Integrated library core for embedded passive components and method for forming electronic device thereon

• US 7,190,592 B2
• Filed: 06/20/2003
• Issued: 03/13/2007
• Est. Priority Date: 01/30/2003
• Status: Expired due to Fees

• Current Assignee: Phoenix Precision Technology Corporation (Unimicron Technology Corporation)
• Original Assignee: Phoenix Precision Technology Corporation (Unimicron Technology Corporation)
• Inventors: Hu, Chu-Chin
• Primary Examiner(s): Reichard, Dean A.
• Assistant Examiner(s): NGUYEN, HOA CAO
• Application Number:
  US10/600,742
• Publication Number:
  US 20040150966A1
• Time in Patent Office: 1,362 Days
• Field of Search: 361762-765, 174262-263, 174265-266
• US Class Current: 361/763
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 23/647 Resistive arrangements H01L23/66, H01L23/62 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/04941 TiN
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H05K 1/092 : Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/095 : for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 1/162 : incorporating printed capacitors
• CPC Class Codes: H05K 1/167 : incorporating printed resistors
• CPC Class Codes: H05K 2201/0187 : with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/09536 : Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
• CPC Class Codes: H05K 3/4061 : for via connections in inorganic insulating substrates
• CPC Class Codes: H05K 3/4069 : for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/426 : initial plating of through-holes in substrates without metal
• CPC Class Codes: H05K 3/4602 : characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

An integrated library core for embedded passive components and a method for forming an electronic device on the library core are provided. An insulating core layer is formed with a plurality of openings penetrating therethrough and with electrically conductive layers on upper and lower surfaces thereof. The openings of the core layer are filled with materials for forming passive components such as resistors and capacitors. This thereby provides an integrated library core on which the electrically conductive layers of the core layer can be desirably patterned to electrically interconnect the passive components, and this library core can be electrically connected to an electronic device such as substrate or printed circuit board to enhance performances of electrical characteristics for the electronic device.

Claims

1. A library core for embedded passive components, comprising:

an insulating core layer having an upper surface and a lower surface opposed to the upper surface, and formed with a plurality of openings penetrating therethrough, wherein the openings are filled with capacitive materials therein; and

a plurality of conductive traces formed from electrically conductive layers as a whole on the core layer by pattering, and formed over the upper and lower surfaces of the core layer and fully covered the capacitive materials, wherein the conductive traces are electrically interconnected to the capacitive materials as well as partly used as parallel sheets onto the capacitive materials to form capacitors embedded in the core layer.

2. The library core for embedded passive components of claim 1, wherein the core layer is formed with a plurality of conductive vias for electrically interconnecting the electrically conductive layers on the upper and lower surfaces of the core layer.

3. The library core for embedded passive components of claim 1, wherein the library core with the patterned conductive traces is fabricated in a semiconductor packaging substrate or printed circuit board for enhancing performances of electrical characteristics.

4. The library core for embedded passive components of claim 1, wherein the library core with the patterned conductive traces is formed with an insulating layer over the conductive traces on the core layer and formed at least one circuit layer on the insulating layer so as to form a multi-layer circuit board.

5. The library core for embedded passive components of claim 4, wherein the multi-layer circuit board is fabricated in a flip-chip semiconductor packaging substrate.

6. The library core for embedded passive components of claim 4, wherein the multi-layer circuit board is fabricated in a wire-bonding semiconductor packaging substrate.

7. The library core for embedded passive components of claim 1, wherein the capacitive materials is polymeric materials, ceramic materials, or polymers formed by ceramic powders.

8. A method for forming a library core for embedded passive components, comprising the steps of:

providing an insulating core layer having an upper surface and a lower surface opposed to the upper surface, wherein the core layer is formed with a plurality of openings penetrating therethrough, allowing the openings to be filled with capacitive materials, and electrically conductive layers formed as a whole on the core layer are over the upper and lower surfaces of the core layer respectively; and

patterning the electrically conductive layers respective on the upper and lower surfaces of the core layer to form a plurality of conductive traces for electrically interconnecting the capacitive materials contained in the openings of the core layer as well as partly used as parallel sheets onto the capacitive materials to thereby form the library core with the embedded capacitor.

9. The method of claim 8, wherein the core layer is formed with a plurality of conductive vias for electrically interconnecting the conductive traces on the upper and lower surfaces of the core layer.

10. The method of claim 8, wherein the capacitive materials is polymeric materials, ceramic materials, or polymers formed by ceramic powders.