Energy pathway arrangement

• US 7,193,831 B2
• Filed: 11/15/2001
• Issued: 03/20/2007
• Est. Priority Date: 10/17/2000
• Status: Expired due to Fees

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, William M.
• Primary Examiner(s): Jackson; Stephen W.
• Application Number:
  US10/399,630
• Publication Number:
  US 20040054426A1
• Time in Patent Office: 1,951 Days
• Field of Search: 361/118, 361/111
• US Class Current: 361/118
• CPC Class Codes: H01G 4/012 Form of non-self-supporting electrodes
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: H01G 4/35 Feed-through capacitors or anti-noise capacitors

Abstract

Compact and integral arrangements for an energy-conditioning arrangement (800q) having various predetermined pathways (813a, 813b) utilized in part for the purpose of conditioning energies of either one or multiple of circuitry that would otherwise detrimentally effect a predetermined application having a single or multiple, circuitry systems. Some energy-conditioning variants can be operable to provide multiple-conditioning operations.

Claims

1. An energy conditioner comprising:

a conductive shield structure comprising a conductive shield structure first conductive shield layer, a conductive shield structure second conductive shield layer, and a conductive shield structure third conductive shield layer;

wherein said conductive shield structure first conductive shield layer is above said conductive shield structure second conductive shield layer, and said conductive shield structure second conductive shield layer is above said conductive shield structure third conductive shield layer;

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, and said conductive shield structure third conductive shield layer are conductively connected to one another;

a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer;

a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer;

wherein each one of said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer, said first pair of conductive non-shield layers, and said second pair of conductive non-shield layers extends in a first dimension and a second dimension; and

wherein said first pair first layer consists of a first pair first layer overlap region and at least one first pair first layer non-overlap region;

wherein said first pair second layer consists of a first pair second layer overlap region and at least one first pair second layer non-overlap region;

wherein said first pair first layer and said first pair second layer are stacked so that said first pair first layer overlap region and said first pair second layer overlap region overlap one another, thereby defining a first pair overlap region;

wherein said second pair first layer consists of a second pair first layer overlap region and at least one second pair first layer non-overlap region;

wherein said second pair second layer consists of a second pair second layer overlap region and at least one second pair second layer non-overlap region;

wherein said second pair first layer and said second pair second layer are stacked so that said second pair first layer overlap region and said second pair second layer overlap region overlap one another, thereby defining a second pair overlap region;

wherein none of said at least one first pair first layer non-overlap region, said at least one first pair second layer non-overlap region, said at least one second pair first layer non-overlap region, and said at least one second pair second layer non-overlap region overlap one another;

wherein said conductive shield structure first conductive shield layer is above all layers of said first pair and said second pair;

wherein said conductive shield structure second conductive shield layer is between said first pair first layer and said first pair second layer, and said conductive shield structure second conductive shield layer is between said second pair first layer and said second pair second layer;

wherein said conductive shield structure third conductive shield layer is below all layers of said first pair and said second pair;

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer all extend in said first dimension and said second dimension beyond the extent in said first dimension and said second dimension of said first pair overlap region; and

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer all extend in said first dimension and said second dimension beyond the extent in said first dimension and said second dimension of said second pair overlap region.

2. The conditioner of claim 1 wherein said first pair first layer and said second pair first layer reside in different planes.

3. The conditioner of claim 1 wherein said first pair first layer and said second pair first layer reside in the same plane.

4. The conditioner of claim 1 further comprising a third pair of conductive non-shield layers comprising a third pair first layer and a third pair second layer;

wherein said third pair first layer and said first pair first layer reside in different planes.

5. The conditioner of claim 1 wherein said conductive shield structure further comprises conductive shield structure conductive connection material extending in a third dimension, wherein said third dimension is perpendicular to said first dimension, and wherein said conductive shield structure conductive connection material conductively connects to said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, and said conductive shield structure third conductive shield layer.

6. The conditioner of claim 5 wherein said conductive connection material includes conductive bands connecting to edges of said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, and said conductive shield structure third conductive shield layer.

7. The conditioner of claim 5 wherein said conductive shield structure conductive connection material includes conductive material extending through via holes.

8. The conditioner of claim 1 wherein said conductive shield structure first conductive shield layer has a rectangular shape in said first dimension and said second dimension.

9. The conditioner of claim 1 wherein said conductive shield structure first conductive shield layer has an annular shape in said first dimension and said second dimension.

10. The conditioner of claim 1 further comprising a dielectric material interspersed between conductive layers.

11. The conditioner of claim 1 wherein said conductive shield structure further comprises a conductive shield structure fourth conductive shield layer above all other conductive layers of said conditioner and a conductive shield structure fifth conductive shield structure below all other conductive layers of said conditioner.

12. The conditioner of claim 1 wherein said conductive shield structure consists of an odd number of conductive shield layers.

13. The conditioner of claim 1 wherein said at least one first pair first layer non-overlap region and said at least one first pair second layer non-overlap region each consist of one region.

14. The conditioner of claim 1 wherein said at least one first pair first layer non-overlap region and said at least one first pair second layer non-overlap region each consist of two discontinuous regions.

15. A circuit comprising the conditioner of claim 13 and further comprising:

a source of electrical power;

a load; and

wherein said conditioner has said first pair first layer connecting to a first path from said source to said load, and said first pair second layer connecting to a second path from said load to said source.

16. A circuit comprising the conditioner of claim 14 and further comprising:

a source of electrical power;

a load; and

wherein said conditioner has said first pair first layer connected in series with a first path from said source to said load.

17. The circuit of claim 16 wherein said conditioner has said first pair second layer connected in series with a second path from said load to said source.

18. The circuit of claim 16 wherein said at least one second pair first layer non-overlap region and said at least one second pair second layer non-overlap region each consist of two discontinuous regions.

19. The circuit of claim 16 wherein said at least one second pair first layer non-overlap region and said at least one second pair second layer non-overlap region each consist of one region.

20. The conditioner of claim 1 further comprising an additional conductive layer closely spaced to one of said first pair first layer, said first pair second layer, said second pair first layer, and said second pair second layer, and conductively coupled to the closely spaced conductive layer to form therewith a split electrode.

21. A voltage divider circuit comprising the conditioner of claim 1.

22. The conditioner of claim 1 further comprising at least five electrode terminals that are electrically isolated in said conditioner from one another.

23. The conditioner of claim 1 further comprising at least seven electrode terminals that are electrically isolated in said conditioner from one another.

24. A method of using the energy conditioner of claim 1, said method comprising applying a voltage to said first pair first layer.

25. A method of making an energy conditioner comprising:

providing a conductive shield structure comprising a conductive shield structure first conductive shield layer, a conductive shield structure second conductive shield layer, and a conductive shield structure third conductive shield layer;

wherein said conductive shield structure first conductive shield layer is above said conductive shield structure second conductive shield layer, and said conductive shield structure second conductive shield layer is above said conductive shield structure third conductive shield layer;

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, and said conductive shield structure third conductive shield layer are conductively connected to one another;

providing a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer;

providing a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer;

wherein each one of said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer, said first pair of conductive non-shield layers, and said second pair of conductive non-shield layers extends in a first dimension and a second dimension; and

wherein said first pair first layer consists of a first pair first layer overlap region and at least one first pair first layer non-overlap region;

wherein said first pair second layer consists of a first pair second layer overlap region and at least one first pair second layer non-overlap region;

wherein said first pair first layer and said first pair second layer are stacked so that said first pair first layer overlap region and said first pair second layer overlap region overlap one another, thereby defining a first pair overlap region;

wherein said second pair first layer consists of a second pair first layer overlap region and at least one second pair first layer non-overlap region;

wherein said second pair second layer consists of a second pair second layer overlap region and at least one second pair second layer non-overlap region;

wherein said second pair first layer and said second pair second layer are stacked so that said second pair first layer overlap region and said second pair second layer overlap region overlap one another, thereby defining a second pair overlap region;

wherein none of said at least one first pair first layer non-overlap region, said at least one first pair second layer non-overlap region, said at least one second pair first layer non-overlap region, and said at least one second pair second layer non-overlap region overlap one another;

wherein said conductive shield structure first conductive shield layer is above all layers of said first pair and said second pair;

wherein said conductive shield structure second conductive shield layer is between said first pair first layer and said first pair second layer, and said conductive shield structure second conductive shield layer is between said second pair first layer and said second pair second layer;

wherein said conductive shield structure third conductive shield layer is below all layers of said first pair and said second pair;

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer all extend in said first dimension and said second dimension beyond the extent in said first dimension and said second dimension of said first pair overlap region; and

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer all extend in said first dimension and said second dimension beyond the extent in said first dimension and said second dimension of said second pair overlap region.

26. A method of using an energy conditioner, said energy conditioner comprising:

providing a conductive shield structure comprising a conductive shield structure first conductive shield layer, a conductive shield structure second conductive shield layer, and a conductive shield structure third conductive shield layer;

wherein said conductive shield structure first conductive shield layer is above said conductive shield structure second conductive shield layer, and said conductive shield structure second conductive shield layer is above said conductive shield structure third conductive shield layer;

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, and said conductive shield structure third conductive shield layer are conductively connected to one another;

providing a first pair of conductive non-shield layers comprising a first pair first layer and a first pair second layer;

providing a second pair of conductive non-shield layers comprising a second pair first layer and a second pair second layer;

wherein each one of said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer, said first pair of conductive non-shield layers, and said second pair of conductive non-shield layers extends in a first dimension and a second dimension; and

wherein said first pair first layer consists of a first pair first layer overlap region and at least one first pair first layer non-overlap region;

wherein said first pair second layer consists of a first pair second layer overlap region and at least one first pair second layer non-overlap region;

wherein said first pair first layer and said first pair second layer are stacked so that said first pair first layer overlap region and said first pair second layer overlap region overlap one another, thereby defining a first pair overlap region;

wherein said second pair first layer consists of a second pair first layer overlap region and at least one second pair first layer non-overlap region;

wherein said second pair second layer consists of a second pair second layer overlap region and at least one second pair second layer non-overlap region;

wherein said second pair first layer and said second pair second layer are stacked so that said second pair first layer overlap region and said second pair second layer overlap region overlap one another, thereby defining a second pair overlap region;

wherein none of said at least one first pair first layer non-overlap region, said at least one first pair second layer non-overlap region, said at least one second pair first layer non-overlap region, and said at least one second pair second layer non-overlap region overlap one another;

wherein said conductive shield structure first conductive shield layer is above all layers of said first pair and said second pair;

wherein said conductive shield structure second conductive shield layer is between said first pair first layer and said first pair second layer, and said conductive shield structure second conductive shield layer is between said second pair first layer and said second pair second layer;

wherein said conductive shield structure third conductive shield layer is below all layers of said first pair and said second pair;

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer all extend in said first dimension and said second dimension beyond the extent in said first dimension and said second dimension of said first pair overlap region;

wherein said conductive shield structure first conductive shield layer, said conductive shield structure second conductive shield layer, said conductive shield structure third conductive shield layer all extend in said first dimension and said second dimension beyond the extent in said first dimension and said second dimension of said second pair overlap region; and

said method comprising applying a voltage to said first pair first layer.