Means for increasing implantable medical device electrode surface area

• US 7,191,009 B2
• Filed: 08/09/2004
• Issued: 03/13/2007
• Est. Priority Date: 08/09/2004
• Status: Active Grant

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Laske, Timothy G., Nygren, Lea A., Martinez, Gonzalo
• Primary Examiner(s): Pezzuto; Robert E.
• Assistant Examiner(s): Patel; Natasha
• Application Number:
  US10/914,303
• Publication Number:
  US 20060030893A1
• Time in Patent Office: 946 Days
• Field of Search: 607/5, 607/9, 607/36, 607/37, 607/121, 607/122, 607/4
• US Class Current: 607/37
• CPC Class Codes: A61N 1/375 Constructional arrangements, e.g. casings
• CPC Class Codes: A61N 1/37512 Pacemakers
• CPC Class Codes: A61N 1/3756 Casings with electrodes thereon, e.g. leadless stimulators

Abstract

A surface area of an IMD electrode is increased by forming a conductive layer over an external portion of a sidewall of an IMD connector header and electrically coupling the conductive layer of the connector header to a conductive mounting surface of a hermetically sealed IMD housing; wherein the conductive mounting surface is an extension of an external conductive surface of the IMD, which external conductive surface forms the IMD electrode that is increased in surface area by the conductive layer formed over the connector header.

Claims

1. An implantable medical device (IMD) including a connector header, the connector header comprising:

a header body formed of a non-conductive, optically transparent polymer and including a sidewall;

at least one connector bore extending within the header body approximately parallel with the sidewall and including at least one connector element mounted therein; and

a conductive layer comprising a conductive material formed on an external portion of the header body sidewall over a majority of the header body sidewall as an electrode surface, the conductive material being adapted to allow viewing through the sidewall into the connector bore;

wherein the connector bore is adapted to receive a connector terminal of a medical electrical lead and the connector element is adapted to electrically couple the lead connector terminal to the IMD.

2. The IMD of claim 1, wherein the conductive material comprises an optically transparent conductive material.

3. The IMD of claim 1, wherein the conductive material comprises a mesh formed of conductive bands leaving mesh windows.

4. The IMD of claim 3, further comprising an optically transparent material filling the mesh windows.

5. The IMD of claim 1, wherein the conductive layer includes a window formed through the conductive material in proximity to an end of the bore beyond the connector element.

6. The IMD of claim 5, further comprising an optically transparent material filling the window.

7. The IMD of claim 1, wherein the connector element includes a setscrew.

8. The IMD of claim 1, wherein the connector element includes a spring contact.

9. An IMD, comprising:

a hermetically sealed housing including a conductive external surface and containing electronic circuitry;

conductors extending from the electronic circuitry through the housing and being isolated from the housing; and

a connector header, through which the conductors are routed, mounted on the housing and including a header body having a sidewall formed of a non-conductive, optically transparent polymer, at least one connector bore extending within the header body approximately parallel with the sidewall, at least one connector element mounted within the connector bore and coupled to at least one of the conductors, and a conductive layer comprising a conductive material formed on an external portion of the header body sidewall over a majority of the header body sidewall as an electrode surface, the conductive material being adapted to allow viewing through the sidewall into the connector bore;

wherein the connector bore is adapted to receive a connector terminal of a medical electrical lead and the connector element is adapted to electrically couple the lead connector terminal to the IMD.

10. The IMD of claim 9, wherein the conductive material comprises an optically transparent conductive material.

11. The IMD of claim 9, wherein the conductive material comprises a mesh formed of conductive bands leaving mesh windows.

12. The IMD of claim 11, further comprising an optically transparent material filling the mesh windows.

13. The IMD of claim 9, wherein the conductive layer includes a window formed through the conductive material in proximity to an end of the bore beyond the connector element.

14. The IMD of claim 13, further comprising an optically transparent material filling the window.

15. The IMD of claim 9, wherein the connector element includes a setscrew.

16. The IMD of claim 9, wherein the connector element includes a spring contact.

17. The IMD of claim 9, further comprising a conduction element disposed between the connector header and the housing to electrically couple the conductive layer of the connector header to the conductive external surface of the housing.

18. The IMD of claim 17, wherein the conductive element includes adhesive properties.

19. The IMD of claim 17, further comprising a fluid tight seal surrounding the conductive element.

20. A connector header for an IMD, comprising:

a header body formed of a non-conductive, optically transparent polymer and including a sidewall;

at least one connector bore extending within the header body approximately parallel with the sidewall and including at least one connector element mounted therein; and

a conductive layer comprising a conductive material formed on an external portion of the header body sidewall over a majority of the header body sidewall as an electrode surface, the conductive material being adapted to allow viewing through the sidewall into the connector bore;

wherein the connector bore is adapted to receive a connector terminal of a medical electrical lead and the connector element is adapted to electrically couple the lead connector terminal to the IMD.

21. The IMD of claim 20, wherein the conductive material comprises an optically transparent conductive material.

22. The IMD of claim 20, wherein the conductive material comprises a mesh formed of conductive bands leaving mesh windows.

23. The IMD of claim 22, further comprising an optically transparent material filling the mesh windows.

24. The IMD of claim 20, wherein the conductive layer includes a window formed through the conductive material in proximity to an end of the bore beyond the connector element.

25. The IMD of claim 24, further comprising an optically transparent material filling the window.

26. The IMD of claim 20, wherein the connector element includes a setscrew.

27. The IMD of claim 20, wherein the connector element includes a spring contact.

28. A method of increasing a surface area of an IMD electrode, the method comprising the steps of:

forming a conductive layer comprising a conductive material extending over an external portion of a sidewall an IMD connector header sidewall over a majority of the header body sidewall the header formed of a non-conductive optically transparent polymer;

electrically coupling the conductive layer of the connector header to a conductive mounting surface of a hermetically sealed IMD housing, the conductive mounting surface being an extension of an external conductive surface of the IMD, which external conductive surface forms the IMD electrode that is increased in surface area by the conductive layer formed over the connector header.

29. The method of claim 28, further comprising the steps of:

coupling a conduction element to the conductive layer of the connector header; and

positioning the conduction element on a mounting surface of the connector header to interface with the conductive mounting surface of the housing for electrical coupling of the conductive layer with the external conductive surface of the housing.

30. The method of claim 29, further comprising the step of forming a fluid tight seal about the conduction element-to-conductive mounting surface interface.

31. The method of claim 29, wherein the conduction element includes adhesive properties.

32. The method of claim 28, wherein forming the conductive layer includes leaving a window formed through the conductive material to facilitate viewing through the sidewall.

33. The method of claim 28, wherein the conductive material comprises an optically transparent conductive material.

34. An implantable medical device (IMD), comprising:

a hermetically sealed housing including a conductive external surface;

a header body formed of a non-conductive, optically transparent polymer and including a sidewall and a mounting surface, the header body being mounted on the housing along the mounting surface;

at least one connector bore extending within the header body approximately parallel with the sidewall, the connector bore being adapted to receive a connector terminal of a medical electrical lead and including at least one connector element mounted therein;

a conductive layer comprising a conductive material formed on an external portion of the header body sidewall over a majority of the header body sidewall as an electrode surface, the conductive material being adapted to allow viewing through the sidewall into the connector bore and further extending over a portion of the mounting surface; and

a conduction element disposed between the conductive material extending over a portion of the mounting surface and the housing for electrically coupling the conductive layer to the conductive external surface of the housing.