Wiring test structures for determining open and short circuits in semiconductor devices

• US 7,187,179 B1
• Filed: 10/19/2005
• Issued: 03/06/2007
• Est. Priority Date: 10/19/2005
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Scaman, Michael E., Yanagisawa, Toshiaki
• Primary Examiner(s): Hirshfeld; Andrew
• Assistant Examiner(s): Valone; Thomas F.
• Application Number:
  US11/163,450
• Time in Patent Office: 503 Days
• Field of Search: 324/512, 324/751, 324/765, 324/763, 257/48, 257/18, 257/751, 438/14, 438/17, 438/18
• US Class Current: 324/512
• CPC Class Codes: G01R 31/2853 Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections G01R31/31717 takes precedence; test of chip-to-PCB or lead-to-PCB connections G01R31/66
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A wiring test structure includes a plurality of wiring traces configured in an interleaving spiral pattern. At least one of the plurality of wiring traces configured for open circuit testing therein, and at least a pair of the plurality of wiring traces is configured for short circuit testing therebetween.

Claims

1. A wiring test structure, comprising:

a plurality of wiring traces configured in a spiral pattern, with at least one of said plurality of wiring traces configured for open circuit testing therein, and at least a pair of said plurality of wiring traces configured for short circuit testing therebetween;

a first wiring plane containing said plurality of spiral pattern traces;

a second wiring plane having at least one conductive trace connected to at least one of said plurality of spiral pattern traces through at least one via;

a first wiring path, said first wiring path including a first probe pad within said first wiring plane, a first of said spiral pattern traces, a first via, a first conductive trace in said second wiring plane, and a third probe pad in said second wiring plane; and

a second wiring path, said second wiring path including a second probe pad within said first wiring plane, a second of said spiral pattern traces, a second via, a second conductive trace in said second wiring plane, and a fourth probe pad in said second wiring plane.

2. The wiring test structure of claim 1, wherein each of said plurality of wiring traces are configured to spiral in an inward direction to a central location from a corresponding probe pad connected thereto.

3. The wring test structure of claim 2, wherein said plurality of wiring traces spiral inward at right angles.

4. A wiring test structure, comprising:

a plurality of wiring traces configured in a spiral pattern, with at least one of said plurality of wiring traces configured for open circuit testing therein, and at least a pair of said plurality of wiring traces configured for short circuit testing therebetween;

a first wiring path, said first wiring path including a first probe pad, a first of said spiral pattern traces and a second probe pad, said first spiral pattern trace being interleaved with itself;

a second wiring path, said second wiring path including a third probe pad and a second of said spiral pattern traces; and

a third wiring path, said third wiring path including a fourth probe pad and a third of said spiral pattern traces;

each of said first, second and third wiring paths formed in a single wiring plane.

5. The wiring test structure of claim 4, wherein:

each of said spiral pattern traces is configured for short circuit testing with respect to an adjacent trace thereto; and

said first wiring path is configured for open circuit testing therein.

11. The wiring test structure of claim 4, wherein each of said plurality of wiring traces are configured to spiral in an inward direction to a central location from a corresponding probe pad connected thereto.

12. The wiring test structure of claim 11, wherein said plurality of wiring traces spiral inward at right angles.

6. A method for forming a wiring test structure, the method comprising:

forming a plurality of wiring traces in a spiral pattern, configuring at least one of said plurality of wiring traces for open circuit testing therein, and configuring at least a pair of said plurality of wiring traces for short circuit testing therebetween;

a first wiring plane containing said plurality of spiral pattern traces;

a second wiring plane having at least one conductive trace connected to at least one of said plurality of spiral pattern traces through at least one via;

configuring a first wiring path, said first wiring path including a first probe pad within said first wiring plane, a first of said spiral pattern traces, a first via, a first conductive trace in said second wiring plane, and a third probe pad in said second wiring plane; and

configuring a second wiring path, said second wiring path including a second probe pad within said first wiring plane, a second of said spiral pattern traces, a second via, a second conductive trace in said second wiring plane, and a fourth probe pad in said second wiring plane.

7. The method of claim 6, wherein each of said plurality of wiring traces are configured to spiral at right angles in an inward direction to a central location from a corresponding probe pad connected thereto.

8. The method of claim 7, wherein said plurality of wiring traces are formed using an alternating phase shift modulation (ALT-PSM) mask.

10. The method of claim 6, wherein said plurality of spiral pattern traces are further configured for at least one of resistance measurements and capacitance measurements in the absence of open circuits and short circuits therein.

9. A method for forming a wiring test structure, the method comprising:

forming a plurality of wiring traces in a spiral pattern, configuring at least one of said plurality of wiring traces for open circuit testing therein, and configuring at least a pair of said plurality of wiring traces for short circuit testing therebetween;

configuring a first wiring path, said first wiring path including a first probe pad, a first of said spiral pattern traces, and a second probe pad, said first spiral pattern trace being interleaved with itself;

configuring a second wiring path, said second wiring path including a third probe pad and a second of said spiral pattern traces; and

configuring a third wiring path, said third wiring path including a fourth probe pad and a third of said spiral pattern traces;

each of said first, second and third wiring paths formed in a single wiring plane;

wherein each of said spiral pattern traces is configured for short circuit testing with respect to an adjacent trace thereto and said first wiring path is configured for open circuit testing therein.

13. The method of claim 9, wherein each of said plurality of wiring traces are configured to spiral at right angles in an inward direction to a central location from a corresponding probe pad connected thereto.