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RF package

  • US 7,187,256 B2
  • Filed: 02/19/2004
  • Issued: 03/06/2007
  • Est. Priority Date: 02/19/2004
  • Status: Active Grant
First Claim
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1. A package comprising:

  • a substrate including an upper surface ground plane connected to a lower surface ground plane by vias through the substrate;

    a die located on the upper ground plane and including a die pad;

    a transmission path including;

    on the upper surface of the substrate, a bonding pad connected to a first transmission line itself connected to a transition pad andon the lower surface of the substrate, a second transmission line connected to the transition pad by a via through the substrate;

    a wire bond extending from the bonding pad to the die pad;

    a portion of the upper surface ground plane and the lower surface ground plane connected by vias defining opposing walls on either side of the transmission path for signal isolation; and

    a low pass filter for compensating wire bond inductance, the filter including;

    a first capacitance formed between the bonding pad and at least the lower surface ground plane,the wire bond inductance, anda second capacitance formed between the die pad and at least the upper surface ground plane.

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