System and method for estimating reliability of components for testing and quality optimization

• US 7,194,366 B2
• Filed: 10/18/2002
• Issued: 03/20/2007
• Est. Priority Date: 10/19/2001
• Status: Expired due to Fees

• Current Assignee: Auburn University
• Original Assignee: Auburn University
• Inventors: Barnett, Thomas S., Singh, Adit D.
• Primary Examiner(s): Tsai; Carol S. W.
• Application Number:
  US10/274,439
• Publication Number:
  US 20030120457A1
• Time in Patent Office: 1,614 Days
• Field of Search: 702/35, 702 81- 84, 250/559.45, 324/158.1, 324/765, 438/10, 438/12, 438 16- 18, 700/109, 700/110, 700/121, 257/E21.525, 706/904, 706/906, 706/912, 706/914, 706/921
• US Class Current: 702/81
• CPC Class Codes: G01R 31/287 Procedures; Software aspects
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

A system and method for determining the early life reliability of an electronic component, including classifying the electronic component based on an initial determination of a number of fatal defects, and estimating a probability of latent defects present in the electronic component based on that classification with the aim of optimizing test costs and product quality.

Claims

1. A method of the post-production reliability of a repairable integrated circuit die component, said method comprising:

performing an initial post-production test on the component to identify repairable defects in the component; and

classifying the component into a classification of a plurality of reliability probability classifications based on the number of repairable defects identified by the initial test; and

estimating the reliability of the component based on the classification.

2. The method of claim 1, wherein the step of estimating the reliability of the component comprises testing a sample of components from fewer than all of a plurality of classifications.

3. The method of claim 2, wherein the step of estimating the reliability of the component comprises testing a sample of components from one of a plurality of classifications.

4. The method of claim 3, wherein said one of a plurality of classifications from which a sample is tested is a classification corresponding to a maximum number of repairable defects identified by the initial test.

5. The method of claim 1, wherein the step of estimating the reliability of the component further comprises determining the number of repairs carried out on a neighboring component.

6. The method of claim 1, wherein the step of estimating the reliability of the component comprises determining a ratio of repairable defects to latent defects in the component.

7. The method of claim 6, further comprising testing the component if an estimated reliability of the component exceeds a specified rate.

8. The method of claim 1, further comprising segregating a plurality of components into a plurality of classifications.

9. The method of claim 8, further comprising statistically predicting the reliability of components in each of said plurality of classifications by testing a sample of components from fewer than all of said plurality of classifications.

10. The method of claim 1, further comprising repairing any repairable defects in the component that are identified by the initial test.

11. The method of claim 1, wherein the component comprises a redundant memory array and the step of classifying the component is based on the number of repairable defects in the redundant memory array identified by the initial test.

12. The method of claim 1, further comprising optimizing subsequent testing of the component based on said classification of the component.

17. The method of claim 1, wherein the step of performing an initial test on the component comprising obtaining a count of the number of repairable defect.

18. The method of claim 17, further comprising comparing the count of repairable defects to a threshold number of repairable defects.

13. A method for predicting the post-production reliability of an integrated circuit die component, said method comprising:

performing an initial post-production test to identify a number of killer defects;

classifying a component into one of a plurality of reliability probability classifications based on the number of killer defects identified by the initial test; and

optimizing further testing of the component to identify the presence of latent defects, based on the classification thereof.

14. The method of claim 13, wherein the step of optimizing further testing comprises subjecting the component to further testing of a duration dependent on the classification thereof.

15. The method of claim 13, wherein the step of optimizing further testing comprises subjecting fewer than all of said plurality of classifications to further testing.

16. The method of claim 13, further comprising predicting the reliability of the component based on the initial test and a statistical defect-clustering model.

19. The method of claim 13, wherein the step of performing an initial test comprises obtaining a count of the number of killer defects.

20. The method claim 19, further comprising comparing the count of killer defects to a threshold number of killer defects.