Printhead chip that incorporates nozzle chamber reduction mechanisms

• US 7,188,933 B2
• Filed: 01/03/2005
• Issued: 03/13/2007
• Est. Priority Date: 06/09/1998
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia, McAvoy, Gregory John
• Primary Examiner(s): Do; An H.
• Application Number:
  US11/026,136
• Publication Number:
  US 20050116993A1
• Time in Patent Office: 799 Days
• Field of Search: 347/54, 347/56, 347/65
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14 Structure thereof only for on-demand ink jet heads
• CPC Class Codes: B41J 2/1433 Structure of nozzle plates
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/16 Production of nozzles
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/17596 Ink pumps, ink valves
• CPC Class Codes: B41J 2002/041 Electromagnetic transducer
• CPC Class Codes: B41J 2002/14346 Ejection by pressure produced by thermal deformation of ink chamber, e.g. buckling
• CPC Class Codes: B41J 2002/14435 Moving nozzle made of thermal bend detached actuator
• CPC Class Codes: B41J 2002/14475 characterised by nozzle shapes or number of orifices per chamber
• CPC Class Codes: B41J 2202/15 Moving nozzle or nozzle plate
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49156 : with selective destruction of conductive paths
• CPC Class Codes: Y10T 29/49401 : Fluid pattern dispersing device making, e.g., ink jet

Abstract

A printhead chip includes a substrate that incorporates a drive circuitry layer and defines a plurality of nozzle chambers and respective ink supply channels in fluid communication with the nozzle chambers. A plurality of nozzles is positioned on the substrate to be in fluid communication with respective nozzle chambers. A plurality of actuators is connected to the drive circuitry layer and is reciprocally displaceable with respect to the substrate on receipt of an electrical signal from the drive circuitry layer. At least one actuator is associated with each respective nozzle chamber. The actuators are positioned so that reciprocal displacement of each actuator results in reduction and subsequent enlargement of each respective nozzle chamber to eject ink drops from the respective nozzles.

Claims

1. A printhead integrated circuit which comprises

a substrate that incorporates a drive circuitry layer and defines a plurality of nozzle chambers and respective ink supply channels in fluid communication with the nozzle chambers;

a plurality of ink ejection nozzles positioned on the substrate to be in fluid communication with respective nozzle chambers; and

a plurality of thermal actuators connected to the drive circuitry layer and reciprocally displaceable with respect to the substrate on receipt of an electrical signal from the drive circuitry layer, at least one actuator being associated wit each respective nozzle chamber, the actuators being positioned so that reciprocal displacement of each actuator results in reduction and subsequent enlargement of each respective nozzle chamber to eject ink drops from the respective nozzles,

wherein each actuator at least partially defines a wall of a respective nozzle chamber, said wall having one of said ink ejection nozzles defined therein.

2. A printhead integrated circuit as claimed in claim 1, in which a number of actuators at least partially span each nozzle chamber, the actuators being displaceable into and out of the respective nozzle chambers.

3. A printhead integrated circuit as claimed in claim 1, in which the nozzle chambers are the result of a crystallographic etch carried out on the substrate so that the nozzle chambers are frusto-conical and taper inwardly towards te respective ink supply channels that are centrally positioned wit the nozzles generally aligned with the respective ink supply channels.

4. A printhead integrated circuit as claimed in claim 3, in which the actuators for each nozzle chamber are fast with the substrate and extend radially inwardly towards the nozzle.

5. A printhead integrated circuit as claimed in claim 4, in which each actuator includes a body that is capable of thermal expansion to perform work and a heating circuit positioned in the body and connected to the drive circuitry layer to be heated and subsequently cooled on receipt of an electrical signal from the drive circuitry layer so that the body experiences reciprocal differential thermal expansion and contraction and is displaced into and out of the respective nozzle chamber.

6. A printhead integrated circuit as claimed in claim 5, in which the bodies of the actuators are of polytetrafluoroethylene and the heating circuits are of a suitable heating element material.

7. A printhead integrated circuit as claimed in claim 4, in which each nozzle is supported with a number of arms fast at one end with the substrate and at an opposite end with the nozzle, each actuator being interposed between consecutive arms.

8. A printhead integrated circuit as claimed in claim 1, in which each ink inlet channel is the result of a deep silicon back etch of the substrate.