Chip level hermetic and biocompatible electronics package using SOI wafers
First Claim
Patent Images
1. An electronics package suitable for implantation in living tissue comprising:
- a silicon-on-insulator chip assembly comprising a silicon layer on top of an insulator substrate and said silicon layer bonded to said insulator substrate; and
a hermetic electrically insulating thin film covering the top and the sides of said silicon layer and extending the sides of said insulator substrate to a partial thickness of said insulator substrate.
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Abstract
The invention is directed to a hermetically packaged and implantable integrated circuit for electronics that is made by producing streets in silicon-on-insulator chips that are subsequently coated with a selected electrically insulating thin film prior to completing the dicing process to yield an individual chip. A thin-layered circuit may transmit light, allowing a photodetector to respond to transmitted light to stimulate a retina, for example. Discrete electronic components may be placed in the three-dimensional street area of the integrated circuit package, yielding a completely integrated hermetic package that is implantable in living tissue.
82 Citations
18 Claims
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1. An electronics package suitable for implantation in living tissue comprising:
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a silicon-on-insulator chip assembly comprising a silicon layer on top of an insulator substrate and said silicon layer bonded to said insulator substrate; and a hermetic electrically insulating thin film covering the top and the sides of said silicon layer and extending the sides of said insulator substrate to a partial thickness of said insulator substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 17, 18)
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11. An electronics package suitable for implantation in living tissue comprising:
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a silicon-on-insulator chip assembly comprising a silicon layer on top of an insulator substrate and said silicon layer bonded to said insulator substrate; a hermetic electrically insulating thin film covering the top and the sides of said silicon layer and extending the sides of said insulator substrate to a partial thickness of said insulator substrate; and wherein said insulator substrate is transparent to light. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification