Manufacturing method for magnetic sensor and lead frame therefor

• US 7,187,063 B2
• Filed: 07/28/2003
• Issued: 03/06/2007
• Est. Priority Date: 07/29/2002
• Status: Expired due to Fees

• Current Assignee: Yamaha Corporation
• Original Assignee: Yamaha Corporation
• Inventors: Shirasaka, Kenichi, Adachi, Hiroshi, Sato, Hideki, Omura, Masayoshi, Saitoh, Hiroshi
• Primary Examiner(s): Potter; Roy Karl
• Application Number:
  US10/627,717
• Publication Number:
  US 20040103530A1
• Time in Patent Office: 1,317 Days
• Field of Search: 257/666, 257/676, 257/723
• US Class Current: 257/666
• CPC Class Codes: G01C 17/30 Earth-inductor compasses
• CPC Class Codes: G01R 33/0206 Three-component magnetometers
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01051 : Antimony [Sb]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: Y10T 29/49121 : Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49174 : Assembling terminal to elongated conductor

Abstract

A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon plastic deformation of the interconnecting members. When the frame is held in a metal mold and the stages are pressed, the interconnecting members are elastically deformed, so that the magnetic sensor chips are bonded onto the stages placed substantially in the same plane and are then wired with the leads. Thereafter, the stages are released from pressure, so that the interconnecting members are restored from the elastically deformed states thereof. When the magnetic sensor chips are combined together to realize three sensing directions, it is possible to accurately measure three-dimensional bearings of magnetism, and the magnetic sensor can be reduced in dimensions and manufactured with a reduced cost therefor.

Claims

1. A lead frame made of a thin metal plate, comprising:

at least two stages;

a frame having a plurality of leads, which is arranged so as to encompass the stages; and

a plurality of interconnecting members having elastically deforming abilities, which are integrally combined together with the frame and are arranged so as to interconnect together the stages and the frame;

wherein the plurality of interconnecting members contain a plurality of corner leads for supporting the stages and a central lead having a specific structure that is arranged between the stages so as to mutually interconnect together the stages.

5. A lead frame according to claim 1, wherein easy-to-deform portions that can be elastically deformed when pressed are formed in the corner leads, and bent portions that can be bent by plastic deformation are formed at ends of the corner leads in proximity to the stages and are formed at selected positions of the central lead in proximity to the stages.

6. A lead frame according to claim 5, further comprising a plurality of projecting portions that are projected from the stages towards the frame and that are engaged with specifically designed leads, which are projected from the frame towards the stages.

7. A lead frame according to claim 5, wherein projections are formed at selected positions of the central lead arranged between the stages.

2. A lead frame made of a thin metal plate, comprising:

at least two stages;

a frame having a plurality of leads, which is arranged so as to encompass the stages; and

a plurality of interconnecting members having elastically deforming abilities, which are integrally combined together with the frame and are arranged so as to interconnect together the stages and the frame;

further comprising a plurality of first protecting portions that are protected from the stages towards the frame, and a plurality of second protecting portions that are protected from the leads towards the stages, wherein each of the first protecting portions is engaged with each of the second projecting portions in a thickness direction of the thin metal plate;

wherein the interconnecting members include easy-to-deform portions that can be elastically deformed when pressed, and bent portions that can be bent by plastic deformation.

4. A lead frame according to claim 2, wherein the first projecting portion has a projection and the second projecting portion has a hollow portion, so that the first and second projecting portions partially overlap each other when the projection is engaged with the hollow portion.

3. A lead frame made of a thin metal plate, comprising:

at least two stages;

a frame having a plurality of leads, which is arranged so as to encompass the stages; and

a plurality of interconnecting members having elastically deforming abilities, which are integrally combined together with the frame and are arranged so as to interconnect together the stages and the frame;

wherein easy-to-deform portions that can be elastically deformed when pressed are formed in the interconnecting members, and wherein pressing members that are projected from the leads towards the stages are formed so as to press the stages in a thickness direction of the thin metal plate.

8. A lead frame made of a thin metal plate, comprising:

at least two stages;

a frame having a plurality of leads encompassing the stages;

a plurality of interconnecting members for interconnecting the stages with the frame, wherein the interconnecting member has a distorted portion that is subjected to plastic deformation and/or elastic deformation; and

a plurality of projecting elements that are projected upwardly or downwardly from the stages respectively.

9. A lead frame according to claim 8, wherein each of the stages is interconnected with a pair of projecting elements that are elongated from the interconnecting members via the distorted portions.

10. A lead frame made of a thin metal plate, comprising:

at least two stages;

a frame having a plurality of leads arranged so as to encompass the stages; and

a plurality of interconnecting members for interconnecting the stages with the frame, wherein the interconnecting members have bent portions that are arranged in proximity to the stages respectively and that can be bent upon plastic deformation and/or elastic deformation.

11. A lead frame made of a thin metal plate, comprising:

at least two stages;

a frame having a plurality of leads arranged so as to encompass the stages;

a plurality of interconnecting members for interconnecting the stages with the frame; and

at least one stage interconnecting member for mutually interconnecting the stages together, wherein the stage interconnecting member is shaped so as to allow plastic deformation.

12. A lead frame according to claim 11, wherein the stage interconnecting member has a zigzag shape by which the stages are interconnected together.

13. A lead frame according to claim 11, wherein a pair of stage interconnecting members each having reduced dimensions are arranged so as to interconnect together both side ends of the stages.