Modular power semiconductor module

• US 7,190,070 B2
• Filed: 04/09/2004
• Issued: 03/13/2007
• Est. Priority Date: 04/10/2003
• Status: Active Grant

• Current Assignee: Semikron Elektronik GmbH & Company KG (Heilbronner Holding GbR)
• Original Assignee: Semikron Elektronik GmbH & Company KG (Heilbronner Holding GbR)
• Inventors: Gruber, Markus, Manz, Yvone, Wahi, Aseem
• Primary Examiner(s): Le; Thao X.
• Application Number:
  US10/821,308
• Publication Number:
  US 20050012190A1
• Time in Patent Office: 1,068 Days
• Field of Search: 257723-725, 257/713, 257/720, 257/717, 257/718, 257/784, 257/E23.173, 257/E25.016, 257/E23.084, 257/E23.092, 257/E23.187, 257/728, 663/147, 663/144, 363/131, 363/720, 363/728, 363/55, 361/715
• US Class Current: 257/723
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 25/115 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/19107 off-chip wires

Abstract

A modular power semiconductor module for mounting on a heat sink comprises a plurality of partial modules, each having a base plate and a framelike housing as well as terminal elements for load terminals and auxiliary terminals. Adjacent partial modules are assembled into a complete power semiconductor module by means of a cap that fixes the partial modules relative to one another and/or by means of connections that fix the various partial modules relative to one another.

Claims

1. A power semiconductor module for mounting on a flat body, comprising a plurality of partial modules, each of said partial modules having:

a base plate;

a framelike housing;

terminal elements for load terminals and auxiliary terminals;

at least one electrically insulated substrate disposed inside said housing on said base plate, said substrate having an insulation body with a plurality of metal connection tracks located therein and insulated from one another, and power semiconductor components, located on said connection tracks and electrically connected thereto;

at least two open-slotlike recesses on a side thereof, and positioned so that, when said partial modules are assembled into a power semiconductor module, said recesses in sides of adjacent partial modules face one another to form closed slots; and

a cap for connecting adjacent partial modules to one another;

said cap having round slotlike recesses for receiving screws, which, in the abutting region of said partial modules, are aligned with said recesses that form said slots therein.

2. The power semiconductor module of claim 1, wherein

said cap is connected to said partial modules by means of snap-detent connections, said housing has detent lugs, and said cap has abutments formed to cooperate with said detent lugs.

3. The power semiconductor module of claim 1, wherein

each of said partial modules has, on a first side adjacent to another partial module, at least one detent lug, and on a second, opposite, side thereof has at least one abutment adapted to cooperate with a detent lug in an adjacent partial module.

4. The power semiconductor module of claim 1, wherein said means for connecting comprises fixing connections.

5. The power semiconductor module of claim 4, wherein

said fixing connections include a snap-detent connection for connection of a first partial module to an adjacent partial module.

6. The power semiconductor module of claim 5, wherein

each of said partial modules has at least two open-slotlike recesses on a side thereof, and positioned so that, when said partial modules are assembled into a power semiconductor module, said recesses in said sides of adjoining partial modules face one another to form closed slots.

7. The power semiconductor module of claim 4, wherein

said fixing connections include a rail that covers all said recesses and said slots formed thereby in adjacent partial modules.