrier on at least sidewalls of recessed features wherein depositing a first portion of a diffusion barrier comprises sputtering metal from a target;

(b) after depositing the first portion of the diffusion barrier, depositing a second portion of the diffusion barrier, which covers at least the bottoms of the recessed features; and

(c) depositing the metal conductive layer over the surface of the substrate.

2. The method of claim 1, wherein the method does not employ a precleaning operation prior to (a).

3. The method of claim 1, further comprising, after (b) and prior to (c), etching the second portion of the diffusion barrier at least at the bottoms of the recessed features without exposing an underlying metal.

4. The method of claim 1, further comprising performing a degas operation prior to (a).

5. The method of claim 1, wherein at least some of the recessed features have aspect ratios of not greater than about 2.

6. The method of claim 1, wherein the recessed features are trenches of a single Damascene structure.

7. The method of claim 1, wherein at least operations (a) and (b) are performed in the same processing chamber.

8. The method of claim 7, wherein the processing chamber is a plasma physical vapor deposition (PVD) chamber.

9. The method of claim 7, wherein the processing chamber comprises a hollow cathode magnetron.

10. The method of claim 4, wherein the substrate is degassed by heating the substrate to between about 150 to 400 degrees Celsius.

11. The method of claim 1, wherein (a) comprised etching the bottoms of recessed features to a depth of about 20 to 100 Angstroms into the underlying metal.

12. The method of claim 1, wherein (a) comprises etching under conditions producing an etch-to-deposition ratio ranging between about 1 and 1.5 in field regions of the substrate and an etch-to-deposition ratio ranging between about 1.1 and 3 in the bottoms of the recessed features.

13. The method of claim 1, wherein (a) comprises depositing the first portion of diffusion barrier elsewhere on the substrate to a thickness of between about 10 and 100 Angstroms on field regions of the substrate and sidewalls of the recessed features.

14. The method of claim 1, wherein (b) comprises depositing the second portion of diffusion barrier to a thickness of at least about 5 Angstroms on the bottoms of the recessed features.

15. The method of claim 1, wherein (a) comprises sputtering a meal from a target having an applied DC power of between about 1 and 10 kW and biasing the substrate with about 200 to 2000 W of RF power.

16. The method of claim 1, wherein (b) comprises using chemical vapor deposition (CVD), physical vapor deposition (PVD), atomic layer deposition (ALD), or pulsed deposition layer (PDL).

17. The method of claim 1, wherein at least one portion of the diffusion barrier comprises a material selected from the group consisting of tantalum, nitrogen-doped tantalum, tantalum nitride, titanium nitride, tungsten nitride, ruthenium, and silicon containing versions of any of these.

18. The method of claim 1, wherein (a) comprises sputtering a metal from a target having an applied DC power of between about 1 and 30 kW, while applying a bias to the substrate.

19. The method of claim 18, wherein the bias comprises RF power of between about 100 and 2000 W.

20. The method of claim 18, wherein (a) further comprises passing argon gas through the process chamber at a flow rate of between about 10 and 300 sccm.

21. The method of claim 1, wherein the metal conductive layer of (c) comprises copper.

22. The method of claim 21, wherein the metal conductive layer is a copper seed layer.

23. A method of claim 1, further comprising, prior to (a), depositing a portion of the diffusion barrier on the surface of the partially fabricated integrated circuit such that the sidewalls of the recessed features have a diffusion barrier thickness of between about 5 and 100 Angstroms.