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Chip level hermetic and biocompatible electronics package using SOI wafers

  • US 7,190,051 B2
  • Filed: 02/07/2003
  • Issued: 03/13/2007
  • Est. Priority Date: 01/17/2003
  • Status: Expired due to Term
First Claim
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1. An electronics package suitable for implantation in living tissue comprising:

  • a silicon-on-insulator chip assembly comprising a silicon layer on top of an insulator substrate and said silicon layer bonded to said insulator substrate; and

    a hermetic electrically insulating thin film covering the top and the sides of said silicon layer and extending the sides of said insulator substrate to a partial thickness of said insulator substrate.

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