Ceramic laminated device, communication equipment and method of manufacturing ceramic laminated device

• US 7,193,862 B2
• Filed: 05/20/2003
• Issued: 03/20/2007
• Est. Priority Date: 05/22/2002
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Maekawa, Tomoya, Taniguchi, Fumihiko, Shigemura, Hiroshi
• Primary Examiner(s): Reichard; Dean A.
• Assistant Examiner(s): CARPIO, IVAN HERNAN
• Application Number:
  US10/441,382
• Publication Number:
  US 20040055693A1
• Time in Patent Office: 1,400 Days
• Field of Search: 361/760, 333/204
• US Class Current: 361/795
• CPC Class Codes: B32B 18/00 Layered products essentially comprising ceramics, e.g. refractory products
• CPC Class Codes: C04B 2235/3206 Magnesium oxides or oxide-forming salts thereof
• CPC Class Codes: C04B 2235/3217 Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
• CPC Class Codes: C04B 2235/3224 Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
• CPC Class Codes: C04B 2235/3251 Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
• CPC Class Codes: C04B 2235/3298 Bismuth oxides, bismuthates or oxide forming salts thereof, e.g. zinc bismuthate
• CPC Class Codes: C04B 2235/3418 Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint glass constituents C04B2235/36
• CPC Class Codes: C04B 2237/62 Forming laminates or joined articles comprising holes, channels or other types of openings
• CPC Class Codes: H01P 1/20345 Multilayer filters
• CPC Class Codes: Y10T 428/24909 Free metal or mineral containing
• CPC Class Codes: Y10T 428/24926 including ceramic, glass, porcelain or quartz layer

Abstract

In recent years, ceramic laminated devices are becoming a focus of great attention as considerable contribution to the miniaturization of high frequency wireless equipment such as a cellular phone, but it is difficult for the conventional ceramic laminated device to secure reliability while maintaining favorable high frequency characteristics. The present invention provides a ceramic laminated device including a reinforcement electrode, which is formed inside a laminated body in which a plurality of ceramic layers, a plurality of inner electrodes and inter-layer via holes are stacked, not electrically connected with inner electrodes nor inter-layer via holes but mechanically connected with the ceramic layers.

Claims

1. A ceramic laminated device comprising an inner part formed inside a laminated body in which a plurality of ceramic layers and a plurality of electrode layers are stacked, wherein the device includes a top and a bottom, and further includes a first electrode layer on the top of the device and a second electrode layer on the bottom of the device, wherein said inner part comprises a reinforcement electrode having the same shape and dimensions as one of the first and second electrode layers, and wherein the reinforcement electrode is in direct contact with both the first and the second ceramic layers from the bottom of the device.

2. The ceramic laminated device according to claim 1, wherein said inner part is a single or a plurality of plane type inner parts provided substantially in parallel to said ceramic layer.

3. The ceramic laminated device according to claim 2, further comprising shield electrodes formed on the upside and/or underside of said laminated body,

wherein said plane type inner part has the same shape as that of said shield electrodes.

4. The ceramic laminated device according to claim 1, further comprising shield electrodes formed on the upside and/or underside of said laminated body,

wherein said inner part further comprises a single or a plurality of solid inner parts provided substantially perpendicular to said ceramic layers on the plane on the side of at least said shield electrodes of said ceramic layers to which said shield electrodes are pasted.

5. The ceramic laminated device according to claim 2, further comprising shield electrodes formed on the upside and/or underside of said laminated body, wherein said inner parts are (i) said plane type inner parts, and (ii) a single or a plurality of solid inner parts provided substantially perpendicular to said ceramic layers in said ceramic layers between said shield electrodes and said plane type inner parts.

6. The ceramic laminated device according to claim 5, wherein a plurality of said plane type inner parts are provided, at least some of said solid inner parts are provided in said ceramic layer between said plane type inner parts.

7. The ceramic laminated device according to any one of claims 4 to 6, wherein said solid inner part is a via hole filled with a conductive paste or dielectric paste.

8. The ceramic laminated device according to claim 1, further comprising:

side electrodes formed on a side of the laminated body; and

the inner part, being not electrically connected with said electrode layers but mechanically connected with said side electrodes.

9. The ceramic laminated device according to claim 8, wherein said side electrodes are terminal electrodes formed on end faces of said laminated body for inputting/outputting electric signals to/from the outside, and said inner part is a plane type inner part mechanically connected with a whole or part of said terminal electrodes and provided substantially in parallel to said ceramic layer.

10. The ceramic laminated device according to claim 8, further comprising an upside shield electrode formed on the upside of said laminated body, and an underside shield electrode formed on the underside of said laminated body, wherein said side electrodes are end electrodes formed on end faces of said laminated body for electrically connecting said upside shield electrode and said underside shield electrode, and said inner part is a plane type inner part mechanically connected with a whole or part of said end electrodes and provided substantially in parallel to said ceramic layer.

11. The ceramic laminated device according to claim 1 or 8, wherein a semiconductor element and/or SAW filter are mounted on the upside of said laminated body.

12. The ceramic laminated device according to claim 1 or 8, wherein said laminated body incorporates a filter.

13. The ceramic laminated device according to claim 12, wherein said filter has the function as a duplexer having a transmission filter function to transmit signals and a reception filter function to receive signals.

14. Communication equipment comprising:

communication circuits that carries out a communication using transmission and/or reception of signals; and

the ceramic laminated device according to claim 1 or 9 that carries out filtering during said communication.