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Wiring test structures for determining open and short circuits in semiconductor devices

  • US 7,187,179 B1
  • Filed: 10/19/2005
  • Issued: 03/06/2007
  • Est. Priority Date: 10/19/2005
  • Status: Expired due to Fees
First Claim
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1. A wiring test structure, comprising:

  • a plurality of wiring traces configured in a spiral pattern, with at least one of said plurality of wiring traces configured for open circuit testing therein, and at least a pair of said plurality of wiring traces configured for short circuit testing therebetween;

    a first wiring plane containing said plurality of spiral pattern traces;

    a second wiring plane having at least one conductive trace connected to at least one of said plurality of spiral pattern traces through at least one via;

    a first wiring path, said first wiring path including a first probe pad within said first wiring plane, a first of said spiral pattern traces, a first via, a first conductive trace in said second wiring plane, and a third probe pad in said second wiring plane; and

    a second wiring path, said second wiring path including a second probe pad within said first wiring plane, a second of said spiral pattern traces, a second via, a second conductive trace in said second wiring plane, and a fourth probe pad in said second wiring plane.

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