Semiconductor device having a heat spreader exposed from a seal resin
First Claim
1. A semiconductor device comprising:
- a first wiring board formed on a substrate and having an opening through which a surface of the substrate is exposed;
a semiconductor element located in the opening and having a back surface opposite to a circuit formation surface, the back surface being bonded to said substrate;
bonding wires which connect electrodes formed on said first wiring board to first electrodes arranged in a peripheral part of the circuit formation surface of said semiconductor element;
a second wiring board facing the circuit formation surface of said semiconductor element and having connection members which are connected to second electrodes arranged in a center part of said circuit formation surface;
first wirings located in said first wiring board;
second wirings located in said second wiring board;
a resin located between said first and second wiring boards;
first external connection terminals formed on said second wiring board and electrically connected to said second electrodes of said semiconductor element through said second wirings in said second wiring board and said connection members;
second external connection terminals formed on said first wiring board electrically connected to said first electrodes of said semiconductor element through wirings in said first wiring board and said bonding wires;
wherein said second wirings are free of contact with said resin;
wherein the first external connection terminals on the second wiring board and the second electrodes on the semiconductor element align respectively, and the second wirings directly connect the first external connection terminals and the connection members by extending in a vertical direction.
1 Assignment
0 Petitions
Accused Products
Abstract
A semiconductor element has a circuit formation surface on which electrode terminals are arranged in a peripheral part thereof. The semiconductor element is encapsulated by a mold resin on a substrate which has openings at positions corresponding to the electrodes of the semiconductor element. The semiconductor element is mounted to the substrate in a state where the circuit formation surface faces the substrate and the electrode terminals are positioned at the openings and a back surface opposite to the circuit formation surface of the semiconductor element is exposed from the mold resin. A heat-emitting member formed of a metal plate is provided on a surface of the substrate opposite to a surface on which the semiconductor element is mounted. The surface of the heat-emitting member being exposed from the mold resin.
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Citations
12 Claims
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1. A semiconductor device comprising:
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a first wiring board formed on a substrate and having an opening through which a surface of the substrate is exposed; a semiconductor element located in the opening and having a back surface opposite to a circuit formation surface, the back surface being bonded to said substrate; bonding wires which connect electrodes formed on said first wiring board to first electrodes arranged in a peripheral part of the circuit formation surface of said semiconductor element; a second wiring board facing the circuit formation surface of said semiconductor element and having connection members which are connected to second electrodes arranged in a center part of said circuit formation surface; first wirings located in said first wiring board; second wirings located in said second wiring board; a resin located between said first and second wiring boards; first external connection terminals formed on said second wiring board and electrically connected to said second electrodes of said semiconductor element through said second wirings in said second wiring board and said connection members; second external connection terminals formed on said first wiring board electrically connected to said first electrodes of said semiconductor element through wirings in said first wiring board and said bonding wires; wherein said second wirings are free of contact with said resin; wherein the first external connection terminals on the second wiring board and the second electrodes on the semiconductor element align respectively, and the second wirings directly connect the first external connection terminals and the connection members by extending in a vertical direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor device comprising:
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a first wiring board formed on a substrate; a semiconductor element being bonded to said substrate; bonding wires that connect electrodes formed on said first wiring board to first electrodes arranged on said semiconductor element; a second wiring board connected to said semiconductor element according to a flip-chip connection, said second wiring board having connection members which are connected to second electrodes arranged in a center part of a surface of said semiconductor element; first external connection terminals formed on said second wiring board; second external connection terminals formed on said first wiring board; and wherein the first external connection terminals on the second wiring board and the second electrodes on the semiconductor element align respectively, and second wirings directly connect the first external connection terminals and the connection members by extending in a vertical direction.
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Specification