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Process monitor for laser and plasma materials processing of materials

  • US 7,186,947 B2
  • Filed: 03/31/2003
  • Issued: 03/06/2007
  • Est. Priority Date: 03/31/2003
  • Status: Expired due to Fees
First Claim
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1. A method for monitoring the processing of a workpiece, the method comprising the steps of:

  • directing an incident laser beam onto a workpiece;

    measuring at least one signal emitted from said workpiece in response to the incident laser beam at an optical detector, said detector generating two outputs based on said at least one signal; and

    determining whether a condition of the processing of the workpiece is an overcombustion cutting condition or a non-penetrating cutting condition based on a ratio of said two outputs and a magnitude of at least one of said two outputs.

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