Light emitting device
First Claim
1. A light emitting device comprising:
- a nitride semiconductor substrate with a resistivity of 0.5 Ω
·
cm or less;
an n-type nitride semiconductor layer at a first main surface side of said nitride semiconductor substrate and a p-type nitride semiconductor layer placed more distantly from said nitride semiconductor substrate than said n-type nitride semiconductor layer at said first main surface side; and
a light emitting layer placed between said n-type nitride semiconductor layer and said p-type nitride semiconductor layer at said first main surface side, whereinone of said nitride semiconductor substrate and said p-type nitride semiconductor layer is mounted at the top side which emits light and the other is placed at the down side, and a single electrode is placed at the top side, andsaid substrate is n-typed with oxygen-doping, and said substrate has an oxygen concentration in the range from 1E17 to 2E19 oxygen atoms/cm3 and a thickness of 100 μ
m to 200 μ
m.
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Accused Products
Abstract
A light emitting device includes a nitride semiconductor substrate with a resistivity of 0.5 Ω·cm or less, an n-type nitride semiconductor layer and a p-type nitride semiconductor layer placed more distantly from the nitride semiconductor substrate than the n-type nitride semiconductor layer at a first main surface side of the nitride semiconductor substrate, and a light emitting layer placed between the n-type nitride semiconductor layer and the p-type nitride semiconductor layer, wherein one of the nitride semiconductor substrate and the p-type nitride semiconductor layer is mounted at the top side which emits light and the other is placed at the down side, and a single electrode is placed at the top side. Therefore, there is provided a light emitting device which has a simple configuration thereby making it easy to fabricate, can provide a high light emission efficiency for a long time period, and can be easily miniaturized.
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Citations
162 Claims
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1. A light emitting device comprising:
- a nitride semiconductor substrate with a resistivity of 0.5 Ω
·
cm or less;
an n-type nitride semiconductor layer at a first main surface side of said nitride semiconductor substrate and a p-type nitride semiconductor layer placed more distantly from said nitride semiconductor substrate than said n-type nitride semiconductor layer at said first main surface side; and
a light emitting layer placed between said n-type nitride semiconductor layer and said p-type nitride semiconductor layer at said first main surface side, whereinone of said nitride semiconductor substrate and said p-type nitride semiconductor layer is mounted at the top side which emits light and the other is placed at the down side, and a single electrode is placed at the top side, and said substrate is n-typed with oxygen-doping, and said substrate has an oxygen concentration in the range from 1E17 to 2E19 oxygen atoms/cm3 and a thickness of 100 μ
m to 200 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
- a nitride semiconductor substrate with a resistivity of 0.5 Ω
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31. A light emitting device comprising a nitride semiconductor substrate GaN substrate with a dislocation density of 108/cm2 or less, an n-type AlxGa1−
- xN layer (x is within the range of 0 to
1) which is an n-type nitride semiconductor layer at a first main surface side of said GaN substrate and a p-type AlxGa1−
xN layer (x is within the range of 0 to
1) placed more distantly from said GaN substrate than said n-type AlxGa1−
xN layer at said first main surface side, and a light emitting layer placed between said n-type AlxGa1−
xN layer and said p-type AlxGa1−
xN layer at said first main surface side, whereinan n-electrode is provided in contact with a second main surface of said GaN substrate which is the main surface at the opposite side from said first main surface, and a p-electrode is provided in contact with said p-type AlxGa1−
xN layer,one of said n-electrode and said p-electrode is mounted at the top side which emits light and the other is mounted at the down side, and the electrode placed at the top side is constituted from a single electrode, and said substrate is n-typed with oxygen-doping, and said substrate has an oxygen concentration in the range from 1E17 to 2E19 oxygen atoms/cm3 and a thickness of 100 μ
m to 200 μ
m. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72)
- xN layer (x is within the range of 0 to
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73. A light emitting device comprising a nitride semiconductor AlN substrate with a heat conductivity of 100 W/(m·
- K) or more, an n-type AlxGa1−
xN layer (x is within the range of 0 to
1) which is an n-type nitride semiconductor layer at a first main surface side of said AlN substrate and a p-type AlxGa1−
xN layer (x is within the range of 0 to
1) placed more distantly from said AlN substrate than said n-type AlxGa1−
xN layer at said first main surface side, and a light emitting layer placed between said n-type AlxGa1−
xN layer and said p-type AlxGa1−
xN layer at said first main surface side, whereinan n-electrode is provided in contact with a second main surface of said AlN substrate which is the main surface at the opposite side from said first main surface, and a p-electrode is provided in contact with said p-type AlxGa1−
xN layer,one of said n-electrode and said p-electrode is mounted at the top side which emits light and the other is mounted at the down side, and the electrode placed at the top side is constituted from a single electrode, and said substrate is n-typed with oxygen-doping, and said substrate has an oxygen concentration in the range from 1E17 to 2E19 oxygen atoms/cm3 and a thickness of 100 μ
m to 200 μ
m. - View Dependent Claims (74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, 100, 101, 102)
- K) or more, an n-type AlxGa1−
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103. A light emitting device comprising a nitride semiconductor substrate with a resistivity of 0.5 Ω
- ·
cm or less, an n-type nitride semiconductor layer at a first main surface side of said nitride semiconductor substrate and a p-type nitride semiconductor layer placed more distantly from said nitride semiconductor substrate than said n-type nitride semiconductor layer at said first main surface side, and a light emitting layer placed between said n-type nitride semiconductor layer and said p-type nitride semiconductor layer at said first main surface side, whereinsaid nitride semiconductor substrate is mounted at the down side and said p-type nitride semiconductor layer is mounted at the top side which emits light, and said substrate is n-typed with oxygen-doping, and said substrate has an oxygen concentration in the range from 1E17 to 2E19 oxygen atoms/cm3 and a thickness of 100 μ
m to 200 μ
m. - View Dependent Claims (104, 105, 106, 107, 108, 109, 110, 111, 112, 113, 114, 115, 116, 117, 118, 119, 120, 121, 122, 123, 124, 125, 126, 127, 128, 129, 130)
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131. A light emitting device comprising a GaN substrate with a dislocation density of 108/cm2 or less, an n-type nitride semiconductor layer at a first main surface side of said GaN substrate and a p-type nitride semiconductor placed more distantly from said GaN substrate than said n-type nitride semiconductor at said first main surface side, and a light emitting layer placed between said n-type nitride semiconductor layer and said p-type nitride semiconductor layer at said first main surface side, wherein
said GaN substrate is mounted at the down side and said p-type nitride semiconductor layer is provided at the top side which emits light, and said substrate is n-typed with oxygen-doping, and said substrate has an oxygen concentration in the range from 1E17 to 2E19 oxygen atoms/cm3 and a thickness of 100 μ
Specification