Packaging technology for non-transvenous cardioverter/defibrillator devices
First Claim
Patent Images
1. A method for packaging a subcutaneous implantable cardioverter/defibrillator comprising the steps of:
- providing a housing having an inner surface and an outer surface, and a first subcutaneous electrode disposed on the outer surface;
placing a frame on the inner surface of the housing;
using the frame to hold a power source, a power storage circuit and an electronic package on a substrate within the housing;
mounting an electronic component of the electronic package in a cavity of the substrate;
applying at least one extra layer of substrate on top of the cavity once the electronic components in the cavity are mounted;
interconnecting the power source, the power storage circuit and the electronic package to the frame;
fitting a header along a portion of the outer surface of the housing, the header having a connector block embedded therein;
connecting the electronic package to a feedthrough, which is in turn connected to the connector block;
providing a septum covered hole in the header adapted to receive a lead, the lead coupled to a second subcutaneous electrode; and
tightening the lead into the septum covered hole by using a tool;
wherein a cardioversion-defibrillation energy is delivered between the first and the second subcutaneous electrodes without a transvenous, intracardiac, or epicardial electrode.
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Abstract
Packaging techniques for a non-transvenous implantable cardioverter/defibrillator include a housing and a frame within the housing for holding electronic components. A header is disposed on the housing and includes at least one feedthrough extending through the housing for providing electrical communication to and from the electronic components within the housing.
180 Citations
78 Claims
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1. A method for packaging a subcutaneous implantable cardioverter/defibrillator comprising the steps of:
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providing a housing having an inner surface and an outer surface, and a first subcutaneous electrode disposed on the outer surface; placing a frame on the inner surface of the housing; using the frame to hold a power source, a power storage circuit and an electronic package on a substrate within the housing; mounting an electronic component of the electronic package in a cavity of the substrate; applying at least one extra layer of substrate on top of the cavity once the electronic components in the cavity are mounted; interconnecting the power source, the power storage circuit and the electronic package to the frame; fitting a header along a portion of the outer surface of the housing, the header having a connector block embedded therein; connecting the electronic package to a feedthrough, which is in turn connected to the connector block; providing a septum covered hole in the header adapted to receive a lead, the lead coupled to a second subcutaneous electrode; and tightening the lead into the septum covered hole by using a tool; wherein a cardioversion-defibrillation energy is delivered between the first and the second subcutaneous electrodes without a transvenous, intracardiac, or epicardial electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 43)
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26. A non-transvenous implantable cardioverter/defibrillator comprising:
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a housing having an outer surface, at least a portion of the outer surface being electrically active; a frame within the housing for holding electronic components; a first subcutaneous electrode and a second subcutaneous electrode, the first and second subcutaneous electrodes electrically coupled to electronic components within the housing, and wherein a cardioversion-defibrillation energy is delivered between the electrically active outer surface of the housing and at least one of the first and second subcutaneous electrodes without a transvenous, intracardiac, or epicardial electrode; an electronic package disposed on a substrate electrically coupled to the frame, wherein the electronic package is a double-sided circuit having electronic components on a top surface and a bottom surface of the substrate; and a header disposed on the housing comprising at least one feedthrough extending through the housing for providing electrical communication to and from the electronic components within the housing. - View Dependent Claims (27, 28, 29, 30)
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31. A subcutaneous implantable cardioverter/defibrillator comprising:
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a housing having an inner surface and an outer surface, at least a portion of the outer surface being electrically active; a frame disposed on the inner surface of the housing; a power circuit electrically coupled to the frame; an electronic package disposed on a substrate electrically coupled to the frame and to the power circuit, wherein the substrate comprises a cavity sized to receive an electronic component of the electronic package, and at least one extra layer of substrate applied on top of the cavity; a first subcutaneous electrode and a second subcutaneous electrode, the first and second subcutaneous electrodes electrically coupled to the electronic package, and wherein a cardioversion-defibrillation energy is delivered between the electrically active outer surface of the housing and at least one of the first and second subcutaneous electrodes without a transvenous, intracardiac, or epicardial electrode, and a header fixed on a portion of the outer surface of the housing wherein the header comprises at least one feedthrough extending through the housing to allow electrical communication to and from the electronic package within the housing. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78)
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Specification