Method of forming a low capacitance semiconductor device and structure therefor
First Claim
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1. A method of forming a semiconductor device comprising:
- providing a substrate of a first conductivity type having a first surface;
forming a first source region and a second source region of the first conductivity type on at least a first portion of the first surface of the substrate wherein the second source region is spaced apart from the first source region;
forming a gate structure overlying the first surface of the substrate with a first end of the gate structure overlying an edge of the first source region and a second end of the gate structure overlying an edge of the second source region wherein a first surface of the gate structure is substantially parallel to the first surface of the substrate and faces away from the first surface of the substrate;
forming an opening in the gate structure and overlying a second portion of the substrate that is positioned in between the first source region and the second source region;
forming an insulator at least on sidewalls of the opening; and
forming a conductor within the opening and on the insulator wherein the conductor is not on the underlying substrate.
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Abstract
In one embodiment a transistor is formed with a gate structure having an opening in the gate structure. An insulator is formed on at least sidewalls of the opening and a conductor is formed on the insulator.
11 Citations
17 Claims
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1. A method of forming a semiconductor device comprising:
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providing a substrate of a first conductivity type having a first surface; forming a first source region and a second source region of the first conductivity type on at least a first portion of the first surface of the substrate wherein the second source region is spaced apart from the first source region; forming a gate structure overlying the first surface of the substrate with a first end of the gate structure overlying an edge of the first source region and a second end of the gate structure overlying an edge of the second source region wherein a first surface of the gate structure is substantially parallel to the first surface of the substrate and faces away from the first surface of the substrate; forming an opening in the gate structure and overlying a second portion of the substrate that is positioned in between the first source region and the second source region; forming an insulator at least on sidewalls of the opening; and forming a conductor within the opening and on the insulator wherein the conductor is not on the underlying substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming a semiconductor device comprising:
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providing a semiconductor substrate of a first conductivity type having a surface; forming a first body region of a second conductivity type on the surface of the semiconductor substrate; forming a first region of the first conductivity type within the first body region and spaced apart from an edge of the first body region; positioning a gate structure having a first portion overlying at least a portion of the first region, a second portion overlying a portion of the first body region, and a third portion overlying a first portion of the semiconductor substrate; forming an opening in the gate structure wherein a sidewall of the opening forms a first sidewall of the gate structure; forming an insulator on the first sidewall of the opening; and forming a conductor abutting the insulator and overlying a second portion of the semiconductor substrate wherein the conductor does not overlie the first region of the first conductivity type. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17)
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Specification