Process monitor for laser and plasma materials processing of materials
First Claim
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1. A method for monitoring the processing of a workpiece, the method comprising the steps of:
- directing an incident laser beam onto a workpiece;
measuring at least one signal emitted from said workpiece in response to the incident laser beam at an optical detector, said detector generating two outputs based on said at least one signal; and
determining whether a condition of the processing of the workpiece is an overcombustion cutting condition or a non-penetrating cutting condition based on a ratio of said two outputs and a magnitude of at least one of said two outputs.
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Abstract
A method for monitoring the processing of a workpiece includes directing an incident laser beam onto the workpiece and measuring a signal emitted from the workpiece. At least two signals are generated by a detector based upon the emitted signal. A workpiece processing quality is determined based upon the ratio of the two output signals and a magnitude of one of the two outputs.
113 Citations
26 Claims
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1. A method for monitoring the processing of a workpiece, the method comprising the steps of:
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directing an incident laser beam onto a workpiece; measuring at least one signal emitted from said workpiece in response to the incident laser beam at an optical detector, said detector generating two outputs based on said at least one signal; and determining whether a condition of the processing of the workpiece is an overcombustion cutting condition or a non-penetrating cutting condition based on a ratio of said two outputs and a magnitude of at least one of said two outputs. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification