Semiconductor device and manufacturing method of the same

• US 7,192,788 B2
• Filed: 12/09/2004
• Issued: 03/20/2007
• Est. Priority Date: 12/12/2003
• Status: Expired due to Fees

• Current Assignee: Renesas Electronics Corporation
• Original Assignee: Renesas Technology Corporation (Renesas Electronics Corporation)
• Inventors: Kurokawa, Atsushi
• Primary Examiner(s): Huynh; Andy
• Assistant Examiner(s): Nguyen; Dao H.
• Application Number:
  US11/007,340
• Publication Number:
  US 20050127393A1
• Time in Patent Office: 831 Days
• Field of Search: 257/303, 257/528, 438/3, 438/309, 438/396
• US Class Current: 438/3
• CPC Class Codes: H01L 27/0605 integrated circuits made of compound material, e.g. AIIIBV
• CPC Class Codes: H01L 28/40 Capacitors
• CPC Class Codes: H01L 28/82 with an enlarged surface, e.g. formed by texturisation

Abstract

The present invention intends to provide a technique that can improve the capacitance density while securing the withstand voltage of a capacitor element. In order to achieve the above object, the present inventive manufacturing method of a semiconductor device includes forming a metal film on a silicon oxide film, forming a SiN film on the metal film, forming a metal film on the SiN film, etching the upper most metal film with a photoresist film as a mask to form an upper electrode, thereafter forming a silicon oxide film that covers the upper electrode, patterning by etching the silicon oxide film and the SiN film with a photoresist film as a mask to form a capacitor insulating film and sputter-etching the lowermost metal film with the patterned silicon oxide film as a mask to form a lower electrode.

Claims

1. A manufacturing method of a semiconductor device, comprising the steps of:

(a) sequentially depositing over a substrate made of a semiconductor substrate or an insulator substrate a first conductive film, a first insulating film and a second conductive film;

(b) patterning the second conductive film to form an upper electrode; and

(c) after the step (b), patterning the first conductive film to form a lower electrode and thereby forming a capacitor element including an upper electrode, a capacitor insulating film and a lower electrode,

wherein the capacitor element and a bipolar transistor are formed over the substrate,

the bipolar transistor being formed by a process comprising the steps of;

(g1) forming a first conductivity type collector layer over the substrate;

(g2) forming a second conductivity type base layer over the collector layer;

(g3) forming a first conductivity type emitter layer over the base layer;

(g4) forming an emitter electrode that electrically connects with the emitter layer over the emitter layer;

(g5) etching the emitter layer;

(g6) after the step of (g5), forming a base electrode that electrically connects with the base layer over the base layer;

(g7) after the step of (g5), patterning the base layer to expose a first region of the collector layer; and

(g8) in the first region, forming a collector electrode that electrically connects with the collector layer.

2. The manufacturing method of a semiconductor device according to claim 1, comprising the steps of:

(b1) after the step (b) and before the step (c), patterning the first insulating film to form the capacitor insulating film,

wherein the first conductive film and the second conductive film have a metal as a main component.

3. The manufacturing method of a semiconductor device according to claim 2,

wherein the first conductive film is formed according to a process comprising the steps of:

(a1) forming a first metal film over the substrate;

(a2) forming a second metal film over the first metal film; and

(a3) forming a third metal film over the second metal film, and

wherein the second metal film comprises gold as a main component, and

wherein the first metal film and the third metal film comprise at least one kind of element selected from molybdenum, titanium, tungsten, titanium tungsten or tungsten silicide as a main component.

4. The manufacturing method of a semiconductor device according to claim 2,

wherein the semiconductor substrate has GaAs or InP as a main component;

and

the insulator substrate has silicon oxide or aluminum oxide as a main component.

5. The manufacturing method of a semiconductor device according to claim 1,

wherein the step (c) comprises the steps of

(c1) forming a second insulating film over the substrate;

and

(c2) patterning the second insulating film.

6. The manufacturing method of a semiconductor device according to claim 5,

wherein the step (c) comprises the step of (c1) etching the first conductive film with the second insulating film as a mask to pattern the first conductive film,

wherein the first conductive film comprises gold, and

wherein the second insulating film has silicon oxide or silicon nitride as a main component.

7. The manufacturing method of a semiconductor device according to claim 1,

wherein the second conductive film and the first insulating film are patterned so that in a plane an outer periphery of the upper electrode is disposed more inside than an outer periphery of the lower electrode;

further comprising, subsequent to the step (c), the steps of;

(d) forming a third insulating film over the substrate;

(e) forming a first opening that reaches the upper electrode over the third insulating film over the upper electrode; and

(f) forming in the first opening a first wiring that electrically connects with the upper electrode.

8. The manufacturing method of a semiconductor device according to claim 1,

wherein the second conductive film is patterned so that in a plane an outer periphery of the upper electrode is disposed more inside than an outer periphery of the lower electrode;

further comprising, subsequent to the step (c), the steps of;

(d) forming a third insulating film over the substrate;

(e) forming, in the third insulating film over the upper electrode, a first opening that reaches the upper electrode and, in a region that is planar and where the upper electrode is not located, and forming in the third insulating film and the capacitor insulating film over the lower electrode, a second opening that reaches the lower electrode; and

(f) forming in the first opening a first wiring that electrically connects with the upper electrode, and in the second opening a second wiring that electrically connects with the lower electrode.

9. The manufacturing method of a semiconductor device according to claim 1,

wherein the upper electrode, the capacitor insulating film and the lower electrode are formed so as to be flat over the substrate.